Abstract: One embodiment of a device for positioning an object to be ground independent of the grinding tool having an armature shaft for holding an object, mounted by means of an armature and armature collar and attached to a mast, which is attached to a base. The armature shaft is used to position the object to be ground at a face angle determined by the combination of the vertical positioner length of the armature relative to the surface of the independent grinding tool. The rotational angle of the object to the grinding tool is set and can be repeated as needed by the indexed angle selector and the keyed receiver.

Abstract: A system for machining a bevel on a disk shaped part including a grinding device having an abrasive, a device for securing the part including a support to which the part is fitted and which is integral with an axis of rotation. The securing device further includes a system for orienting the axis of rotation to define the angle of the bevel and a system for moving the support closer to the abrasive in order to machining the part under stress. The invention concerns the field of crystals for timepieces.

Abstract: The present disclosure is related to a method for sharpening the tip of a microprobe, in particular a neural probe or an array of neuroprobes having a common base portion. The probes have a constant thickness and a chisel-shaped tip portion. The probes are attached to the slanted side of a wedge-shaped carrier, with the probe tips placed in close proximity to the edge of the carrier, for example extending over said edge. The base of the carrier is then subjected to a grinding step, possibly followed by a polishing step, so that the probe tips of the probes are ground to form a sharp pointed tip shape.

Abstract: An aspect of the present invention relates to a method of manufacturing an eyeglass lens, which comprises a step of conducting polishing processing of a non-optical surface of a semifinished lens, one surface of which is an optical surface and the other surface of which is the non-optical surface, to create an optical surface. The semifinished lens comprises an acrylic coating on an optical surface of a lens substrate, a surface of the acrylic coating having a contact angle relative to water of equal to or less than 90°, prior to the polishing processing, a protective film is adhered through an adhesive layer of the film to the surface of the acrylic coating, and the polishing processing is conducted by polishing a non-optical surface of the lens substrate in a state where the protective film surface is secured in a block jig.

Abstract: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.

Abstract: A method of polishing diamonds held by a tang (100) having a predefined axis (160) orthogonal to polishing surface (110). The axis (160) returns to its original spatial orientation with respect to the polishing surface (110) at the end of each facet of the diamond (122) polishing.

Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

Abstract: An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a plurality of connector fixtures that may receive a variety of connectors at varying angles. Each connector fixture communicates with a corresponding polishing pad. Thus, fiber optic cable connectors having a variety of polished end faces may be provided with the apparatus. The apparatus also eliminates the potential for contamination among polishing films, reduces polishing steps, and saves labor and maintenance costs.

Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

Abstract: A system for polishing a substrate has a controller, pressure source, a platen, and a carrier for handling the substrate. The carrier must be able to detect if a substrate is present. In either the case of a false detection of substrate presence or the failure to detect substrate presence, the likely result is damaged substrates, wasted polishing consumables, and down time of the manufacturing facility. Detection is achieved by the substrate causing movement of a plunger and by such movement resulting in a pressure differential that is detected. The reliability of this detection is improved by one or more of a precise relationship of the plunger to a plate that applies pressure to the substrate, a controlled seal that is ensured of being broken when the plunger is moved by the presence of a substrate, and proper spring pressure applied to the plunger to prevent spurious plunger movement.

Abstract: A concave optical fiber ferrule holding plate for polishing an end face of an optical fiber is disclosed. The holding plate may be used alone for hand polishing or be provided as a component of an optical fiber polishing machine. The circular holding plate comprises a concave interior with one or more concentric wear rings disposed radially inwardly on said interior from the outer periphery of the holding plate to a point surrounding the optical fiber ferrule located in the center. The holding plate contacts a polishing material only at the peripheral wear ring thereby reducing contamination from the material of the holding plate which reduces contamination of the end face of the fiber during polishing. The degree of deterioration of the wear rings can be easily observed to determine when the ferrule holding plate must be replaced.

Abstract: A process for forming a semiconductor wafer which is single side polished improves nanotopology and flatness of the polished wafer. The process reduces the effect of back side surface features, such as edge ring phenomena and back side laser marks, on nanotopology, thereby improving oxide layer uniformity for chemical/mechanical planarization (CMP) processing, and flatness on the polished front side of the wafer after polishing. The wafer is mounted on a polishing block by wax. The edge ring causes certain deformation and stress in the wafer upon mounting, which is held by the wax. After mounting, the wax is heated to allow the wafer to relax, removing the stress, without degrading the bond of the wafer to the polishing block. The wafer is polished and removed from the polishing blocks. The polished surface substantially retains its shape after being de-mounted from the block.

Abstract: An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a plurality of connector fixtures that may receive a variety of connectors at varying angles. Each connector fixture communicates with a corresponding polishing pad. Thus, fiber optic cable connectors having a variety of polished end faces may be provided with the apparatus. The apparatus also eliminates the potential for contamination among polishing films, reduces polishing steps, and saves labor and maintenance costs.

Abstract: An apparatus that enables a magnification system to view the surface of optical connectors without the need to remove the connectors from a polishing workholder. A connector is placed into a centering insert that is integral to a polishing workholder. The magnification system is fitted with an adapter that engages with the centering insert. This engagement locates the ferrule of the optical connector in the focal plane of the magnification system for viewing and inspection of surface quality.

Abstract: The invention is a grinding apparatus for grinding tips of welding electrodes.

Abstract: The present invention provides novel preformed base blocks that may be used with thermoplastic ophthalmic lens blocking compositions. The preformed base block has a rear portion that is sized and adapted to fit the chuck of a lens processing machine and a front portion that has a textured front surface and preferably a negatively tapered peripheral edge. The front portion is adapted to mechanically retain the thermoplastic blocking composition to form a lens block against a lens blank.

Abstract: A lapping apparatus for uniformly laps work pieces. The lapping apparatus includes a rotary lapping plate, a lapping base including a plurality of pads contacting the lapping plate, an adapter including first and second surfaces for supporting the mounting base contacting the lapping plate, and a supporting mechanism provided on the lapping base for supporting the second surface of the adapter by a supporting point. As the adapter supporting the work piece is supported on two points on the work piece and one supporting point of the lapping plate, the lapping surface of the work piece may follow as the lapping plate. Accordingly, it becomes possible to uniformly lap the work piece regardless of accuracy of the lapping base.

Abstract: A method for polishing a gemstone includes providing a polishing surface (11), mounting the gemstone in a holder (6) of a clamp (1), and choosing a reference plane (33) so that it corresponds to the polishing surface. Then the facet polishing depth is set by bringing the gemstone into a position with respect to the reference plane (33) which the gemstone will occupy after completion of polishing the facet. At the moment when the clamp occupies a same position with respect to the polishing surface as the clamp previously occupied with respect to the reference plane, polishing is stopped.

Abstract: A tool guide for sharpening woodcarving and lathe tools comprises a holder frame having an adjustable clamping member for clamping a portion of a tool against an inner surface thereof, and an adjustable foot member removably connected to the holder frame by a downwardly extending central rod for engaging a work surface which is coplanar with or parallel to a nearby abrasive sharpening surface. The foot member includes an arcuate surface which may be arranged to engage the work surface for sharpening tools having a U-shaped cutting edge profile, and a pair of arc ends which may be arranged to engage the work surface by inverting the foot member for sharpening tools having a straight cutting edge profile. A pair of side rods are spaced on opposite sides of the central rod, whereby distal ends of the side rods and central rod define an angular profile for sharpening tools having a V-shaped cutting edge when the foot member is removed.

Abstract: For blocking or polishing a natural or synthetic stone having a Mohs hardness greater than about 5, a blocking head has a body, a mounting member which can move vertically with respect to the body, and a rotary spindle driven by a motor. The mounting member is carried by a leaf spring whose position is altered by a parallel linkage whose arm is driven by a motor. In this way, the spring can for soft landing apply an upwards bias opposing the gravitational force of the mass of the mounting member. When the stone is in contact with the scaife, the deflection of the spring measures the force on the stone, and this deflection is detected by an LVDT. Subsequently, the spring can apply a downwards bias to augment the working force. A microprocessor is responsive to the output of the LVDT and controls the motor so that the force applied to the stone complies with a predetermined program.

Abstract: A machine is disclosed for forming facets on the surfaces of a plurality of workpieces. The machine is characterized by the presence of a plurality of pin members for holding the workpieces to be faceted against an abrading surface of a lap or an abrading wheel. The pin members are positioned and held together in a contiguous relationship. The machine also includes a mechanism for setting the angular relationship of the pin members relative to the lap or abrading wheel and for causing movement of the pin members away from the lap. An automated lap cooling, moisturizing and working compound supply system is also provided in another embodiment of this invention, for allowing continuous operation of the machine.

Abstract: A machine is disclosed for forming facets on the surfaces of a plurality of workpieces. The machine is characterized by the presence of a plurality of pin members for holding the workpieces to be faceted against an abrading surface of a lap or a grinding wheel. The pin members are positioned and held together in a contiguous relationship. The machine also includes a mechanism for setting the angular relationship of the pin members relative to the lap or grinding wheel and for causing rotational or gyrational movement of the pin members.

Abstract: A dop, a tang, and the combination of the two structures. The dop has an arc of movement of at least 75 degrees and as much as 95 degrees. The dop has an arcuate surface having an arc of movement of at least 95 degrees and a gear having key ways. The arcuate surface having keys extending substantially the entire arc of movement and the keys interdigitating with the key ways. The tang has a butt end, a neck, a clamp end connected to the neck and opposite the butt end, a clamp connected to the clamp end. The butt end including a platform structure integral to the neck and a support structure having a base. The support structure movably connected to the platform structure by a first adjustment tool. The support structure further including a second plurality of adjustment tools connected to the base.

Abstract: During polishing of a gemstone (30, 100, 200), a coolant is passed in heat exchange relationship with the gemstone to remove heat. This reduces the risk of temperature degradation of the gemstone. In practice, this can be achieved by passing a fluent coolant through a coolant chamber (34, 124, 214) which forms part of the apparatus that is used to hold the gemstone during polishing and which is in heat exchange relationship with the gemstone held by the apparatus.