Abstract: A mounting element for holding a self-adhesive and/or flexible abrasive includes a supporting plate, and a distributing body. The supporting plate includes a plurality of suction openings which penetrate the supporting plate from a first side to a second side opposite the first side. A first side of the distributing body is in contact with the second side of the supporting plate, and a second side of the distributing body is configured to hold an abrasive. The distributing body includes a plurality of cavities which penetrate the distributing body from the first side of the distributing body to the second side of the distributing body, and which are mutually separated by a plurality of walls. At least one of the walls has at least one aperture which connects at least two adjacent cavities to each other.

Abstract: A grinding disk is provided with a support plate with anchoring projections. A drive connector is connected to the support plate. An elastically deformable pad in the form of an injection molded part of un-foamed elastomeric thermoplastic synthetic material is provided and has a first face and an opposite second face. The pad has a chamber structure provided on the first face. The chamber structure has chambers laterally delimited by intermediate walls. The chambers have a top side that is open and is facing in a direction of the first side. The pad has a substantially closed support surface provided on the second face and facing away from the chamber structure. A working element is to be attached to the support surface. The support plate is connected to the first face of the pad to support the pad. The anchoring projections of the support plate are embedded within the pad.

Abstract: A method and system for planarizing or polishing a semiconductor wafer. The system includes a carrier adaptable to hold a semiconductor wafer, a polishing pad, and a platen having a substantially planar surface in contact with the polishing pad, the planar surface having a distribution of holes. The distributed holes are operatively connected to a vacuum system providing a vacuum pressure to hold the polishing pad against the platen during operation of the system. Relative movement between the carrier and polishing pad acts to planarize a surface of the wafer.

Abstract: An abrasive article for polishing a substrate surface. The abrasive article includes a holder pad assembly and an abrasive member held in place with respect to a holder pad. The abrasive member further includes a first surface engaged with the holder pad assembly, and a second surface including an abrasive. A preload mechanism is positioned to bias the second surfaces of the abrasive member toward the substrate surface. One or more fluid bearing features on the second surface of the abrasive member is configured to generate lift forces during relative motion between the abrasive article and the substrate surface.

Abstract: A rotatable abrasive lapper machine platen assembly is attached to a lapper machine frame. The assembly has at least: a) a circular-shaped rotatable horizontal platen having i) a front surface and ii) a back surface; b) the circular platen having a platen radius, a platen outer circumference and a platen outer periphery; c) the circular platen front surface having an outer annular planar portion where the platen outer annular planar portion extends radially to the circular platen outer circumference; and d) a flexible abrasive disk secured in conformable flat contact with the circular platen front surface outer annular planar portion wherein the abrasive disk is positioned concentric with the circular platen.

Abstract: An electric hand-held power tool for performing sanding work, in particular a finishing sander, is provided, that includes a drive plate (16)—which is drivable in a sanding motion using an electric motor—and a sanding plate (21?) attached thereto such that it is removable without the use of a tool, with means for attaching a sanding pad (22?). To create a multifunctional device with which various types of sanding work may be performed in an optimal manner, a tub-like recess (23) with a flat tub bottom (231) for receiving the drive plate (16) in a form-fit manner is formed in the top side of the sanding plate (21?) facing the drive plate (16); the sanding plate (21?) is attached in a manner such that it is removable without the use of tools, preferably via a Velcro attachment between the tub bottom (231) and the surface of the drive plate (16).

Abstract: An assembly for producing partially packaged semiconductor devices is provided. In one embodiment, the assembly includes a magnetic plate; a flexible substrate disposed adjacent the magnetic plate and having two surfaces; a nonstick coating disposed on one surface of the flexible substrate thereby exposing a nonstick surface; and a tape layer having two surfaces. The tape layer is adhesively attached to the nonstick surface to expose a surface of the tape layer. A frame is disposed on the exposed surface of the tape layer, and a plurality of integrated circuit (IC) die is positioned within the frame and supported by the tape layer. A panel is formed within the frame that at least partially surrounds the plurality of IC die and that contacts the tape layer.

Abstract: A method and apparatus for replacing a polishing pad conditioning disk is a chemical mechanical polishing system is provided. The apparatus comprises a disk load/unload station for unloading used conditioning disks from a pad conditioning assembly and loading unused conditioning disks onto the pad conditioning assembly, on or more disk storage stations for storing both used and unused conditioning disks, and a central robot having a range of motion sufficient for transferring both used an unused conditioning disks between the disk load/unload station and the one or more disk storage stations. Embodiments described herein reduce the length of system interruption by eliminating the need to safety lock out the system for the replacement of polishing pad conditioning disks.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: A method and system are disclosed. The system may include a device for sharpening a convex edge on the blade of a knife. The device may include a resilient material and a plurality of abrasive sheets of varying grit values. Each abrasive sheet may be removably attachable to a top of the resilient material. The method may include placing the blade against the abrasive surface at a small angle with a first side of an edge to be sharpened of the blade contacting the abrasive surface and a spine of the blade elevated above the abrasive surface, applying a downward force on the blade causing the edge to be sharpened to compress the resilient abrasive surface, and moving the first side of the edge to be sharpened along the abrasive surface in the direction of the spine.

Abstract: The vacuum suction holding apparatus of the present invention has a vacuum duct which is disposed inside a polishing head, with one end of this vacuum duct being opened in the attachment surface and the other end thereof being connected to a vacuum source. A polishing body is held by suction on the attachment surface of the polishing head by sucking air through the vacuum duct. The apparatus further has an orifice which is disposed in the vacuum duct, a first pressure sensor and a second pressure sensor which detect the pressure inside the vacuum duct at positions before and after the orifice, and a judgment device which judges whether or not the polishing body is held by suction on the polishing head on the basis of the pressure difference before and after the orifice detected by these two pressure sensors.

Abstract: A platen structure of a polishing apparatus for semiconductor wafer and a method for exchanging a polishing pad affixed to the same are provided in which the polishing pad supported by the platen is exchanged with convenience within a short time. The platen structure of the polishing apparatus in which the polishing pad attached to the platen of the polishing apparatus comprises a pad plate to which the polishing pad for polishing a wafer is attached, and a platen body combined with the pad plate and having at least one vacuum hole formed thereto to provide a vacuum passage.

Abstract: Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The magnetic field source has a first member that induces a magnetic field in the head. The fluid and/or the magnetic elements move within the chamber under the influence of the magnetic field source to exert a force against a portion of the micro-device workpiece. In a further aspect of this embodiment, the carrier assembly includes a flexible member in the chamber. The magnetic field source can be any device that induces a magnetic field, such as a permanent magnet, an electromagnet, or an electrically conductive coil.

Abstract: Disclosed is a carrier head of a chemical mechanical polishing apparatus for planarizing a semiconductor wafer. An adjustment chamber is provided in a space section formed between a membrane lower holder and a membrane upper holder of a wafer support assembly. Pressure applied to the adjustment chamber is transferred to a rear surface of a membrane during a polishing process through a perforated hole formed at a center of the membrane lower holder. A center portion of the membrane is connected to a vacuum pipe by passing through a hole of the membrane lower holder and the adjustment chamber. Vacuum pressure is directly applied to a wafer so that the wafer is easily attached to the carrier head at lower pressure. Pressure is evenly distributed over the whole area of the wafer so that the wafer is evenly polished.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion.

Abstract: Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The magnetic field source has a first member that induces a magnetic field in the head. The fluid and/or the magnetic elements move within the chamber under the influence of the magnetic field source to exert a force against a portion of the micro-device workpiece. In a further aspect of this embodiment, the carrier assembly includes a flexible member in the chamber. The magnetic field source can be any device that induces a magnetic field, such as a permanent magnet, an electromagnet, or an electrically conductive coil.

Abstract: The present invention provides a polishing apparatus with a construction which makes it possible to prevent the peripheral portions of a substrate from sloping downward as a result of the polishing member tilting at the peripheral portions of the substrate during the polishing of the substrate, and which makes it possible to adjust the contact pressure quickly in accordance with changes in the contact area between the polishing surface and the substrate surface.

Abstract: A cleaning system and a cleaning method is provided with a cleaning medium comprising a magnetic substance and a magnetic field generating device for applying a magnetic force to the magnetic substance in the cleaning medium so that the magnetic substance and the area to be cleaned are rubbed together. The area to be cleaned is cleaned by the rubbing action of the cleaning medium. The interior of the cleaned object not reachable by hands or instruments can be easily cleaned with this device. The cleaning medium, made of a magnetic substance, is guided into the interior of the cleaned object. The magnetic field generating device generates a magnetic field in the cleaning medium and thereby applies a force to the magnetic substance. By rubbing the magnetic substance on the inner wall surface of the area to be clean, the object can be cleaned efficiently.

Abstract: A ventilated platen/polishing pad assembly for chemical mechanical polishing copper conductors on a semiconductor wafer is disclosed. The ventilated platen is constructed by a platen having a multiplicity of apertures through a thickness of the platen, and a polishing pad that has a multiplicity of apertures for fluid communication with the multiplicity of apertures in the platen such that a gas can flow through the ventilated platen and the ventilated polishing pad to mix with a polishing slurry solution dispensed on top of the polishing pad. When an oxidizing gas is mixed with the slurry solution, the mass transfer process during the chemical mechanical polishing can be improved and thus improving the polishing uniformity of the copper surface.

Abstract: A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion.

Abstract: An apparatus according to the principles of the present invention includes a rotatable platen, a rigid plate member with a top surface and a bottom surface, includes pin members coupled to the rigid plate member which can be inserted into guide openings positioned within the rotatable platen, and a vacuum channel formed within the platen that enables removable mounting the rigid plate member to a top surface of the rotatable platen. The vacuum channel includes a cavity in the top surface of the platen. The rigid plate member adhesively holds the polishing pad to form a rigid plate assembly. A vacuum source coupled to the vacuum channel can be activated to create a vacuum within the vacuum channel to attract the rigid plate member to the platen. The platen can then used to polish work pieces contacting the polishing pad on the top surface of the rigid plate member.

Abstract: A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion.

Abstract: A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion.

Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

Abstract: An adapter for use with automated abrading equipment. The adapter includes a first surface for the releasable mounting of abrasive articles, such as those mounted with releasable adhesive, and a second surface for releasable mounting to automated equipment. The second surface may contain hook and/or loop like structures or other non-adhesive based mounting mechanisms, and the adapter may include magnetic material.

Abstract: A back-up pad for pad for supporting an abrasive article. A preferred embodiment of the invention provides a back-up pad having a dust collection groove, in which the engagement component for securing the abrasive article is attached to the dust collection groove surface. The present invention also provides a method for forming a back-up pad with a dust collection groove.

Abstract: Apparatus and a method of cold cross-sectioning soft materials includes providing a chuck attached to a drive motor with a composite plate attached to the chuck and including a heat insulating portion, a heat conducting layer, and a central axially extending duct with a plurality of radially extending conduits in communication therewith, the central axially extending duct is accessible externally for introducing a cooling liquid thereto. A sheet of grinding material is magnetically attached to the composite plate and the drive motor is activated to rotate the composite plate and grinding material. A cooling liquid is introduced into the duct and communicated to the conduits and a lubricant is supplied to the exposed rotating surface of grinding material.

Abstract: An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may comprise a vacuum or electromagnetic force, and the pad has a hard or magnetic backside layer for facing the plating and responding to the attractive force. This invention has particular application to chemical-mechanical polishing for use in planarizing dielectrics.

Abstract: A method and apparatus for facilitating the removal and replacement of polishing pads utilized in the process of polishing and planarizing workpieces such as semiconductors where the polishing machine employed includes a rotatable platen. The apparatus for facilitating the removal and replacement of polishing pads includes a top plate for securing a polishing pad thereto and means for removably mounting the top plate to the rotatable platen in the polishing machine. Means for removably mounting the top plate to the rotatable platen preferably includes a plurality of electromagnetic elements embedded within the top surface of the rotatable platen and means for activating and deactivating the electromagnetic elements.

Abstract: A magnetic disc system for grinding or polishing metallographic test specimens on a movable platen includes a barrier that is magnetically attached to a movable platen. A grinding or polishing surface attaches to the barrier. The barrier magnetically attaches to the platen and is also capable of blocking or greatly reducing the magnetic field magnetism from passing through to the grinding or polishing surface and restricting or preventing swarf adhesion resulting from the polishing or grinding operation that could harm the prepared surface.

Abstract: An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary lapping table, a lapping head attachment frame, an adjuster ring resiliently supported by the frame, a lapping head attached to the adjuster ring, a tilting assembly attached to the lapping head, and an up and down movable back plate pivotally attached to the lapping head. The apparatus further comprises first actuators or cylinders for correcting balance by applying forces on right and left sides of the pivotal point of the back plate, and second actuators or cylinders for correcting bow of the workpiece by applying operating forces on a plurality of predetermined locations of the tool so that the moving directions of movable parts of the second actuator means are substantially parallel with the directions of the operating forces.

Abstract: A polishing system includes a polishing pad for polishing a surface of a layer provided on a substrate, a surface condition measuring device for detecting a condition of a polishing surface of the polishing pad and a controller for controlling a process to the polishing pad by judging whether the polishing pad can be continuously used for polishing of the surface of the layer provided on the substrate, on the basis of a signal indicative of a measurement from the surface condition measuring device.

Abstract: An attachment means for attaching a sheet-formed abrasive and/or polishing means to a magnetized support, said attachment means comprising a ferromagnetic base layer and an external adhesive layer to which the abrasive and/or polishing means attached, and where said ferromagnetic base layer comprises a ferromagnetic metal foil and that said attachment means comprises a liner sheet having a first side adhered to a first side of the base layer by means of an internal adhesive layer, the liner sheet having the external adhesive layer disposed on the second side of the liner, the external adhesive layer being capable of releasably fixating the abrasive and/or polishing means and said external adhesive layer being capable of substantially retaining its adhesive capacity after removal of the abrasive and/or polishing means. The base layer is optionally and preferably provided with a friction increasing layer on the second side.

Abstract: An attachment system for a lens surfacing and polishing pad adapted for use with a lapping tool is described. The lapping tool includes a curved surface having a metallic surface disposed on at least a portion thereof. The pad has a configuration conforming to the curved surface of the lapping tool and includes a first abrasive surface and a second metallic surface. The metallic surface of the lapping tool may be magnetized, either selectively or permanently, permitting the metallic substrate surface to adhere thereto, thus removably fastening the pad to the lapping tool. Alternatively, the metallic surface of the pad may be magnetized, permitting the metallic surface of the lapping tool to adhere thereto, thus removably fastening the pad to the lapping tool.

Abstract: A separation type grinding or polishing (hereinafter "grinding") surface plate (11) comprises a surface plate body (12) connected to a drive of a grinding apparatus directly or through a water cooled jacket or the like, and a disk (13) for grinding which is adapted to rotate together with the surface plate body (12) and contact an article being ground directly or through an abrasive cloth (14). The disk (13) for grinding is detachably held on the surface plate body (12) by vacuum suction or magnetic forces. Accordingly, it is possible to ensure an accuracy in a cleaning operation of a surface plate, a replacing operation of an abrasive cloth or the like as well as labor saving and to prevent lowering of a grinding accuracy due to thermal deformation.

Abstract: A back-up pad for pad for supporting an abrasive article. A preferred embodiment of the invention provides a back-up pad having a dust collection groove, in which the engagement component for securing the abrasive article is attached to the dust collection groove surface.

Abstract: An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may comprise a vacuum or electromagnetic force, and the pad has a hard or magnetic backside layer for facing the plating and responding to the attractive force. This invention has particular application to chemical-mechanical polishing for use in planarizing dielectrics.

Abstract: A carrier head assembly including a drive shaft and a system flange connectable to the drive shaft where the system flange includes a number of magnetic plates. The carrier head assembly also includes a carrier head flange. The carrier head flange has more magnetic plates, these magnetic plates generally facing the previous plates. The magnetic plates magnetically engage to couple the carrier head flange to the system flange.

Abstract: An improved process for lapping a surface according to the present invention comprises:a) providing a work piece with two surfaces to be lapped,b) providing two rotatable platens, each having i) a back surface and ii) a front surface,c) providing a sheet of abrasive material having an abrasive face and a back side, the back side being on the front surface of each of the two rotatable platens with the abrasive faces of each sheet facing the other sheet,d) placing the work piece with two surfaces to be lapped between the two rotatable platens, so that each abrasive face faces only one of the two surfaces to be lapped,e) rotating the two platens at a rotational speed of at least 500 revolutions per minute,f) contacting each of the abrasive faces with the only one of the two surfaces to be lapped, andg) lapping said two surfaces of said work piece simultaneously.

Abstract: A polishing apparatus is provided with a turn table, on which an air passage is formed, and a polishing pad mount plate, on which a polishing pad is stuck. The polishing pad mount plate is detachably attached on the turn table. When the polishing pad mount plate is detached from the turn table, a separation fluid supplying part supplies air as separation fluid between the turn table and the polishing pad mount plate through the air passage.

Abstract: A polishing apparatus such as a semiconductor wafer. The polishing apparatus has a turntable, a cloth cartridge detachably exchangeably mounted on the turntable, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth. The cloth cartridge includes a cartridge base member and a polishing cloth bonded to an upper surface of the cartridge base member. The cartridge base member comprises a plurality of base member segments, and the polishing cloth comprises a plurality of polishing cloth segments bonded to upper surfaces of respective of the base member segments.

Abstract: Lapping or polishing at high speeds with fine abrasive particles offers significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising a rotatable platen having I) a back surface and ii) a front surface, wherein the front surface of the rotating platen facing a work piece has a flat plateau or raised area which is continuous around a perimeter of the front side of said platen and the plateau is elevated with respect to a central area on the front surface. The front surface optionally has vents for air, the platen optionally has a back side to which a shaft is connected (directly or through intermediate connections) to rotate the platen and there is a front side on the platen to which is secured an abrasive sheet by reduced air pressure conveyed through said vents.

Abstract: A polishing pad conditioner has a grid with an abrasive surface for conditioning a polishing pad. Opposite the abrasive side of the grid, there is a back surface, having at least one key way, which extends at least partially into the back surface. A grid holder has a number of keys equal to the number of key ways in the back surface of the grid. The grid holder keys engage the grid key ways, thereby eliminating slippage between the grid and the grid holder. A mechanized arm is attached to the grid holder, and imparts a rotational and translational motion to the grid holder. A magnet may be used as an attachment means between the grid and the grid holder. The key ways of the grid and the keys of the grid holder may be arranged such that the grid holder can only receive the grid with the back surface of the grid facing the grid holder.

Abstract: A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.

Abstract: A tool for filing or abrading surfaces or for sharpening instruments such as knives, chisels and the like includes two spaced thin ferromagnetic rails having co-planar upper edges. A magnet is located between the rails with a ferromagnetic plate magnetically held to the rail. The plate has an exposed abrasive coated surface. A first magnetic pole of the magnet concentrates and conducts magnetic flux to the plate through the rails with sufficient force to hold the plate in position against the upper edges of the rails without the need for a retaining cavity to further restrain the plate from moving during use.