Abstract: A plurality of substantially identical, thermally and/or atmospherically isolated modules can be employed to effect a treatment process. Each module can include a thermal system and/or atmospheric control system to effect a step of a treatment process, such as a heat treatment process for metal articles, particularly heat treatment and/or welding of parts made from so-called “super allows.” The module control systems can communicate and/or cooperate to carry out a process.

Abstract: An erasing apparatus includes a conveyance path configured to convey a sheet on which an image is formed with a coloring agent which is erased by heating. A first erasing unit is disposed on the conveyance path and is configured to heat the sheet when the sheet is conveyed between a first heating component and a first press component. A second erasing unit is disposed on the conveyance path downstream from the first erasing unit and is configured to heat the sheet when the sheet is conveyed between a second heating component and a second press component. A control section is configured to control a temperature of the first heating component at a first temperature at which the image on the sheet can be erased and to control a temperature of the second heating component at a second temperature lower than the first temperature.

Abstract: A label manufacturing apparatus includes a thermal head and a device for transporting a heat sensitive adhesive sheet. The control device operates the head in synchronization with timing of transporting of the sheet to activate the adhesive, determines if heating based on a last row of a heating pattern is completed before a trailing end of the sheet reaches a set position contacting the head, controls driving of the transporting device so that when it is determined that the heating based on the heating pattern last row is completed, the sheet is transported until the trailing end passes through the set position, and controls driving of the head so that when it is determined that the heating based on the last row of the heating pattern is completed, the heating based on the last row of the heating pattern is repeated until the trailing end passes through the set position.

Abstract: A label manufacturing apparatus has a thermal head with heating elements for heating at least a part of a heat sensitive adhesive sheet to place it into an adhesive state when the heat sensitive sheet is transported through a preselected position of the label manufacturing apparatus in which the heat sensitive sheet contacts the heating elements of the thermal head. A control device selectively operates the heating elements of the thermal head in synchronization with timing of transporting of the heat sensitive adhesive sheet through the preselected position to thereby heat the part of the heat sensitive adhesive sheet and place into the adhesive state, and stops operation of the heating elements so that a trailing end portion of the heat sensitive sheet is not heated and is not placed into an adhesive state when the trailing end portion reaches the preselected position.

Abstract: According to one embodiment, first and second branch paths of a decoloring apparatus are formed downstream in a sheet conveying direction of a reading section in a conveying path. A diverting section is provided at a branch point of the first and second branch paths in the conveying path. A control section determines on the basis of image data whether decoloring processing should be applied to a sheet, diverts, if determining that the decoloring processing should be applied to the sheet, the sheet to the first branch path with the diverting section, and diverts, if determining that the decoloring processing should not be applied to the sheet, the sheet to the second branch path with the diverting section. A decoloring section is provided between the reading section and the branch point in the conveying path and heats the sheet to decolor an image formed with a decolorable color material.

Abstract: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising a first chamber containing the vapor phase and, inside the first chamber within the vapor phase, a second chamber in which a vacuum can be generated and into which the item to be soldered can be introduced. A third chamber communicates with the first chamber to allow the item to be soldered to be transferred into the first chamber by means of a transporting system. The process and device according to the invention are advantageous in that they ensure soldered joints having a higher quality than those of the prior art.

Abstract: In order to prevent occurrence of an unintentional non-heated part at a trailing end portion in a transporting direction of a heat sensitive adhesive sheet, in accordance with a matrix-like heating pattern of M0 columns×N0 rows, a thermal head and transporting means are driven, and a plurality of heating elements of the thermal head are selectively operated in synchronization with timing of transporting a heat sensitive adhesive sheet (2) by the transporting means. Thus, when at least a part of the heat sensitive adhesive sheet (2) is heated to develop adhesive properties, if heating based on a last row (N0th row) in the heating pattern is completed before a trailing end portion (2b) in the transporting direction of the heat sensitive adhesive sheet (2) reaches a position contacting with the heating element of the thermal head, the heat sensitive adhesive sheet (2) is transported until the trailing end portion (2b) passes through the position contacting with the heating element of the thermal head.

Abstract: A thermal processing apparatus and method with predictive temperature correction. Distances are measured from a backside of the wafer relative to a reference plane. Heat is transferred to the backside of the substrate in relation to the measured distances. This allows a baking unit to uniformly heat the substrate to compensate for irregularities or warpage.

Abstract: The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.

Abstract: A calcination furnace capable of variably setting calcination conditions such as a size of a calcination chamber, a temperature, a temperature distribution and flowing of gas in the calcination chamber; and the like depending on calcined intermediate products. A furnace body in which a furnace chamber is defined includes two movable sections, which are moved in predetermined directions, to thereby vary an internal volume of the furnace chamber as desired.

Abstract: A calcination furnace capable of variably setting calcination conditions such as a size of a calcination chamber, a temperature, a temperature distribution and flowing of gas in the calcination chamber; and the like depending on calcined intermediate products. A furnace body in which a furnace chamber is defined includes two movable sections, which are moved in predetermined directions, to thereby vary an internal volume of the furnace chamber as desired.

Abstract: For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.

Abstract: A system is disclosed for curing epoxy in a fiber optic connector. An oven has a receptacle for receiving the connector with an exposed length of an optical fiber projecting therefrom. A heat conductive sheath is positionable on the connector about the optical fiber for distributing heat from the oven and for protecting the fiber when the connector is inserted into the receptacle. Sensing elements are located in the path of insertion movement of the fiber optic connector and conductive sheath to be actuated thereby in response to the connector being inserted into the receptacle. A micro-controller is coupled between the sensing elements and audible/visual signals. The micro-controller includes a timer to actuate the audible/visual signals after a predetermined period of time within which the heater is energized.

Abstract: The present invention is directed to a heat treatment apparatus for performing heat treatment of a substrate. According to the present invention, a thermocouple is introduced into a heating furnace and discharged from the heating furnace by carrier means in such a state that one side ends of the wires forming thermocouple are connected to the substrate and another ends of the wires forming the thermocouple are connected to fixed terminals of a terminal mount. Movable terminals of a terminal driving mechanism are brought into contact with the fixed terminals of the terminal mount, to outwardly extract output signals of the thermocouple. Thus, temperatures of the temperature measuring substrate can be accurately measured while securing air-tightness in the heating furnace. Further, entanglement of metal wires forming the thermocouple is prevented in introduction/discharging of the substrate.

Abstract: A method for distinguishing invasive from noninvasive E. coli comprises collecting an undifferentiated bacterial sample from a host, contacting bacteria contained in the sample to a growth medium which contains a dye selectively taken up by invasive E. coli, incubating the growth medium to grow colonies of E. coli, and examining the growth medium to detect E. coli colonies which have taken up the dye. A two-step incubation procedure provides superior results. While the invention can be practiced with E. coli obtained from any host, specific procedures for practicing the invention in poultry are provided.

Abstract: A pre-expander for polymer beads is disclosed which includes a pre-expansion chamber having an agitator therein. The agitator is driven by an electric motor. The power requirements of the motor are monitored to determine the resistance which the beads are offering to motion of the agitator. The resistance to motion increases as the beads expand. Pre-expansion is stopped when the resistance offered by the beads results in a predetermined power requirement.

Abstract: To permit installation of various sizes of deburring chambers, matched to particular sizes, or combination of sizes of workpieces, so that only the minimum size chamber for the particular quantity or size of workpiece need be used, the chambers are provided in sets with adapters so that a single machine frame can be utilized, the adapters and chambers being fitted within the machine frame so that the lower edge (13a, 13'a) of any one of the chambers is within the closing or sealing stroke of a closing plate (14) carrying the workpieces. A coding system, for example coding bolts (16) is secured to each one of the chambers, to be scanned by a reading head (17) and transmitting information relative to the appropriate fill quantity and pressure of gases for the particular chamber then being installed in the machine.