Wire Tool Patents (Class 83/307.1)
  • Patent number: 8695472
    Abstract: A machine for cutting structural members is described. The machine has an endless travelling wire and a frame arranged around a structural member to be cut. The travelling wire and frame have longitudinal track with carriages with at least one pulley carrying at least one cutting segment. The longitudinal tracks are adapted to be engaged via motion means in arcuate guide slots.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: April 15, 2014
    Assignee: TS R&D S.R.L.
    Inventor: Francesco Matteucci
  • Patent number: 8465227
    Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: June 18, 2013
    Assignee: Tetra Technologies, Inc.
    Inventor: Galen R. Clark, II
  • Patent number: 8397610
    Abstract: Device (1) for separating a strand (3) of plastic material, which can be moved along a conveying passage (2), into longitudinal portions (3a), having at least one notching device (5) which on all sides of the passage (2) comprises in each case a notching tool (8a to 8d) which can be moved by means of a tool drive (18) in a tool guide (17) between an initial notching position and a notching position, wherein the cutting device (4) comprises two cutting wire holders (24) which are disposed in mutually opposite-lying boundary regions of the passage (2) and which can be moved transversely with respect to the passage (2) by means of a cutting drive (26) in a cutting guide (25), and wherein the notching device (5) with its notching tools (8a to 8d) are disposed its passage (2) the support module (9) which is moveable forwards and backwards [sic].
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: March 19, 2013
    Assignee: Hans Lingl Anlagenbau und Verfahrenstechnik GmbH & Co. KG
    Inventor: Rainer Koch
  • Patent number: 8171833
    Abstract: The present invention is a rail system cheese cutter comprised of an arched cutting surface, rail and cutting arm with a removable cutting wire and tension adjustment component which allows the user to adjust the tension of the wire. The rail has a milled portion where the cutting arm is to be attached to the rail. One end of the cutting arm has a rotational bearing with a slot and opening. The slot is slid around the milled portion of the rail until the rail rests in the opening of the rotational bearing. Once attached, the cutting arm can be pivoted around the rail and moved laterally along the rail allowing the user to uniformly cut or slice a food item without moving it.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: May 8, 2012
    Inventor: John Reed Felton
  • Patent number: 8151674
    Abstract: A layer cutting apparatus includes a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray, and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: April 10, 2012
    Assignee: General Mills Marketing, Inc.
    Inventors: James R. Baeten, Vanessa L. Little, Karalyn A. Littlefield, Mark W. Yungner, Robert A. Zoss, Linda Baggio
  • Patent number: 8141611
    Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: March 27, 2012
    Assignee: HTC Corporation
    Inventors: Yao-Hsiang Lai, Ta-Cheng Liu, Jung-Hung Hung, Yu-Meng Lin, Kuo-Lung Yang
  • Publication number: 20120048088
    Abstract: The present invention concerns a cutting device for rolls of ribbon-like material. The device 1 comprises cutting means active on at least one roll in order to divide this latter in two or more pieces. The cutting means are commutable between a non operative condition, in which they do not act on the roll, and an operative condition, in which they transversally cut the roll. The cutting means comprise a thread-like cutting element which develops transversally to the roll. The cutting thread is mobile along its longitudinal development so as to cut the roll. The cutting means comprise at least one handling member, preferably two pulleys operatively associated to the thread-like cutting element to move this latter along its longitudinal development.
    Type: Application
    Filed: August 25, 2011
    Publication date: March 1, 2012
    Applicant: GAMBINI INTERNATIONAL S.A.
    Inventor: Giovanni Gambini
  • Patent number: 8109693
    Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: February 7, 2012
    Assignee: Tetra Technologies, Inc.
    Inventor: Galen R. Clark, II
  • Patent number: 7922424
    Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: April 12, 2011
    Assignee: Tetra Technologies, Inc.
    Inventor: Galen R. Clark, II
  • Patent number: 7600457
    Abstract: An apparatus and method for producing tissue slides is disclosed. The apparatus includes a holding assembly for manipulating the sample block, a blade assembly for preparing a thin section from the sample block, and a transfer roller mechanism for transferring the thin section to a receiving medium. The apparatus further includes a controller that may track the sample block and thin section. The method includes the steps of first locating a sample embedded within a support medium, which may be paraffin or a similar medium. Next, the embedded sample is oriented in such a way that its working surface is presented. This orientation may entail determining the orientation of the embedded sample with respect to the blade that will produce the largest cross-sectional area. Next, a slice of the sample from said embedded sample is removed and subsequently transferred to a suitable receiving medium, which may include a microscope slide.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: October 13, 2009
    Inventors: John Voneiff, Jay Frederick Gibson
  • Patent number: 7428860
    Abstract: A cheese slicer having a bottom plate on which a block of cheese can be placed, a vertical guide rod mounted on the bottom plate having an external thread on which a slicing arm with a slicing string, and a roundel with an internal thread, which is received on the external thread. The slicer also has a holding arm, which holds the upper part of the block of cheese in position during the slicing operation. The holding arm includes a second roundel, which is coupled to the slicing arm roundel, and which has an internal flush bore such that the holding arm is slidably mounted on the guide rod below the slicing arm roundel and moves vertically. The holding arm prevents tilting of the cheese and the cutting of slices not of uniform thickness.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: September 30, 2008
    Assignee: P.E.J. Danmark AS
    Inventor: Marcus Vagnby
  • Patent number: 6422067
    Abstract: Slurry useful for wire-saw slicing has viscosity adjusted to 400-700 mPa·second at a shear speed of 2/second and of 50-300 mPa·second at a shear speed of 380/second. The viscosity of slurry is measured using a cone and plate type viscometer which can measure viscosity at different shear speeds. Since the slurry sufficiently flows into inner parts of grooves formed in an ingot and consumed for wire-saw slicing due to the viscosity controlled in response to the shear speed, the ingot can be efficiently sliced to wafers or discs.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: July 23, 2002
    Assignees: Super Silicon Crystal Research Institute Corporation, Ohtomo Chemical Industrial Corporation
    Inventors: Hiroshi Oishi, Keiichiro Asakawa, Junichi Matsuzaki, Akio Ashida