Abstract: The method of the invention includes forming a plate and deforming, by ultrasonic forging, a plate side located between the conical surfaces (34, 35) of strikers (2, 3) for the purpose of forming a wedge-shaped edge on the plate (1). The strikers are rotated around their longitudinal axes (L1, L2). The device of the invention is provided with a drive for rotating the strikers (2, 3). On the working surface of the striker (2, 3) a recess is made, the generatrix of which corresponds to the form of the wedge-shaped edge surface. The invention enables to shorten the time of treatment and improve the quality of the cutting edge surface.

Abstract: A finisher arrangement for surface finishing of parts, including a bowl-type centrifugal finishing device for agitating a mixture of parts and treating media within the bowl, and a handler for loading and unloading the parts/media to and from the bowl, respectively. The finishing device and handler are positioned sidewardly adjacent but on opposite sides of a rotary drive unit which defines a transfer horizontal drive axis. Arm linkages couple each of the finishing device and handler to the drive unit so that each is independently vertically swingable about the drive axis into respective loading and unloading positions.

Abstract: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

Abstract: A processing apparatus includes a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported by the four processing unit supporting mechanisms, the four processing units respectively corresponding to four of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.

Abstract: A workpiece feeder is capable of feeding a roller to a roller end face processing machine in a stable posture, a roller end face processing machine, and a roller for a rolling bearing processed by such a roller end face processing machine are provided. The workpiece feeder for roller end face processing includes: a carrier ring having a plurality of recesses arranged in a radially-inner surface thereof at a predetermined pitch along a circumferential direction; a regulating wheel fitted into the carrier ring to form roller fitting cavities between a radially-outer surface of the regulating wheel and the plurality of recesses; a carrier support for supporting the carrier ring on a radially-outer side with respect to the plurality of recesses; and rotational force applying means for applying a rotational force to the carrier ring on the radially-outer side with respect to the plurality of recesses.

Abstract: A method and a device for machining the leading edge of a turbine engine blade by a machining center for which parameters are set is disclosed. The method includes: acquiring a 3D profile of the leading edge of the blade; calculating at least one characteristic of the leading edge from the 3D profile; comparing the value of the calculated characteristic with a known theoretical value of the characteristic to obtain an elementary difference for the characteristic; calculating at least one undulation of the leading edge between at least two consecutive elementary sections from the 3D profile; optimizing the elementary differences obtained as a function of the undulation; setting the parameters of the machining center as a function of the optimized elementary differences for the elementary sections to define machining passes over the leading edge; and machining the leading edge of the blade with the machining center with parameters set.

Abstract: An apparatus for lapping a portion of an exterior surface of a housing is described. The apparatus includes at least a lapping tool arranged to execute a lapping operation. The lapping tool takes the form of a lapping pad which includes a conduit through which slurry can be transported for local deposition on the housing during a lapping operation. The apparatus also includes a stage on which a workpiece in the form of a housing is mounted. During the lapping operation, slurry is passed through the slurry conduit in the lapping tool, the lapping tool and the housing are moved in various motions. In this way, a gradual transition region is created between an accessory region and the remainder of the housing.

Abstract: The invention relates to a method for the operation of a gear or profile grinding machine (1) for the grinding of pre-geared or pre-profiled workpieces (2), wherein the machine comprises at least one tool spindle (3) which can carry at least one grinding tool (4) and wherein the machine comprises at least two workpiece spindles (5, 6) which can at least temporarily be driven to the tool spindle (3) for cooperation of the workpiece (2) with the grinding tool (4). To improve the ratio between primary processing time and secondary processing time the invention proposes that the at least two workpiece spindles (5, 6) are pivoted around a respective axis of rotation (7, 8) for transportation from a grinding position (I) to a loading station (II) and vice versa, wherein the rotation of the two workpiece spindles (5, 6) takes place independently from another. Furthermore, the invention relates to a gear or profile grinding machine.

Abstract: Disclosed is a deburring apparatus. The deburring apparatus includes a transfer module installed on a base to form a transfer path of transferring a workpiece to be deburred, a deburring module provided on the transfer path of the workpiece installed on the base to deburr the workpiece, and a blocking cover installed on the base to reciprocate thereon to selectively prevent the transfer module and the workpiece on the transfer module from being exposed to an outside, and to prevent dust and noise, which are produced when a deburring work is performed for the workpiece by using the deburring module, from being delivered to the outside. The burrs, which are produced when a metallic produce or a non-metallic produce having a 3-D shape is molded or cut, are easily and rapidly removed.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.

Abstract: To provide a polishing pad (14) useful for polishing semiconductor materials having a high hardness. The polishing pad (14) is used for polishing a workpiece (16) in combination with loose grains and comprises a polishing surface (15) comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.

Abstract: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid equal-height flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a precision-flat abrading machine base where the spindle surfaces are in a common plane that is co-planar with the base surface. The three spindles are positioned to form a triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. Flat surfaced workpieces are attached to the spindles and the rotating floating-platen abrasive surface contacts all three rotating workpieces to perform single-sided abrading. The platen abrasive surface can be re-flattened by attaching equal-thickness abrasive disks to the three spindles that are rotated while in abrading contact with the rotating platen abrasive. There is no wear of the abrasive-disk protected platen surface.

Abstract: A bearing ring grinding machine having a grinding unit arranged to machine the bearings with micron-size tolerances and reduce a grinding cycle period. The grinding unit includes a fixed plate which supports a horizontally movable loader and sliding carriage. A carriage stopper, in the loader, holds the ring against the plate and between two lateral channels. The fixed plate has an opening for passage of a rotatable spindle, equipped with a magnetizable bush, to support the ring during machining and support stops for automatically positioning the ring on the bush. Initially, the carriage releases a ring to be ground which then passes toward the bush. The ring is then secured, machined, carried by a magnetic carrier of an automatic discharge device.

Abstract: In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel which is adapted to press a cylindrical workpiece into the grinding wheel as the regulating wheel rotates. Electronic equipment may be adapted to adjust a pressure of the regulating wheel against the grinding wheel. Also, a carrier may be adapted to house the workpiece, the carrier being attached to a translation mechanism adapted to move the carrier between the wheels such that the workpiece is in contact with both wheels.

Abstract: A grinding apparatus for grinding workpieces includes two clamping rods and a base. Each of the two clamping rods has a first end and an opposite second end. The first ends are opposite to each other for clamping workpieces therebetween. The base includes a receiving groove for receiving the workpieces therein and two positioning slots at opposite sides of the receiving groove. The positioning slots are aligned with each other and configured for receivingly engaging with the clamping rods to align the clamping rods with each other.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished.

Abstract: A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.

Abstract: A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.

Abstract: A lens stocking apparatus capable of stocking a plurality of lenses, which has a first stage, on which a plurality of trays respectively accommodating lenses are mountable, for transferring a tray, a vertically movable second stage, on which a plurality of trays respectively accommodating lenses are mountable by being vertically stacked, for receiving a tray, a tray movement unit that has a holding portion, which is adapted to hold a tray, and that is configured to move a tray from the first stage to the second stage, and a guide unit adapted to guide a position of at least a topmost one of trays mounted on the second stage.

Abstract: In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a load cup arm configured to pivot about an axis between a load position aligned with the apparatus and an off-load position. A work piece platform is coupled to an end of the load cup arm and a plurality of lift fingers and a plurality of guide fingers, configured to support and center a work piece, are spaced about the work piece platform. A plurality of guide posts are spaced apart about the periphery of the work piece platform and are configured to align the work piece platform, in the load position, to the processing apparatus.

Abstract: A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for transferring a substrate between the substrate holding mechanism and the carrier held by the carrier holding unit. The substrate holding mechanism has a first substrate contacting member which comes in contact with the substrate when the substrate holding mechanism holds the substrate, and at least the substrate contacting portion of the first substrate contacting member includes a conductive portion, which is electrically grounded.

Abstract: An attitude control device and a precision machining apparatus capable of accurately controlling the attitude of an object mounted on the attitude control device according to grinding stages. The attitude control device is constituted by a first flat-plate member 21 and a second flat-plate member 22 disposed in parallel with the first flat-plate while being spaced apart from the same by a distance L. A spherical member 3 is interposed between the first and second flat-plate members 21, 22 while fitting its portions in recesses 21a, 22a respectively formed in the first and second flat-plate members 21, 22. A first actuator 4a expandable in a Z-axis direction perpendicular to a plane defined by an X-axis and a Y-axis is interposed between the flat-plate members. Second actuators 4b, 4b expandable in a suitable direction in the plane defined by the X-axis and the Y-axis are connected to the second flat-plate member 22.

Abstract: A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planarized conductive layer on the front surface of the wafer, a chamber within the ECMPR module configured to remove conductive material from an edge region of the wafer, a CMP module configured to receive the wafer from the ECMPR module and polish the planarized conductive layer on the surface of the wafer to form the metallic interconnect structure, and a robot configured to transfer the wafer from the ECMPR module to the chemical mechanical polish (CMP) module. In one aspect of the invention, the ECMPR module deposits conductive material on the front surface of the wafer. The ECMPR module removes at least a portion of the conductive layer from the front surface of the wafer.

Abstract: A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.

Abstract: For retrofitting conventional machining apparatuses, in particular cross-cut machines, with a workpiece holder, the invention proposes a workpiece holder with at least one continuous clamping chain that is provided on one side with a plurality of clamping jaws.

Abstract: A machining strain removal apparatus for removing machining strain present on a treated surface of a workpiece, for example, a ground back of a semiconductor wafer by polishing the treated surface or ground back with a polishing tool with a high efficiency in a high quality. The apparatus comprises chuck means for holding the workpiece while exposing the treated surface, and polishing means for polishing the treated surface of the workpiece held on the chuck means. The polishing means includes a polishing tool, and presses the polishing tool being rotated against the treated surface of the workpiece, thereby polishing the treated surface.

Abstract: A substrate loader for a semiconductor substrate processing system that generally includes a wall having an exterior side with one or more apertures formed therethrough and a related method of loading a processing system. A door assembly is movably coupled to the wall in each of the apertures and is adapted to temporarily retain the substrate. A first portion of the door assembly substantially closes the aperture when the door assembly is in a first or closed position, and a second portion of the door assembly substantially closes the aperture when the door assembly is in a second or open position. A robot for transferring a substrate in a processing system is also provided.

Abstract: The apparatus includes a frame and a holder rotatably secured to the frame for releasably holding a first workpiece of the workpieces. A mechanism is provided for rotating the holder from a loading station to a grinding station and a grinder is movably secured to the frame and selectively positionable relative to the first workpiece when the first workpiece is located at the grinding station. A control is included for selectively positioning the grinding means relative to the first workpiece for grinding the first workpiece and a further holder is rigidly secured to and spaced relative to the holder. The arrangement is such that when the holder is rotated in a direction towards the grinding station, the further holder is rotated in a direction towards the loading station for loading a second workpiece of the workpieces at the loading station so that sequential grinding and loading of the workpieces is permitted.

Abstract: An electronic component chip feeder enabling to feed electronic component chips in which electrodes on the outer surfaces thereof can be cleanly maintained and the reliability of electrical connections is excellent even when miniaturizing thereof is promoted, and a method for manufacturing electronic devices by using electronic component chips being excellent in the reliability of electrical connections are provided. The electronic component chip feeder for feeding electronic component chips includes a cleaning device disposed in an intermediate portion of a supplying system for supplying plural electronic component chips in an aligned relationship for cleaning outer surfaces of the electronic component chips.

Abstract: There are provided with a carrier having a work-holding hole in which a work is fitted and held, a surface plate for grinding the work held on the carrier, and exciter for exciting the carrier to adjust a position of the work deviated from the work-holding hole. Exciting the carrier by the exciter causes a position of the work, deviated from the work-holding hole, to be adjusted, thereby causing the work to be fitted in the work-holding hole.

Abstract: A unidirectional gate disposed between interconnecting fluid transport regions in a manufacturing process. The gate allows workpieces to pass from a first transport region to a second transport region but prevents them from returning to the first region after having passed into the second region. The gate may specifically be used in semiconductor wafer manufacturing, especially where wafers exit a water track into a cassette.

Abstract: A method is provided for processing a metal foil sheet to produce magnetic recording media. The method comprises providing an elongate metal foil sheet having a first side and a second side. The sheet is advanced through a plurality of processing stations in equal unit length segments such that each segment receives the same treatment to form a magnetic recording medium from each segment. Method are also provided to prepare the foil surfaces by polishing, texturing, cleaning, and stress relieving, to coat the prepared surfaces with at least one metal layer, to finish the coated layers by buffing, burnishing, and lubricating, and to form disk units from the prepared, coated and finished surfaces.

Abstract: A bumper finishing apparatus comprises a guided fixture for carrying a bumper past a fixed rotary finishing head. An external drive moves the fixture as guided by a guide profile to coordinate travel of the bumper past the finishing head so that the finishing head abrades the bumper surface in a manner to achieve the desired finish.

Abstract: A loading apparatus (14) loads a workpiece (16) into a through-feed mechanism (20, 22, 24) which advances the workpiece (16) through a processing device (12) at an advancement speed. The loading apparatus (14) includes a roller assembly (30, 32) which grips the workpiece (16), and further includes a motorized drive train (34) which drives the roller assembly (30, 32) to urge the workpiece (16) toward the through-feed mechanism (20, 22, 24) at a speed greater than the advancement speed. The drive train (34) includes a slip clutch (86) which permits slippage in the drive train (34) under resistance transmitted through the workpiece (16) from the through-feed mechanism (20, 22, 24) to the roller assembly (30, 32). The roller assembly (30, 32) loads the workpiece (16) against the resistance of the through-feed mechanism (20, 22, 24) at a speed not greater than the advancement speed.

Abstract: Wafer demount apparatus automatically demounts and transports a polished semiconductor wafer to an inspection station. The apparatus includes a bridge located between a polishing block supporting wax-mounted wafers and an offload conveyor. The bridge fills the gap and provides a smooth transition surface for the wafers moving from the polishing block to the conveyor. The bridge is also capable of movement to achieve vertical and horizontal alignment with the polishing block.

Abstract: A polishing apparatus has a turntable and a top ring for gripping a semiconductor wafer to be polished by an abrasive cloth on the turntable. The polishing apparatus incorporates a loading and unloading unit having a supply holder for holding and supplying a semiconductor wafer to be polished to the top ring at a transfer position, and a reception holder for receiving a polished semiconductor wafer from the top ring at the transfer position. The reception holder and the supply holder are mounted on respective opposite ends of a support block which is angularly movable in a vertical plane by a turning mechanism for moving the supply holder and the reception holder alternatively to the transfer position.

Abstract: A polishing apparatus for polishing a surface of a workpiece such as a semiconductor wafer is installed in a clean room. The polishing apparatus includes a polishing section having a turntable with an abrasive cloth mounted on an upper surface thereof, a top ring for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, a loading section for loading the workpiece to be polished onto the top ring, and an unloading section for unloading the workpiece which has been polished from the top ring. A cover covers an entire area of movement of the top ring including the polishing section, the loading section and the unloading section. An exhaust duct discharges air of an interior space of the cover to an outside of an installation space of the polishing apparatus.

Abstract: An aluminum wheel having a side on which an annular groove is formed is stably led to a polishing and cleaning station in a compact shot blasting apparatus in which the aluminum wheel is uniformly polished and cleaned, and in which an inlet guide way and an outlet guide way on which the aluminum wheel rolls are provided upstream and downstream of a pair of eccentric rollers, a stopper is provided above the inlet guide way while a kick-out bracket which can ascend and descend passing through a gap between the eccentric rollers is provided so that the aluminum wheel is led onto the eccentric rollers with its rolling speed being controlled by the stopper and the kick-out bracket. Further, the shot blasting zone on the aluminum wheel is extended horizontally in a band-like shape.

Abstract: An automatic drill loader is used with a drill grinding machine to automatically present drills to the drill grinding machine workhead for being ground thereat and to carry ground drills to a storage receptacle. The automatic drill loader comprises a magazine, a timing station, and two sets of grippers. The magazine stores a quantity of drills, which may have stepped shanks. The magazine is adjustable to suit drills of different lengths and diameters. The magazine presents one drill at a time to a staging station. A load gripper grips the drill at the staging station and conveys it to the timing station, whereat the drill is linearly and angularly oriented. The load gripper then transports the drill to the drill grinding machine workhead. Simultaneously, an unload gripper carries a ground drill from the drill grinding machine workhead to the storage receptacle.

Abstract: A method for determining the deformation of workpiece on a grinding machine is proposed, in which the deformation of workpiece can be determined without using the less reliable initial deformation.Suppose the deflection at the beginning and the final deflection for the last time be T' (s) and T' (e), respectively, and the deformation preset for the grinding completion time be Ta, the deformation T (s) at the operation start time for the workpiece in the present time is approximated by the expressionT(s)=T' (s)-T' (e)+TaSuppose the shift of grinding wheel for the workpiece be .DELTA.A, and the change in diameter be D(x)-D(s), the deformation T(x) at a time for the present time is determined from the expressionT(x)-.DELTA.A+(D(x)-D(s))/2+T(s).

Abstract: An apparatus is provided for automatic, intermittent feed of workpieces into a lathe. The apparatus includes a collet having a side entry for receiving workpieces and a workpiece positioning aperture, in alignment with the lathe spindle, for finally positioning the workpieces for machining. The collet further includes dowel pins that initially position the workpiece and a plunger that reciprocates intermittently to advance and press the individual workpieces into the positioning aperture. The apparatus includes a delivery chute for intermittently dropping the individual workpieces into the collet assembly side access for initial positioning. A control system positions the collet assembly to receive the workpiece, releases the workpiece from the delivery chute, actuates the plunger to press the workpiece into final position for machining, actuates machining, and, at its completion, actuates the plunger to withdraw the workpiece whereupon it drops from the machine by gravity.