Abstract: A synthetic grindstone for performing surface processing, includes: abrasive grains; binder made of a thermosetting resin material and holding the abrasive grains in a dispersed state; and filler including at least one of first filler, second filler, and third filler. The first filler has a larger average particle diameter than the abrasive grains. The second filler has electrical conductivity. The third filler is harder than a workpiece. The filler is disposed in a state of being dispersed in the binder.

Abstract: A nanodiamond particle dispersion including nanodiamond particles highly dispersed in an organic solvent is provided. A nanodiamond particle dispersion of the present invention includes nanodiamond particles dispersed in an organic solvent, in which the nanodiamond particles have a silane compound (excluding a silane compound having a (meth)acryloyl group) bonded to a surface of the nanodiamond particles, the organic solvent has an SP value from 8.0 to 14.0 (cal/cm3)1/2, and the nanodiamond particles are dispersed with a particle diameter (D50) from 2 to 100 nm. The organic solvent is preferably at least one type of organic solvent selected from ketones, ethers, alcohols, and carbonates.

Abstract: A bonded abrasive article includes elongate shaped abrasive particles. The elongate shaped abrasive particles comprise an elongate shaped ceramic body having opposed first and second ends joined to each other by at least two longitudinal sidewalls. At least one of the at least two longitudinal sidewalls is concave along its length. At least one of the first and second ends is a fractured surface.

Abstract: In an embodiment, a polycrystalline diamond table includes a plurality of bonded diamond grains and a plurality of interstitial regions defined by the plurality of bonded diamond grains. The polycrystalline diamond table may be at least partially leached such that at least a portion of at least one interstitial constituent has been removed from at least a portion of the plurality of interstitial regions by exposure to a leaching agent. The leaching agent may include a mixture having a ratio of weight % hydrofluoric acid to weight % nitric acid of about 1.0 to about 2.4, and water in a concentration of about 50 weight % to about 85 weight %. Various other materials, articles, and methods are also disclosed.

Abstract: A method for producing endless abrasive articles (100) comprises: —providing a mandrel coil (200), which comprises a first complete turn (BOA) formed of an endless mandrel belt (BO), —feeding the endless mandrel belt (BO) to an input end (INO) of the mandrel coil (200) and unwinding the mandrel belt (B0) from an output end (OUT0) of the mandrel coil (200) so as to move the surface of the first complete turn (BOA) of the mandrel coil (200), —forming a laminated sleeve (SLEEVE1) by feeding a first strip (S1) on the moving surface of the first complete turn (BOA) of the mandrel coil (200), and—forming an endless abrasive article (100) by cutting the laminated sleeve (SLEEVE1).

Abstract: A free standing PCD body comprises a PCD material formed of combination of intergrown diamond grains forming a diamond network and an interpenetrating metallic network, the PCD body not being attached to a second body or substrate formed of a different material. The diamond network is formed of diamond grains having a plurality of grain sizes, and comprises a grain size distribution having an average diamond grain size, wherein the largest component of the diamond grain size distribution is no greater than three times the average diamond grain size. The PCD material forming the free standing PCD body is homogeneous, such that the PCD body is spatially constant and invariant with respect to diamond network to metallic network volume ratio. The homogeneity is measured at a scale greater than ten times the average grain size and spans the dimension of the PCD body. The PCD material is also macroscopically residual stress free at said scale.

Abstract: An abrasive article can include an abrasive component including a body. The body can include a bond matrix and abrasive particles contained in the bond matrix. In an embodiment, the body can include an interconnected phase extending through at least a portion of the bond matrix. The body can include a discontinuous phase including a plurality of discrete members. At least one of the discrete member can include a macroscopic pore. In another embodiment, the body can include a porosity of at least 15 vol % for a total volume of the body.

Abstract: The invention concerns thermally insulating materials comprising the aforementioned particles, a process for the preparation of these particles and materials obtained by incorporation of these particles into matrices. The present invention also concerns inorganic spherical and hollow inorganic particles with low apparent density imparting thermal properties to various types of matrices in which they are dispersed.

Abstract: An abrasive article is provided that may include a body. The body may include a bond component and abrasive particles within the bond component. The bond component may include a Fe—Co—Cu—Ni—Sn based bond material and a performance enhancing material. The performance enhancing material may include hex-boron nitride. The content of the performance enhancing material may be at least about 6 vol. % and not greater than about 14 vol. % for a total volume of the bond component.

Abstract: In-line processes for producing scrubby substrates, and related scrubby substrate cleaning articles. The process may include melting a polymer resin material, and extruding or otherwise dispensing the molten polymer resin material through one or more orifices of a heated nozzle, into a stream of hot inert gas, which attenuates the molten resin, so that the resin forms into elongated globules (rather than fibers or filaments). Such globules may have irregular cross-section and/or irregular thickness along a length of the globules. Alternatively, the molten resin may be formed into substantially continuous or discontinuous string or chain pattern of abrasive fibers, exhibiting a high frequency, low amplitude substantially linear pattern on the base substrate. In either case the globules or abrasive fibers are collected onto at least a portion of a base substrate layer to form a scrubby substrate that is more abrasive than typical meltblown materials.

Abstract: Provided is a wearable flexible printed circuit board, in which a conductive circuit pattern is formed on a fiber web formed by accumulating fibers, and thus a base substrate has flexibility, resilience, waterproofness and air-permeability so as to be applied to future-oriented devices, a manufacturing method thereof, and a wearable smart device using the same. The wearable flexible printed circuit board includes: a base substrate made of a fiber web that is formed by accumulating spun fibers made of a fiber-forming polymer material and having a diameter of 3 ?m or less; and a conductive circuit pattern formed on the base substrate.

Abstract: A composite wear pad for being coupled to a slider block of a convergent nozzle of a gas turbine engine includes a high heat capacity composite having a resin and a plurality of carbon fibers bonded together by the resin. The composite wear pad also includes a first rod coupled to the high heat capacity composite at a first axial end of the composite wear pad such that a first end thickness. The composite wear pad also includes a second rod coupled to the high heat capacity composite at a second axial end of the composite wear pad such that the first axial end and the second axial end of the composite wear pad each have an end thickness that is greater than a middle thickness of the composite wear pad.

Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.

Abstract: Polishing pad and method of manufacturing the same, the method, whereby materials for forming a polishing layer are mixed and solidified by a chemical reaction so as to manufacture the polishing pad, the method including: grinding organic materials by using a physical method so as to form micro-organic particles; mixing the micro-organic particles formed in the operation with the materials for forming the polishing layer; mixing at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical foaming agent that are capable of controlling sizes of pores, with the mixture in the operation so as to form gaseous pores; performing gelling and hardening of the mixture generated in the operation so as to form a polishing layer; and processing the polishing layer so as to distribute open pores defined by opening gaseous pores on a surface of the polishing layer.

Abstract: An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.

Abstract: A polycrystalline diamond (PCD) composite compact element 100 comprising a substrate 130, a PCD structure 120 bonded to the substrate 130, and a bond material in the form of a bond layer 140 bonding the PCD structure 120 to the substrate 130; the PCD structure 120 being thermally stable and having a mean Young's modulus of at least about 800 GPa, the PCD structure 120 having an interstitial mean free path of at least about 0.05 microns and at most about 1.5 microns; the standard deviation of the mean free path being at least about 0.05 microns and at most about 1.5 microns. Embodiments of the PCD composite compact element may be for a tool for cutting, milling, grinding, drilling, earth boring, rock drilling or other abrasive applications, such as the cutting and machining of metal.

Abstract: Provided are a method for producing a finish polishing pad and the polishing pad which allow formation of a stable film and enables polishing with fewer polishing scratches. The method comprises the steps of: dissolving a composition for forming polyurethane resin film containing a polyurethane resin and an additive(s) in a solvent capable of dissolving the resin; removing an insoluble component(s) to make the content of the insoluble component(s) in the solution less than 1% by mass relative to the total mass of the composition; adding a poor solvent to the solution from which the insoluble component(s) has(have) been removed, followed by mixing, the amount of the poor solvent added being calculated according to a defined Formula 1; and forming a film from the mixture solution on the film formation substrate by a wet coagulation method, to thereby form the polyurethane resin film.

Abstract: A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a porous polymeric material, wherein the polishing pad comprises closed pores and wherein the polishing pad has a void volume fraction of 70% or more. Also disclosed is a method for preparing the aforesaid polishing pad and a method of polishing a substrate by use of theaforesaid polishing pad.

Abstract: A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.

Abstract: The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad.

Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of (a) providing a releasing carrier; (b) providing a foaming resin composition; (c) coating the foaming resin composition of the step (b) on the carrier of the step (a); and (d) curing the foaming resin composition of the step (c). The invention also provides a process for manufacturing a polishing apparatus.

Abstract: Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material.

Abstract: Polishing pad and method of manufacturing the same, the method including: (a) mixing materials for forming a polishing layer; (b) mixing at least two from among inert gas, a capsule type foaming agent, a chemical foaming agent, and liquid microelements that are capable of controlling sizes of pores, with the mixture in (a) so as to form two or more types of pores; (c) performing gelling and hardening of the mixture generated in (b) so as to form a polishing layer including the two or more types of pores; and (d) processing the polishing layer so as to distribute micropores defined by opening the two or more types of pores on a surface of the polishing layer.

Abstract: A polish pad including a polish region contributing to polishing of a polish object; and a polish layer being disposed in the polish region and including unfoamed segments comprising unfoamed resin and foamed segments comprising resin including independent pores. The unfoamed segments and the foamed segments of the polish layer are made of the same raw resin.

Abstract: Abrasive articles possessing a highly open (porous) structure and uniform abrasive grit distribution are disclosed. The abrasive articles are fabricated using a metal matrix (e.g., fine nickel, tin, bronze and abrasives). The open structure is controlled with a porosity scheme, including interconnected porosity (e.g., formed by leaching of dispersoid), closed porosity (e.g., induced by adding a hollow micro-spheres and/or sacrificial pore-forming additives), and/or intrinsic porosity (e.g., controlled via matrix component selection to provide desired densification). In some cases, manufacturing process temperatures for achieving near full density of metal bond with fillers and abrasives, are below the melting point of the filler used, although sacrificial fillers may be used as well. The resulting abrasive articles are useful in high performance cutting and grinding operations, such as back-grinding silicon, alumina titanium carbide, and silicon carbide wafers to very fine surface finish values.

Abstract: An object of the present invention is to provide a polishing pad which hardly generates scratches on the surface of an object to be polished, and has improved dressability. Another object of the present invention is to provide a method for manufacturing a semiconductor device using the polishing pad. A polishing pad of the present invention includes a polishing layer made of a fine cell-containing polyurethane resin foam, wherein the polyurethane resin foam contains a polyurethane resin having an Asker D hardness of 20 to 60 degrees and an abrasion parameter, which is expressed by the following equation, of 1 to 3.

Abstract: A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.

Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.

Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.

Abstract: Methods of forming a polycrystalline table comprise disposing a plurality of particles comprising a superabrasive material, a substrate comprising a hard material, and a catalyst material in a mold. The plurality of particles is partially sintered in the presence of the catalyst material to form a brown polycrystalline table having a first permeability attached to an end of the substrate. The substrate is removed from the brown polycrystalline table and catalyst material is removed from the brown polycrystalline table. The brown polycrystalline table is then fully sintered to form a polycrystalline table having a reduced, second permeability. Intermediate structures formed during a process of attaching a polycrystalline table to a substrate comprise a substantially fully leached brown polycrystalline table. The substantially fully leached brown polycrystalline table comprises a plurality of interbonded grains of a superabrasive material.

Abstract: Abrasive particles which are shaped abrasive particles each with an opening are described. The shaped abrasive particles are formed from alpha alumina and have a first face and a second face separated by a thickness t. The opening in each of the shaped abrasive particles can improve grinding performance by reducing the size of a resulting wear flat, can provide a reservoir for grinding aid, and can improve adhesion to a backing in a coated abrasive article.

Abstract: Polycrystalline compacts include a hard polycrystalline material comprising first and second regions. The first region comprises a first plurality of grains of hard material having a first average grain size, and a second plurality of grains of hard material having a second average grain size smaller than the first average grain size. The first region comprises catalyst material disposed in interstitial spaces between inter-bonded grains of hard material. Such interstitial spaces between grains of the hard material in the second region are at least substantially free of catalyst material. In some embodiments, the first region comprises a plurality of nanograins of the hard material. Cutting elements and earth-boring tools include such polycrystalline compacts.

Abstract: A hardfacing material includes a metal matrix material and particles of crushed polycrystalline diamond material embedded within the metal matrix material. An earth-boring tool includes a body comprising particles of fragmented polycrystalline diamond material embedded within a metal matrix material. The particles of fragmented polycrystalline diamond material include a plurality of inter-bonded diamond grains. A method includes forming an earth-boring tool including a metal matrix material and particles of crushed polycrystalline diamond material.

Abstract: Provided are: a polishing pad which is capable of alleviating a scratch problem that occurs when a conventional hard (dry) polishing pad is used, and which is excellent in polishing rate and polishing uniformity and is usable not only for primary polishing but also for finish polishing; and a method for producing the polishing pad. The polishing pad is for polishing a semiconductor device and includes a polishing layer having a polyurethane-polyurea resin molded body containing cells of a substantially spherical shape. The polyurethane-polyurea resin molded body has a ratio of closed cells of 60 to 98%. The polyurethane-polyurea resin molded body has a ratio tan ? of a loss modulus E? to a storage modulus E? (loss modulus/storage modulus) of 0.15 to 0.30. The storage modulus E? is 1 to 100 MPa. The polyurethane-polyurea resin molded body has a density D of 0.4 to 0.8 g/cm3.

Abstract: A polyurethane is produced by reacting a mixture including at least (A) a diisocyanate, (B) a polyol, and (C) a chain extender, the polyol (B) having the number average molecular weight of 400 to 5000, the chain extender (C) including (C1) a compound shown by the following general formula (1) and (C2) a compound shown by the following general formula (2), the compound (C1) and the compound (C2) having a number average molecular weight of less than 400, and a ratio “M1/(M1+M2)” calculated by using the number of moles (M1) of the compound (C1) and the number of moles (M2) of the compound (C2) being 0.25 to 0.9.

Abstract: Herein are disclosed an apparatus and method for reaction injection molding of polyurethane foam. In the method, a recirculation loop containing polyols along with an effective amount of water, and a recirculation loop containing isocyanates, are each partially evacuated.

Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed. The vitrified bond includes an oxide of a lanthanoid. Additionally, the vitrified bond component defines pores that can be essentially all less than 800 ?m in diameter. Seventy percent of the pores are in a range of between about 40 ?m and about 500 ?m and have an average aspect ratio less than about 2. The porosity is in a range of between about 50% and about 90% of the total volume of the superabrasive product.

Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed, wherein the vitrified bond component defines pores occupying greater than about 50% of the total volume of the vitrified superabrasive product. The vitrified superabrasive product can be in the form of a grinding tool, such as a grinding wheel. A superabrasive mixture includes a glass powder, a superabrasive grit, a binder and a silicon carbide. The mixture can be in the form of a green body, which is fired under an atmosphere and pressure, and at a temperature sufficient to form a porous vitrified superabrasive product.

Abstract: A method of manufacturing a polycrystalline diamond (PCD) cutting element used as drill bit cutting elements (10) is disclosed. The method comprises leaching a PCD body formed from diamond particles (202) using a binder-catalyzing material so as to remove substantially all of the binder-catalyzing material from portions of a cutting surface of the PCD body. A portion (24) of the cutting surface is identified as a cutting area which, in use of the cutting element to cut material, is heated by the cutting action of the cutting element. Leaching of the PCD body includes performing a relatively deep leach in the portion of the cutting surface identified as the cutting area and performing a relatively shallow leach in at least the portion (26) of the cutting surface surrounding the identified cutting area.

Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains and a porosity of at least about 66 vol %.

Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging from about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a hard segment content (HSC) in a range from 26 to 34%, and has a density D in a range from 0.30 to 0.60 g/cm3, the hard segment content (HSC) being determined by the following formula (1): HSC=100×(r?1)×(Mdi+Mda)÷(Mg+r×Mdi+(r?1)×Mda)??(1).

Abstract: A polishing pad for polishing a semiconductor device and manufacturing method therefor, the polishing pad comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein an M-component of the polyurethane-polyurea resin foam has a spin-spin relaxation time T2 of 160 to 260 ?s, the polyurethane-polyurea resin foam has a storage elastic modulus E? of 1 to 30 MPa, the storage elastic modulus E? being measured at 40° C. with an initial load of 10 g, a strain range of 0.01 to 4%, and a measuring frequency of 0.2 Hz in a tensile mode, and the polyurethane-polyurea resin foam has a density D in a range from 0.30 to 0.60 g/cm3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.

Abstract: It is an object of the invention to provide a tank for use in making high-quality, air void-less, polishing pads, to provide a method for producing a polishing pad using the tank, and to provide a polishing pad obtained by such a production method. A tank for holding a resin composition, the tank comprising two or more body components and joint parts, wherein the two or more body components are joined by the joint parts to form a frame-shaped body, at least one of the joint parts includes an opening and closing member that joins adjacent ones of the body components in such a way that the adjacent body components can swing open, and at least another one of the joint parts includes a joint member that joins adjacent ones of the body components in such a way that the adjacent body components can swing about the joint member.