With Protein Or Reaction Product Thereof Patents (Class 51/301)
-
Publication number: 20150107163Abstract: A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may comprise a plurality of polycrystalline superabrasive particles made of surface functionalized superabrasive particle The surface functionalized superabrasive particles may have halogens or organic moiety instead of hydrogen.Type: ApplicationFiled: October 23, 2013Publication date: April 23, 2015Applicant: Diamond Innovations, Inc.Inventor: Valeriy V. Konovalov
-
Publication number: 20150017454Abstract: Chemical mechanical polishing composition is provided. The composition comprises (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a protein, and (C) an aqueous medium.Type: ApplicationFiled: January 25, 2013Publication date: January 15, 2015Applicant: BASF SEInventors: Yuzhuo Li, Bastian Marten Noller, Michael Lauter, Roland Lange
-
Patent number: 8622154Abstract: Diamond bonded constructions comprise a polycrystalline diamond body having a matrix phase of bonded-together diamond grains and a plurality of interstitial regions between the diamond grains including a catalyst material used to form the diamond body disposed within the interstitial regions. A sintered thermally stable diamond element is disposed within and bonded to the diamond body, and is configured and positioned to form part of a working surface. The thermally stable diamond element is bonded to the polycrystalline diamond body, and a substrate is bonded to the polycrystalline diamond body. The thermally stable diamond element comprises a plurality of bonded-together diamond grains and interstitial regions, wherein the interstitial regions are substantially free of a catalyst material used to make or sinter the thermally stable diamond element. A barrier material may be disposed over or infiltrated into one or more surfaces of the thermally stable diamond element.Type: GrantFiled: February 5, 2013Date of Patent: January 7, 2014Assignee: Smith International, Inc.Inventors: Georgiy Voronin, J. Daniel Belnap, Feng Yu, Benjamin Randall
-
Patent number: 8616936Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor which make use of this abrasive.Type: GrantFiled: March 2, 2012Date of Patent: December 31, 2013Assignee: Hitachi Chemical Company, Ltd.Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno
-
Publication number: 20120167477Abstract: An abrasive article comprising an abrasive particle including a core comprising a compressible material, an intermediate layer comprising a binder material overlying an exterior surface of the core, and an outer layer comprising abrasive grains overlying the intermediate layer.Type: ApplicationFiled: December 29, 2011Publication date: July 5, 2012Applicants: SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC.Inventors: Jianna Wang, Guan Wang, Charles G. Herbert
-
Patent number: 8162725Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.Type: GrantFiled: July 25, 2007Date of Patent: April 24, 2012Assignee: Hitachi Chemical Company, Ltd.Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno
-
Patent number: 8137159Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.Type: GrantFiled: August 25, 2011Date of Patent: March 20, 2012Assignee: Hitachi Chemical Company, Ltd.Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno
-
Publication number: 20120021675Abstract: A polishing slurry comprising a collagen derivative and a colloidal solution is effective for polishing of synthetic quartz glass substrates. It prevents formation of defects having a size that can be detected by a high-sensitivity flaw detector.Type: ApplicationFiled: July 25, 2011Publication date: January 26, 2012Inventors: Harunobu Matsui, Daijitsu Harada, Masaki Takeuchi
-
Publication number: 20080153392Abstract: The disclosure relates to chemical mechanical planarization (CMP) polishing compositions including proline and a fluorochemical surfactant. The wafer polishing composition may be used as a solution substantially free of abrasive particles, the composition of which can be adjusted to control Oxide Removal Rate and oxide over nitride Selectivity Ratio in Shallow Trench Isolation (STI) processing of semiconductor wafers using a fixed abrasive CMP process. In certain embodiments, the disclosure provides a working liquid for fixed abrasive CMP including proline and a fluorochemical surfactant at a pH from 9 to 11. When used in a fixed abrasive CMP system and method for STI, exemplary working liquids may yield an Oxide Removal Rate of at least 500 angstroms per minute, and an oxide over nitride Selectivity Ratio of at least 5.Type: ApplicationFiled: December 20, 2006Publication date: June 26, 2008Inventors: John J. Gagliardi, Patricia M. Savu
-
Patent number: 7077879Abstract: An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or less when a test piece comprising the water-insoluble matrix material is broken at 80° C. according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.Type: GrantFiled: June 16, 2004Date of Patent: July 18, 2006Assignee: JSR CorporationInventors: Toshihiro Ogawa, Kou Hasegawa, Nobuo Kawahashi
-
Patent number: 6679761Abstract: A polishing compound and a polishing method are provided, whereby in a CMP process in a process for production of a semiconductor device, a metal layer and/or a barrier layer, etc., can be polished while suppressing excessive oxidation of the metal layer, and the polishing rate can be adjusted depending upon the application. A polishing compound comprising polishing abrasive grains and a peptide, a polishing compound slurry having such a polishing compound suspended in an aqueous medium, preferably together with an oxidizing agent and preferably at a pH of at least 7, and a method for polishing a metal layer of e.g. Cu and/or a barrier layer, formed on a semiconductor substrate, by polishing with an abrasive cloth of a CMP apparatus having such a polishing compound slurry supported thereon, are disclosed.Type: GrantFiled: May 6, 2002Date of Patent: January 20, 2004Assignee: Seimi Chemical Co., Ltd.Inventors: Kazuo Sunahara, Katsuyuki Tsugita, Sachie Shinmaru
-
Patent number: 6568996Abstract: The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The polishing agent for processing semiconductor comprises a compound having glucose structure, polishing particles and water.Type: GrantFiled: April 19, 2001Date of Patent: May 27, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Toshio Kobayashi, Toshiyuki Toyoshima, Suguru Nagae, Masanobu Iwasaki, Kouichirou Tsutahara, Shin Hasegawa
-
Publication number: 20020039875Abstract: The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The polishing agent for processing semiconductor comprises a compound having glucose structure, polishing particles and water.Type: ApplicationFiled: April 19, 2001Publication date: April 4, 2002Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Toshio Kobayashi, Toshiyuki Toyoshima, Suguru Nagae, Masanobu Iwasaki, Kouichirou Tsutahara, Shin Hasegawa
-
Patent number: 5219463Abstract: This invention provides coated and three-dimensional, low density abrasive articles comprising ammonium aluminum fluoride-based salts which serve as grinding aids.Type: GrantFiled: May 4, 1992Date of Patent: June 15, 1993Assignee: Minnesota Mining and Manufacturing CompanyInventors: David E. Broberg, Carl A. Jackson
-
Patent number: 4715940Abstract: A shadow mask is provided which can provide a precise patterning to a deposit at process temperature without destruction of the shadow mask itself. The shadow mask consists of a plurality of metallic strips having a series of interconnecting small arched bridges that hold the strips of the mask together. The shadow mask is used in a process for depositing electrode structures in an electroluminescent device wherein the mask is positioned over a substrate surface to be coated and deposit electrode material is sprayed from a geometrically broad source, through the mask and onto the substrate. Deposition occurs beneath the arched bridges resulting in a pattern deposition that does not readily reveal the presence of bridges because sufficient material is coated beneath to provide cosmetic and electrical continuity between areas separated by the bridges. This invention is particularly suited for a mask designed to provide a fine pattern of closely spaced parallel lines or electrode structures.Type: GrantFiled: October 23, 1985Date of Patent: December 29, 1987Assignee: GTE Products CorporationInventor: Robert A. Boudreau
-
Patent number: 4222747Abstract: The invention relates to a polishing material of the type containing powdered cerium oxide suspended in water.According to the invention, this polishing material also contains, in combination, a substance for use as a thickener and a substance for reducing the surface tension.The polishing material is particularly useful for polishing ophthalmic lenses made from organic materials.Type: GrantFiled: December 27, 1978Date of Patent: September 16, 1980Assignee: Essilor International, Cie Generale d'OptiqueInventors: Jean-Claude Dauguet, Jean-Pierre Mazzone, Pierre Moreau
-
Patent number: 4163647Abstract: A process for making cloth backing for coated abrasive articles is disclosed wherein a backing material is coated on its front side, with a liquid thermosetting resin, in such a manner that the resin does not permeate the interstices of the cloth. As a result, the cloth retains most of its original pliability when incorporated in the finished coated abrasive article. A back sizing, of for example glue, may also be applied in the same manner to provide a coated abrasive backing material which is both front sized and back sized but which still possesses most of its original pliability.Type: GrantFiled: October 21, 1974Date of Patent: August 7, 1979Assignee: Norton CompanyInventor: Henry J. Swiatek
-
Patent number: 4126428Abstract: In an improved coated abrasive, abrasive granules are bonded to a backing sheet by an isocyanurate resin. Bonding is accomplished by use of a one-part, latent, room-temperature stable isocyanate system trimerizable to polyisocyanurate. The trimerizable system comprises an aromatic isocyanate having dispersed throughout the liquid, mircocapsules containing a catalyst for isocyanurate formation. The microcapsules have a permeable shell wall essentially of partially polymerized aromatic isocyanate which encapsulates the liquid catalyst at room temperature but, on activation of the isocyanate-catalyst by a suitable force, the liquid catalyst permeates the shell wall, mixes with the liquid polyisocyanate, and cures the isocyanate to a fully cured thermoset isocyanurate resin.Type: GrantFiled: August 1, 1977Date of Patent: November 21, 1978Assignee: Minnesota Mining and Manufacturing CompanyInventor: Harold E. Rude
-
Patent number: 4112631Abstract: A capsule containing fine abrasive grains dispersed in a liquid or low melting solid grinding aid can be substituted for conventional abrasive polishing grains. A novel coated abrasive structure is made by bonding such capsules to a backing sheet.Type: GrantFiled: May 29, 1973Date of Patent: September 12, 1978Assignee: Minnesota Mining and Manufacturing CompanyInventor: Robert N. Howard
-
Patent number: 3992178Abstract: A flexible abrasive article carries a layer of particles of electroconductive material on the outer surface of the abrasive side to reduce the buildup of electrostatic charge during use in sanding wood or grinding metal. Metallic and non-metallic electroconductive materials may be employed.Type: GrantFiled: April 9, 1974Date of Patent: November 16, 1976Assignee: Fabrika AB EKAInventors: Erik L. Markoo, Hans S. Ekblom, Torsten Wilhelm Sandell
-
Patent number: 3942959Abstract: The accumulation of electrostatic charges in an abrasive article having a flexible backing sheet, a layer of adhesive and abrasive grains embedded in the adhesive is prevented by incorporating an electroconductive metal pigment or ionizable salt in an inner layer of the article and sandwiching this layer between two layers of substantially lower electroconductance so as to insulate the inner layer.Type: GrantFiled: August 13, 1973Date of Patent: March 9, 1976Assignee: Fabriksaktiebolaget EKAInventors: Eric L. Markoo, Tore G. H. Strand, Thorsten W. Sandell