Abstract: An apparatus including a base, a drive device disposed on the base, a sensor unit disposed on the base, and an engagement device. The drive device having an output shaft with a wafer receiving surface, and the drive device being configured to rotate the output shaft about an axis of rotation. The sensor unit being configured to sense a wafer received on the wafer receiving surface. The engagement device being configured to engage and disengage a translational mechanism between the drive device and the sensor unit. When the engagement device engages the translational mechanism, rotation of the output shaft about the axis of rotation by the drive device changes a relative positional relationship between the sensor unit and the axis of rotation.

Abstract: A wafer-transfer device for a chemical-mechanical polishing apparatus includes a base and lifting frame. A first cylinder is connected to a lower portion of the lifting frame to lift it and includes a piston rod passing through the lower portion of the lifting frame and fixed to the base. A basin-shaped contraposition ring is mounted onto an upper portion of the lifting frame via a spring. An inner edge of a top of the contraposition ring defines a curved surface adapted to a contour of a polishing head of the chemical-mechanical polishing apparatus. A wafer support is disposed above the contraposition ring. A second cylinder is mounted onto the contraposition ring and includes a piston rod passing through the contraposition ring and connected to a bottom of the wafer support to lift it. Respective axes of the wafer support, second cylinder, and contraposition ring coincide with one another.

Abstract: A device for grinding spinning cots has a rotating grinding roller and a carriage that is linearly movable relative to the grinding roller. A pivot arm is pivotably supported on the carriage and movable between a loading position and a grinding position. A workpiece receptacle is mounted on the pivot arm and adapted to receive a spinning cot to be ground. A feed device is provided that is actuatable in accordance with progression of a grinding process performed on the spinning cot toward a grinding surface of the grinding roller. The pivot arm is moveable by the feed device relative to the carriage. A device is provided that is actuatable independent of the feed device for manual adjustment of the carriage into a desired linear position relative to the grinding roller.

Abstract: A wafer transferring apparatus includes a top ring for holding a wafer on a lower end surface thereof and a pusher mechanism for transferring the wafer to and from the top ring. The pusher mechanism has a wafer rest for placing the wafer thereon and is arranged to allow the wafer released from the lower end surface of the top ring to be seated on the wafer rest. The pusher mechanism also has a sensor mechanism for detecting when the wafer is properly seated on the wafer rest. The sensor mechanism is adapted to block sensor light emitted from a light-emitting device by the wafer seated on the wafer rest.

Abstract: An adaptive work table-reciprocation control system and method that can reduce a grinding time. The system uses a vibration sensor head installed on a chuck surface in the vicinity of the workpiece to detect a vibration signal emitted from the contact zone between the grinding wheel and the workpiece. When the value of the vibration signals falls below a trigger level, a work table direction of motion is reversed.

Abstract: A power tool (2) includes a motor (22) pivotally mounted within the housing of the tool. The tool is able to accept any one of a plurality of attachment members (44, 46, 48).

Abstract: An apparatus and method for uniformly planarizing a surface of a semiconductor wafer and accurately stopping CMP processing at a desired endpoint. In one embodiment, a planarizing machine has a platen mounted to a support structure, an underpad attached to the platen, a polishing pad attached to the underpad, and a wafer carrier assembly. The wafer carrier assembly has a chuck with a mounting cavity in which the wafer may be mounted, and the wafer carrier assembly moves the chuck to engage a front face of the wafer with the planarizing surface of the polishing pad. The chuck and/or the platen moves with respect to the other to impart relative motion between the wafer and the polishing pad. The planarizing machine also includes a pressure sensor positioned to measure the pressure at an area of the wafer as the platen and the chuck move with respect to each other and while the wafer engages the planarizing surface of the polishing pad.

Abstract: The apparatus includes a frame and a holder rotatably secured to the frame for releasably holding a first workpiece of the workpieces. A mechanism is provided for rotating the holder from a loading station to a grinding station and a grinder is movably secured to the frame and selectively positionable relative to the first workpiece when the first workpiece is located at the grinding station. A control is included for selectively positioning the grinding means relative to the first workpiece for grinding the first workpiece and a further holder is rigidly secured to and spaced relative to the holder. The arrangement is such that when the holder is rotated in a direction towards the grinding station, the further holder is rotated in a direction towards the loading station for loading a second workpiece of the workpieces at the loading station so that sequential grinding and loading of the workpieces is permitted.

Abstract: There are provided with a carrier having a work-holding hole in which a work is fitted and held, a surface plate for grinding the work held on the carrier, and exciter for exciting the carrier to adjust a position of the work deviated from the work-holding hole. Exciting the carrier by the exciter causes a position of the work, deviated from the work-holding hole, to be adjusted, thereby causing the work to be fitted in the work-holding hole.

Abstract: A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion.

Abstract: A shuttle system for transferring a semiconductor wafer from a receiving station to a horizontal-oriented head drive of a wafer polishing machine includes a linear horizontal rail extending from a first position to a second position; a wafer transfer assembly adjacent to the first position; a wafer conveying assembly movable along the rail from adjacent the first position to adjacent the second position; and wherein the wafer conveying assembly includes a vertically movable and radially movable gripper for gripping peripheral edges of a wafer to be transferred and conveyed from the transfer assembly to the head drive. The transfer assembly includes a transfer receiver for receiving an unpolished wafer from a cassette which receiver is movable to the second position where the gripper is movable to edge-grip the received unpolished wafer. The gripper includes a series of radially movable segments having edge-contacting fingers depending therefrom for gripping the wafer edges.

Abstract: There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly, a first rotating mechanism for rotating the first polishing plate assembly, an upper polishing plate assembly, a second rotating mechanism for rotating the upper polishing plate assembly, a pressing mechanism, a conveying mechanism and a discharging mechanism. The lower polishing plate assembly includes a lower polishing plate, a polishing pad, a porous sheet interposed between the lower polishing plate and the polishing pad. The porous sheet has a thickness of 0.5 to 3 mm, and is formed of a foaming resin. The upper polishing plate assembly includes an upper polishing plate, a plate-like chuck and a backing pad, a pressure reducing unit, and a cleaning unit.