With Protein Or Reaction Product Thereof Patents (Class 51/301)
  • Publication number: 20150107163
    Abstract: A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may comprise a plurality of polycrystalline superabrasive particles made of surface functionalized superabrasive particle The surface functionalized superabrasive particles may have halogens or organic moiety instead of hydrogen.
    Type: Application
    Filed: October 23, 2013
    Publication date: April 23, 2015
    Applicant: Diamond Innovations, Inc.
    Inventor: Valeriy V. Konovalov
  • Publication number: 20150017454
    Abstract: Chemical mechanical polishing composition is provided. The composition comprises (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a protein, and (C) an aqueous medium.
    Type: Application
    Filed: January 25, 2013
    Publication date: January 15, 2015
    Applicant: BASF SE
    Inventors: Yuzhuo Li, Bastian Marten Noller, Michael Lauter, Roland Lange
  • Patent number: 8622154
    Abstract: Diamond bonded constructions comprise a polycrystalline diamond body having a matrix phase of bonded-together diamond grains and a plurality of interstitial regions between the diamond grains including a catalyst material used to form the diamond body disposed within the interstitial regions. A sintered thermally stable diamond element is disposed within and bonded to the diamond body, and is configured and positioned to form part of a working surface. The thermally stable diamond element is bonded to the polycrystalline diamond body, and a substrate is bonded to the polycrystalline diamond body. The thermally stable diamond element comprises a plurality of bonded-together diamond grains and interstitial regions, wherein the interstitial regions are substantially free of a catalyst material used to make or sinter the thermally stable diamond element. A barrier material may be disposed over or infiltrated into one or more surfaces of the thermally stable diamond element.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: January 7, 2014
    Assignee: Smith International, Inc.
    Inventors: Georgiy Voronin, J. Daniel Belnap, Feng Yu, Benjamin Randall
  • Patent number: 8616936
    Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor which make use of this abrasive.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: December 31, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno
  • Publication number: 20120167477
    Abstract: An abrasive article comprising an abrasive particle including a core comprising a compressible material, an intermediate layer comprising a binder material overlying an exterior surface of the core, and an outer layer comprising abrasive grains overlying the intermediate layer.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 5, 2012
    Applicants: SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC.
    Inventors: Jianna Wang, Guan Wang, Charles G. Herbert
  • Patent number: 8162725
    Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: April 24, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno
  • Patent number: 8137159
    Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: March 20, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yuuto Ootuki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno
  • Publication number: 20120021675
    Abstract: A polishing slurry comprising a collagen derivative and a colloidal solution is effective for polishing of synthetic quartz glass substrates. It prevents formation of defects having a size that can be detected by a high-sensitivity flaw detector.
    Type: Application
    Filed: July 25, 2011
    Publication date: January 26, 2012
    Inventors: Harunobu Matsui, Daijitsu Harada, Masaki Takeuchi
  • Publication number: 20080153392
    Abstract: The disclosure relates to chemical mechanical planarization (CMP) polishing compositions including proline and a fluorochemical surfactant. The wafer polishing composition may be used as a solution substantially free of abrasive particles, the composition of which can be adjusted to control Oxide Removal Rate and oxide over nitride Selectivity Ratio in Shallow Trench Isolation (STI) processing of semiconductor wafers using a fixed abrasive CMP process. In certain embodiments, the disclosure provides a working liquid for fixed abrasive CMP including proline and a fluorochemical surfactant at a pH from 9 to 11. When used in a fixed abrasive CMP system and method for STI, exemplary working liquids may yield an Oxide Removal Rate of at least 500 angstroms per minute, and an oxide over nitride Selectivity Ratio of at least 5.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Inventors: John J. Gagliardi, Patricia M. Savu
  • Patent number: 7077879
    Abstract: An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or less when a test piece comprising the water-insoluble matrix material is broken at 80° C. according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: July 18, 2006
    Assignee: JSR Corporation
    Inventors: Toshihiro Ogawa, Kou Hasegawa, Nobuo Kawahashi
  • Patent number: 6679761
    Abstract: A polishing compound and a polishing method are provided, whereby in a CMP process in a process for production of a semiconductor device, a metal layer and/or a barrier layer, etc., can be polished while suppressing excessive oxidation of the metal layer, and the polishing rate can be adjusted depending upon the application. A polishing compound comprising polishing abrasive grains and a peptide, a polishing compound slurry having such a polishing compound suspended in an aqueous medium, preferably together with an oxidizing agent and preferably at a pH of at least 7, and a method for polishing a metal layer of e.g. Cu and/or a barrier layer, formed on a semiconductor substrate, by polishing with an abrasive cloth of a CMP apparatus having such a polishing compound slurry supported thereon, are disclosed.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: January 20, 2004
    Assignee: Seimi Chemical Co., Ltd.
    Inventors: Kazuo Sunahara, Katsuyuki Tsugita, Sachie Shinmaru
  • Patent number: 6568996
    Abstract: The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The polishing agent for processing semiconductor comprises a compound having glucose structure, polishing particles and water.
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: May 27, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshio Kobayashi, Toshiyuki Toyoshima, Suguru Nagae, Masanobu Iwasaki, Kouichirou Tsutahara, Shin Hasegawa
  • Publication number: 20020039875
    Abstract: The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The polishing agent for processing semiconductor comprises a compound having glucose structure, polishing particles and water.
    Type: Application
    Filed: April 19, 2001
    Publication date: April 4, 2002
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Toshio Kobayashi, Toshiyuki Toyoshima, Suguru Nagae, Masanobu Iwasaki, Kouichirou Tsutahara, Shin Hasegawa
  • Patent number: 5219463
    Abstract: This invention provides coated and three-dimensional, low density abrasive articles comprising ammonium aluminum fluoride-based salts which serve as grinding aids.
    Type: Grant
    Filed: May 4, 1992
    Date of Patent: June 15, 1993
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: David E. Broberg, Carl A. Jackson
  • Patent number: 4715940
    Abstract: A shadow mask is provided which can provide a precise patterning to a deposit at process temperature without destruction of the shadow mask itself. The shadow mask consists of a plurality of metallic strips having a series of interconnecting small arched bridges that hold the strips of the mask together. The shadow mask is used in a process for depositing electrode structures in an electroluminescent device wherein the mask is positioned over a substrate surface to be coated and deposit electrode material is sprayed from a geometrically broad source, through the mask and onto the substrate. Deposition occurs beneath the arched bridges resulting in a pattern deposition that does not readily reveal the presence of bridges because sufficient material is coated beneath to provide cosmetic and electrical continuity between areas separated by the bridges. This invention is particularly suited for a mask designed to provide a fine pattern of closely spaced parallel lines or electrode structures.
    Type: Grant
    Filed: October 23, 1985
    Date of Patent: December 29, 1987
    Assignee: GTE Products Corporation
    Inventor: Robert A. Boudreau
  • Patent number: 4222747
    Abstract: The invention relates to a polishing material of the type containing powdered cerium oxide suspended in water.According to the invention, this polishing material also contains, in combination, a substance for use as a thickener and a substance for reducing the surface tension.The polishing material is particularly useful for polishing ophthalmic lenses made from organic materials.
    Type: Grant
    Filed: December 27, 1978
    Date of Patent: September 16, 1980
    Assignee: Essilor International, Cie Generale d'Optique
    Inventors: Jean-Claude Dauguet, Jean-Pierre Mazzone, Pierre Moreau
  • Patent number: 4163647
    Abstract: A process for making cloth backing for coated abrasive articles is disclosed wherein a backing material is coated on its front side, with a liquid thermosetting resin, in such a manner that the resin does not permeate the interstices of the cloth. As a result, the cloth retains most of its original pliability when incorporated in the finished coated abrasive article. A back sizing, of for example glue, may also be applied in the same manner to provide a coated abrasive backing material which is both front sized and back sized but which still possesses most of its original pliability.
    Type: Grant
    Filed: October 21, 1974
    Date of Patent: August 7, 1979
    Assignee: Norton Company
    Inventor: Henry J. Swiatek
  • Patent number: 4126428
    Abstract: In an improved coated abrasive, abrasive granules are bonded to a backing sheet by an isocyanurate resin. Bonding is accomplished by use of a one-part, latent, room-temperature stable isocyanate system trimerizable to polyisocyanurate. The trimerizable system comprises an aromatic isocyanate having dispersed throughout the liquid, mircocapsules containing a catalyst for isocyanurate formation. The microcapsules have a permeable shell wall essentially of partially polymerized aromatic isocyanate which encapsulates the liquid catalyst at room temperature but, on activation of the isocyanate-catalyst by a suitable force, the liquid catalyst permeates the shell wall, mixes with the liquid polyisocyanate, and cures the isocyanate to a fully cured thermoset isocyanurate resin.
    Type: Grant
    Filed: August 1, 1977
    Date of Patent: November 21, 1978
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Harold E. Rude
  • Patent number: 4112631
    Abstract: A capsule containing fine abrasive grains dispersed in a liquid or low melting solid grinding aid can be substituted for conventional abrasive polishing grains. A novel coated abrasive structure is made by bonding such capsules to a backing sheet.
    Type: Grant
    Filed: May 29, 1973
    Date of Patent: September 12, 1978
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Robert N. Howard
  • Patent number: 3992178
    Abstract: A flexible abrasive article carries a layer of particles of electroconductive material on the outer surface of the abrasive side to reduce the buildup of electrostatic charge during use in sanding wood or grinding metal. Metallic and non-metallic electroconductive materials may be employed.
    Type: Grant
    Filed: April 9, 1974
    Date of Patent: November 16, 1976
    Assignee: Fabrika AB EKA
    Inventors: Erik L. Markoo, Hans S. Ekblom, Torsten Wilhelm Sandell
  • Patent number: 3942959
    Abstract: The accumulation of electrostatic charges in an abrasive article having a flexible backing sheet, a layer of adhesive and abrasive grains embedded in the adhesive is prevented by incorporating an electroconductive metal pigment or ionizable salt in an inner layer of the article and sandwiching this layer between two layers of substantially lower electroconductance so as to insulate the inner layer.
    Type: Grant
    Filed: August 13, 1973
    Date of Patent: March 9, 1976
    Assignee: Fabriksaktiebolaget EKA
    Inventors: Eric L. Markoo, Tore G. H. Strand, Thorsten W. Sandell