Abstract: The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film (1) according to the invention comprises a support (11), resin layer (12) and protective film (13), where the resin layer (12) is composed of a photosensitive resin composition comprising a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a benzotriazole derivative represented by the following general formula (1).

Abstract: An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Abstract: SU-8 photoresist compositions are modified to improve their adhesion properties by adding 1% to 6% of an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercaptopropyltrimethoxysilane, and aminopropyltrimethoxysilane. SU-8 photoresist compositions are modified to improve their resistance to cracking and film stress by adding 0.5% to 3% of a plasticizer selected from the group consisting of dialkylphthalates, dialkylmalonates, dialkylsebacates, dialkyladipates, and diglycidyl hexahydrophthalates. The improvements can be obtained simultaneously by adding both the adhesion promoter and the plasticizer to SU-8 photoresist compositions.

Abstract: A polymer composite comprises a base material, and a polymer membrane provided on at least a part of the base material, the polymer membrane having at least hydrophilicity, and the polymer composite is used in a state exposed to water or a water-based solvent. The polymer membrane is a resin film formed by photo-crosslinking a photosensitive resin composition consisting essentially of a water-soluble polymer, and during crosslinking of the photosensitive resin composition, some of photosensitive groups of the photosensitive resin composition are bound to amino groups fixed to the surface of the base material, whereby the resin film is fixed to the base material.

Abstract: The present invention provides a planographic printing element suitable to receive and bond with a subsequently applied hydrophilic layer comprises a substrate layer, such as polyester film or paper, having coated thereon an adhesion layer, said adhesion layer comprising a polymer having a glass transition temperature of less than 15C and containing functional groups such as hydroxyl, epoxy or glycidyl groups capable of reacting with the hydrophilic layer. The polymer may be a terpolymer of a hydroxyalkyl methacrylate, an alkyl acrylate and an aminoalkyl methacrylate. The polymer may be mixed with gelatin and the mixture applied to the substrate as a coating. The hydrophilic layer, which may comprise metal oxide particles, such as aluminium oxide and/or titanium dioxide particles in a sodium silicate binder, is subsequently applied as a coating to the adhesion layer.

Abstract: A heat-sensitive composition can be used to make a heat-sensitive imaging material. The composition includes a water-soluble or water-dispersible binder and dispersed therein, a photothermal conversion material, and hybrid particles of a combustible nitro-resin and an addition polymer derived from one or more ethylenically unsaturated polymerizable monomers. The hybrid particles preferably have a core-shell structure with the combustible nitro-resin comprising the core and the addition polymer providing the shell. These imaging materials are particularly useful as “direct-write” thermally imageable elements useful to provide lithographic printing plates without ablation or the need for alkaline development.

Abstract: A heat-sensitive composition can be used to make a heat-sensitive imaging material. The composition includes a water-soluble or water-dispersible binder and dispersed therein, a photothermal conversion material, and hybrid particles of a combustible nitro-resin and an addition polymer derived from one or more ethylenically unsaturated polymerizable monomers. The hybrid particles preferably have a core-shell structure with the combustible nitro-resin comprising the core and the addition polymer providing the shell. These imaging materials are particularly useful as “direct-write” thermally imageable elements useful to provide lithographic printing plates without ablation or the need for alkaline development.

Abstract: An object of the present invention is to provide a photosensitive resin composition or a photosensitive resist for color filters which is superior in heat resistance, water resistance, solvent resistance, chemical resistance, and also transparency, and a method for producing color filters using them. The present invention relates to a photosensitive resin composition comprising a vinyl polymer (A) having at least one cyclocarbonate group and at least one carboxyl group in the molecule and a compound (B) having at least two ethylenically unsaturated double bonds in the molecule as a main component, which can introduce crosslinked structures by photocuring and thermosetting, a photosensitive resist for color filters comprising the photosensitive resin composition and a colorant, and a method for producing a color filter, using the photosensitive resist for color filters.

Abstract: A radiation curable resin formulation suitable for planarizing an ink jet heater chip. The resin formulation includes a multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium salt photoinitiator, and a non-photoreactive solvent. The resin formulation is substantially devoid of acrylate polymer components. Radiation curable resins according to the invention exhibit enhanced adhesion with the nozzle plate adhesive thereby reducing the incidence of delamination between the nozzle plate and a semiconductor chip containing the resin layer. Another advantage is that the resin layer, according to the invention, reduces pigment flocculation on the surface of the resin layer when using pigment-based ink jet inks.

Abstract: Negative-working, water-developable imageable elements, useful as printing plate precursors, and methods for their use, are disclosed. The elements can be imaged with ultraviolet radiation, with infrared radiation, or with heat. The elements contain an imageable composition that contains a latent Brönsted acid, a water-soluble or water-dispersible binder, and an acid-activated cross-linking agent.

Abstract: SU-8 photoresist compositions are modified to improve their adhesion properties by adding 1% to 6% of an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercatopropyltrimethoxysilane, and aminopropyltrimethoxysilane. SU-8 photoresist compositions are modified to improve their resistance to cracking and film stress by adding 0.5% to 3% of a plasticizer selected from the group consisting of dialkylphthalates, dialkylmalonates, dialkylsebacates, dialkyladipates, and diglycidyl hexahydrophthalates. The improvements can be obtained simultaneously by adding both the adhesion promoter and the plasticizer to SU-8 photoresist compositions.

Abstract: A negative photoresist for transferring a photomask to a semiconductor wafer includes a passivated component that is activated by an exposure radiation, the activated component being configured to interact with the uppermost layer of the semiconductor wafer at the interface, the interaction ensuring increased adhesion between the negative photoresist and the substrate. Alternatively, a positive photoresist for transferring a photomask to a semiconductor wafer includes a component that is passivated by an exposure radiation, the activated component being configured to interact with the uppermost layer of the semiconductor wafer at the interface, the interaction ensuring increased adhesion between the positive photoresist and the substrate.

Abstract: An imaging member is composed of a hydrophilic imaging layer having a hydrophilic heat-sensitive polymer containing heat-activatable thiosulfate groups, and optionally a photothermal conversion material. Upon application of energy that generates heat, such as from IR irradiation, the polymer is crosslinked and rendered more hydrophobic. The imaging layer is disposed on an interlayer on a support, which interlayer comprises a Group IVB element (such as titanium, hafnium or zirconium) compound for improved mechanical and imaging properties. The exposed imaging member can be contacted with a lithographic printing ink and used for printing with or without post-imaging wet processing. This imaging member is particularly useful for direct write imaging using IR lasers or thermal printing heads.

Abstract: A resist composition comprising: a curable composition mainly comprising (1) at least one of an alkali-soluble acrylic compound and an alkali-soluble methacrylic compound; (2) a fine-particulate crosslinked elastic polymer having a carboxyl group; and (3) an agent for enhancing adhesion with respect to copper.

Abstract: A self-contained photohardenable imaging assembly comprising a first transparent polymeric film support, an imaging layer comprising a plurality of photosensitive microcapsules, a developer material and an adhesion promoter, and a second support which may be transparent or opaque is disclosed. Upon image-wise exposure and image development, an image forms in the imaging layer sealed between the supports to form an integral unit having improved peel strength.

Abstract: A photographic element comprising a film support base, an adhesion promoting layer, a subbing layer and at least one light-sensitive silver halide emulsion layer, wherein the adhesion promoting layer is close to the support and contains a silane compound and a polyurethane, and the subbing layer, selected within the group consisting of a hydrophilic colloidal layer or a layer comprising a continuous gelled network of inorganic particles, is positioned between the adhesion promoting layer and the emulsion layer.

Abstract: A semiconductor processing method of promoting adhesion of photoresist to an outer substrate layer predominately comprising silicon nitride includes, a) providing a substrate; b) providing an outer layer of Si3N4 outwardly of the substrate, the outer Si3N4 layer having an outer surface; c) covering the outer Si3N4 surface with a discrete photoresist adhesion layer; and d) depositing a layer of photoresist over the outer Si3N4 surface having the intermediate discrete adhesion layer thereover, the photoresist adhering to the Si3N4 layer with a greater degree of adhesion than would otherwise occur if the intermediate discrete adhesion layer were not present.

Abstract: There is disclosed a silver halide photographic light-sensitive material which comprises a polyester film support, at least one subbing layer containing a self-emulsifiable isocyanate compound having an ethylene oxide recurring unit and two or more isocyanate groups on the support, and at least one silver halide emulsion layer provided on said subbing layer.

Abstract: A silver halide light-sensitive material comprises a support, a hardening layer and a light-sensitive layer in order. The light-sensitive layer contains silver halide and a hydrophilic polymer. The hardening layer or the light-sensitive layer contains a reducing agent. The hardening layer contains a mixture of a polymer (A) and a polymer (B). The mixture contains the polymer (A) in an amount of 5 to 70 wt. % and the polymer (B) in an amount of 30 to 95 wt. %. The polymer (A) comprises repeating units of (A1) in an amount of not less than 95 mol %. The polymer (B) comprises repeating units of (B1) in an amount of 10 to 90 mol % and repeating units of (B2) in an amount of 10 to 90 mol %.

Abstract: A silver halide light-sensitive material comprises a support, a hardening layer and a light-sensitive layer in order. The light-sensitive layer contains silver halide and a hydrophilic polymer. The hardening layer or the light-sensitive layer contains a reducing agent. The hardening layer contains a mixture of a polymer (A) and a polymer (B). The mixture contains the polymer (A) in an amount of 5 to 70 wt. % and the polymer (B) in an amount of 30 to 95 wt. %. The polymer (A) comprises repeating units of (A1) in an amount of not less than 95 mol %. The polymer (B) comprises repeating units of (B1) in an amount of 10 to 90 mol % and repeating units of (B2) in an amount of 10 to 90 mol %.

Abstract: A photosensitive photoresist material which is effective for use as an ion etch barrier layer after patterning. The photoresist composition includes the reaction product of a compound having the general formula R.sub.1 --COO--(CH.sub.2).sub.n --O--R.sub.2 and a silylating agent.

Abstract: A support for an imaging element is described, which support comprises a polyester polymeric film having coated thereon a subbing layer comprising gelatin and a multi-hydric organic compound having at least three hydroxyl groups, which gelatin subbing layer coated support has been subjected to a heat treatment to reduce the core-set curling tendency of the polymeric film. Imaging elements for use in an image-forming process is also described, which elements comprise a gelatin subbing layer coated polyester polymeric film support as described above, and an image-forming layer coated on the subbed support. A method for forming a heat-tempered, gelatin-subbed support for an imaging element is also described, comprising coating a subbing layer comprising gelatin and a multi-hydric organic compound having at least three hydroxyl groups on a polyester polymeric film, and subjected the coated film to heat treatment to reduce the core-set curling tendency of the polymeric film.

Abstract: A method for forming a hydrophobic material layer upon a hydrophilic material layer over a substrate. There is first provided a substrate. There is then formed over the substrate a hydrated hydrophilic material layer. There is then treated the hydrated hydrophilic material layer with a glycol ether acetate material in the absence of an organofunctional silane material to form a glycol ether derivatized hydrophilic material layer having a glycol ether moiety covalently bonded thereto through condensation of the hydrated hydrophilic material layer with the glycol ether acetate material. Finally, there is then formed upon the glycol ether derivatized hydrophilic material layer a hydrophobic material layer. The method is particularly useful in enhancing adhesion onto hydrated hydrophilic material layers of positive photoresist material layers whose solubility in a developer results from a photogenerated acid material.

Abstract: A photosensitive element comprising a temporary support having thereon an aqueous resin layer which contains at least one kind of fine particles having an average particle size or agglomerated particle size of 1 to 10 .mu.m. The fine particles impart a roughened surface to the aqueous resin layer. Furthermore, a photosensitive insulating resin layer is provided on the aqueous resin layer. Also disclosed is an insulating resin image having a roughened surface which is prepared by a process comprising the steps of providing the above-described photosensitive element, laminating the photosensitive element on an insulating substrate, and pattern exposing and developing the photosensitive insulating resin layer.

Abstract: The present invention comprises a polyester film support in which the surface has been subjected to an energetic treatment with nitrogen plasma to produce amine groups on the polyester surface. The treated surface is then coated with a dilute solution of amine reactive hardener and gelatin. After drying the hardener/gelatin coated support a photographic emulsion is coated on the surface. The resulting film element has excellent adhesion of the photographic emulsion after photoprocessing, and it is safer to coat and handle than previously known methods involving grafting of hardener directly to the support.

Abstract: A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.

Abstract: A photoimageable composition contains from 0.5 to 5 wt. percent of a compound of the formula: ##STR1## wherein R=alkyl, aryl, aralkyl, alkenyl, alkynyl, and substituted forms thereofX=OR', SR', NR'.sub.2, R'R'=H, R, CO--R,G=nothing or C.sub.1 -C.sub.8 alipathic hydrocarbon, andY=COOH, PO.sub.3 H, SO.sub.3 H, SO.sub.2 H and SOH. X'=R'to promote adhesion of the photoimageable composition to metal.

Abstract: A positive photoresist adhesion promoter which is provided as a thin layer between a resist such as polymethylmethacrylate for use on gallium arsenide is described. The positive photoresist adhesion promoter includes a mixture of a positive photoresist with an organic solvent. The use of the positive adhesion promoter increases the resistance of the resist such as PMMA to chemical stress during subsequent processing steps for the circuit. An alternative arrangement is to use a composition of the photoresist to be deposited as the masking layer as adhesion promoter layer and processing the adhesion promoter layer to induce cross linking in the resin component of the photoresist material to thus provide a tenacious bond between the adhesion promoter layer and the material of the substrate, such as gallium arsenide.

Abstract: The present invention relates to a photopolymerizable resin composition developable with an aqueous weak alkaine solution and suitable for a printed circuit board.The photopolymerizable resin composition of the present invention is mainly composed of:(a) a linear acrylic copolymer,(b) an ethylenically unsaturated compound, and(c) a photopolymerization initiator,wherein said linear acrylic copolymer comprises as indispensable comonomers:i) at least one compound represented by the general formula: ##STR1## wherein X is a hydrogen atom or a methyl group, Y is an oxygen atom or an imino group and Z is an alkylene group having 1 to 5 carbon atoms, andii) an ethylenically unsaturated compound having a carboxyl group.the photopolymerizable resin composition of the present invention can afford a resist film having excellent flexibility and adhesion through the use of the above-described particular linear acrylic copolymer.

Abstract: A process for promoting photoresist adhesion on a semiconductor wafer having a previously applied photoresist layer. The process is adapted for semiconductor manufacture in which a first photoresist layer has been applied to the wafer and in which a second photoresist layer must be adhered to the first photoresist layer and to the substrate of the wafer. The process includes a steps of: baking the first photoresist layer, applying a liquid mixture including solvents to soften the first photoresist layer and an adhesion promotor for the substrate, spin drying the wafer, and applying a second photoresist layer. In an illustrative embodiment of the invention, the liquid mixture includes acetone, n-butyl acetate (NBA), and hexamethyldisilazane (HMDS) combined in a ratio of 1:1:1.

Abstract: The surface of metallic features are coated with a desensitizer composition comprising an amino-silane to reduce the likelihood of chemical interaction between the metallic feature and a photosensitive functional group that is included in a dielectric composition that is coated over the metallic features. The chemical interaction adversely affects the photosensitivity of the dielectric composition and, thus, inhibits the formation of complete and well defined via interconnections through the dielectric composition.

Abstract: A recording sheet which comprises a substrate having a large of a metal on the surface thereof, and a layer of microcapsules, said layer of microcapsules including a coupling agent to improve the adhesion of said microcapsule layer to said metal layer; the coupling agent is preferably a silane.

Abstract: Multilayer, photosensitive recording materials which can be developed with aqueous media contain one or more layers of a mixture which is crosslinkable by photopolymerization, soluble or dispersible in aqueous media and based on polymer containing hydroxyl and/or amide groups, as binders, compatible photopolymerizable monomers and photopolymerization initiators, which mixture contains from 0.1 to 10% by weight, based on its total amount, of an aldehyde of the general formula I ##STR1## where R is hydrogen, hydroxyl, C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, C.sub.6 -C.sub.10 -aryl or C.sub.6 -C.sub.10 -aryloxy.

Abstract: A photoimageable composition of the negative acting type which includes a binder polymer which contains carboxyl groups is provided with a metal chelate in which the coordination number of the metal is 2 or higher. When the photoimageable composition is coated as a layer on a dry film, the metal chelate reacts with the carboxyl groups of the polymer, releasing a metal ion which bridges carboxyl groups of two or more polymer molecules. This bridging reduces cold flow of the photoimageable composition layer of the dry film.

Abstract: Disclosed are a light sensitive material and a lithographic printing plate made therefrom by silver complex diffusion transfer process ree from peeling of layer during printing which comprises a polyester film support made hydrophilic by coating with an organic copolymer as a support and at least one undercoat layer, a silver halide emulsion layer and an image receiving layer containing physical development nuclei layer provided on said support in succession, said undercoat layer contiguous to the support containing a polyfunctional epoxy compound having at least three epoxy groups in molecule.

Abstract: A photosensitive lithographic plate is suitable for use in making a water-less lithographic plate which does not require dampening water. The photosensitive lithographic plate has a primer layer containing a hardened gelatin, a photosensitive layer and a silicone rubber layer. The silicone rubber layer and the photosensitive layer are imagewise removed as a result of the imagewise exposure and development so as to expose portions of the primer layer corresponding to an image. The exposed gelatin-containing plate is securely adhered to the substrate and is easily dyeable for examination of the formed image.

Abstract: An electron beam recording film comprising a support bearing, in order,(A) a sputtered layer of indium-ion oxide, and(B) a gelatino silver halide emulsion layer, e.g., silver iodobromide, crosslinked with 2 to 10% by weight based on the weight of gelatin in the emulsion layer of a Cr.sup.+3 -containing compound, e.g., chrome alum, chromic choloride, etc.Optionally other layers can be present in the film, e.g., crosslinked gelatin overcoat, subbing layer on support, titanium oxide layer on the indium-tin oxide layer.

Abstract: A photocurable composition comprising (a) 100 parts by weight of a resin having structural units derived from at least one alpha, beta-unsaturated ethylenically unsaturated monomer, (b) 10 to 300 parts by weight of a photopolymerizable monomer, (c) 0.1 to 20 parts by weight of a photopolymerization initiator, and (d) 0.01 to 1 part by weight of a compound represented by the following general formula (I) or general formula (II) ##STR1## wherein R.sup.1 represents a divalent aromatic hydrocarbon group having bonds at the ortho-position to each other; R.sup.2 represents hydrogen, an alkyl group having 1 to 4 carbon atoms, a phenyl group or an aryl group having a C.sub.1 -C.sub.4 alkyl; R.sup.3 and R.sup.4 each represent an alkyl group having 1 to 10 carbon atoms, an aryl group or an aralkyl group; X.sup.1 represents oxygen, sulfur or N--R.sup.5 ; X.sup.2 represents oxygen, sulfur or NH; X.sup.3 represents nitrogen or CR.sup.6 ; X.sup.4 represents oxygen, sulfur or NR.sup.6 ; X.sup.5 represents nitrogen or CR.

Abstract: The composition of this invention comprises:(a) a thermoplastic organic polymer,(b) a non-gaseous ethylenically unsaturated compound containing at least two terminal ethylenic groups capable of forming a polymer by photoinitiated addition polymerization,(c) an addition polymerization initiator activatable by actinic radiation, and(d) a benzotriazole carboxylic acid.

Abstract: A process for improving adhesion between photographic layers of a photographic element comprising a support having provided thereon at least(1) a first photographic layer comprising a high molecular weight compound having a functional group capable of reacting with an isocyanate group and(2) a second photographic layer comprising a high molecular weight compound having a functional group capable of reacting with an isocyanate group which compound is different from the high molecular weight compound of said first layer,which process comprises coating from 2 to 20 ml/m.sup.2 of a solution containing a polyisocyanate compound having at least two isocyanate groups on the first photographic layer, drying said solution, and then coating the second photographic layer.

Abstract: Lamination of a photopolymerizable film onto a substrate employs an intermediate nonphotosensitive liquid which is substantially all monomer.

Abstract: There is described a photomechanical method for forming pressure sensitive transfer reproductions of color images, either single color or multicolor, upon a substrate involving the forming of a base coat protective layer on a substrate, applying one color ink layer on the base layer and a white ink overlayer on the one color ink layer. The surface of the white ink overlayer is powdered and a layer of photoresist composition is applied. The photoresist covered layered substrate is exposed to a light source through an image carrying photographic negative film to harden the photoresist at the imaged areas thereby forming a mask. Nonhardened photoresist composition areas along with their underlaying layers are removed using stepwise solvent development steps. The steps are repeated where different ink colors are to be applied to form a multicolored image.

Abstract: A photopolymerizable resin composition is described which comprises, (a) 40 to 85 wt. %, based on the composition, of a thermoplastic polymer binder, (b) 15 to 60 wt. %, based on the composition, of a cross-linkable monomer having at least one ethylenically unsaturation, (c) 0.5 to 10 wt. %, based on the total of the binder (a) and the monomer (b), of a photopolymerization initiator, and (d) 0.005 to 1 wt. %, based on the total of the binder (a) and the monomer (b), of a tetrazole compound of the formula: ##STR1## wherein R.sub.1 is H, halogen, methyl, ethyl, phenyl, carboxyl, amino, dimethylamino, diethylamino, methoxy, ethoxy, mercapto or sulfonic acid; and R.sub.2 is H, methyl, ethyl, phenyl, amino or mercapto. The photopolymerization resin composition exhibits an enhanced adhesion to a metal surface, and is useful as a photoresist for fabrication of a printed circuit board.

Abstract: The invention is directed to a process for preparation of a negative resist configuration on a siliceous substrate.A negative resist polymer is bonded to the siliceous substrate using an intermediary interlayer of silane between the substrate and the resist polymer. The silane is applied to the siliceous substrate and the silane-coated surface is heated to accomplish bonding; the resist polymer is then applied as an overlay on the silane-coated surface and the resist polymer surface is irradiated to form an image therein and simultaneously to bond the resist polymer image to the silane-coated surface.

Abstract: Disclosed is a photosensitive material which comprises a support and at least an undercoating layer and a silver halide emulsion layer, said undercoating layer containing a matting agent having an average particle size larger than the thickness of the undercoating layer. Use of this photosensitive material for diffusion transfer process causes neither slipping between the photosensitive material and the image receptive layer nor pinholes in silver images.

Abstract: Photographic assemblages and processes are described wherein a stripping layer is employed to enable an image-receiving layer to be separated from the rest of the assemblage after processing. Each side of the stripping layer has a hydrophilic layer immediately adjacent thereto, only one of which contains particulate material substantially insensitive to light and in a volume percentage of about 5 to about 75 percent of the hydrophilic material-particulate material mixture, so that upon separation, substantially all of the stripping layer will remain with the portion of the assemblage having the hydrophilic layer containing the particulate material.Transparencies or prints which are less bulky can thereby be obtained from integral assemblages.

Abstract: Improved release properties are obtained between a cover sheet and a supported negative acting radiation sensitive photopolymerizable composition by introduction into the composition a compound of the formula A--B, whereinA is substituted or unsubstituted alkyl or alkenyl of 6 to 24 carbon atoms, andB is a 5 or 6 atom aromatic or nonaromatic heterocyclic radical containing 2 or 3 heteroatoms taken from N, O, S or combination thereof, said radical optionally containing a six carbon fused aromatic ring,an alkali metal salt of a .beta. amino carboxylic acid or a bis alkali metal salt of a .beta., .beta.' amino dicarboxylic acid, wherein said release compound or mixture is present in said negative acting photopolymerizable composition in an effective amount sufficient to lower peel force to a value not greater than 75 grams.

Abstract: Silver halide photographic elements comprising a support on which there is spread a plurality of photosensitive layers of gelatin incorporating silver halides and containing coupling agents, and further being associatd with auxiliary gelatin layers tend to suffer from brittleness. An improved element comprises, spread over said support and under said plurality of photosensitive layers, a layer of gelatin in which there is dispersed a fragility reducing quantity of droplets of a water-immiscible high boiling organic solvent, and an adhesion promoting quantity of a vinyl addition polymer latex.

Abstract: The adherence of a hydrophilic layer containing a hydrophilic colloid binder upon the surface of a vinyl chloride polymer free of hydrophilic recurring units is improved by exposing the polymer surface to a corona discharge sufficient to satisfy a particular wetting test described in the specification, and colloidal silica is dispersed within the hydrophilic layer in a weight ratio range relative to the binder of 1:5-2:1.

Abstract: An improved process is provided for attaching layers of hydrophilic, photosensitive materials onto hydrophobic plastic substrates, which comprises forming a layer of a polycrystalline, optically transparent, moisture barrier material on the substrate, followed by depositing thereon a layer of a hydrophilic, polar material, prior to depositing the photosensitive layer thereon. The process is especially suitable for the fabrication of pre-holographic elements and holograms. Holograms are fabricated by exposing and developing latent images in the photosensitive layer of pre-holographic elements and attaching to the photosensitive layer by an optical adhesive a protective cover layer comprising a plastic substrate coated with the moisture barrier material and the hydrophilic material. Additional moisture barrier protection may optionally be provided by forming a combination of moisture barrier layers and hydrophilic layers on the outer surfaces of the plastic substrates.