Abstract: The present invention relates generally to high visibility garment, and more specifically to high visibility safety garment. Method, apparatus, device and an article of clothing implementing the invention are also disclosed.

Abstract: A multimedia call is completed to a mobile user, who registered to receive a multimedia call at a multimedia terminal using a portable intelligent device. A mobile user record including a physical address of a multimedia terminal and a user address is stored. In response to a multimedia call addressed to the user address, the physical address is determined and call notification information is transmitted to the multimedia terminal at the physical address. The multimedia call is then completed to the multimedia terminal at the physical address.

Abstract: A system and method for circumventing schemes that use duplication detection to detect and block unsolicited e-mail (spam.) An address on a list is assigned to one of m sublists, where m is an integer that is greater than one. A set of m different messages are created. A different message from the set of m different messages is sent to the addresses on each sublist. In this way, spam countermeasures based upon duplicate detection schemes are foiled.

Abstract: An optical ring network architecture including a number (N) of multi-add/drop filters, such as filters formed using symmetrical pairs of frequency routers. Each multi-add/drop filter is coupled to two other multi-add/drop filters using N−2 transmission media, such as optical fibers, to form a ring. The network also includes a number (N) of terminal stations associated with the multi-add/drop filters. A terminal station (p) is coupled with, and receives information from, its associated multi-add/drop filter (p) through a single optical fiber. In addition, the terminal station p is coupled with, and transmits information in a first direction around the ring to, a multi-add/drop filter p+1 through a single optical fiber. Communications from terminal station p to each other terminal station in the first direction are assigned one of N−1 wavelengths such that no two wavelengths on a given optical fiber are associated with communications between terminal stations in the same direction.

Abstract: A system and method for load balancing. A packet is received at a firewall, which implements a rule and refers the packet to a load balancing proxy. The proxy performs a load balancing analysis at the load balancing proxy. Based on the results of the load balancing analysis, the proxy determines a load balancing rule, which is implemented by the firewall. At the end of the session to which the received packet belongs, the load balancing rule is deleted at the firewall.

Abstract: A pseudo proxy server is provided for a host network when the host network experiences periods of congestion. The host network determines whether an arrival rate of data requests exceeds a predetermined threshold. If so, the host network adds an address of a pseudo proxy server to a list of servers aliased to the host network. Thereafter, data requests are routed to the pseudo proxy server on a round robin basis. The pseudo proxy server may be engaged without first loading information content from the host network on the pseudo proxy server.

Abstract: When a network element receives a request for an increase in bandwidth via a resource management (RM) cell, the network element determines the rate that it can support. If the rate that the network element can support is less than the requested rate, rather than simply rejecting the requested rate, the network element overwrites the rate encoded in the appropriate field in the arriving RM cell with a lower rate than requested. If the network element can support the requested rate, the rate encoded in the RM cell is left unchanged and the RM cell is transmitted to the network along the connection.

Abstract: This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated device which modulates the capability of the heat sink to dissipate heat, and method thereof.

Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is converted to an intermetallic layer. A layer of copper intermetallics with hafnium, lanthanum, zirconium or tin, is provided to improve the electromigration resistance and to reduce defect sensitivity. A method is also provided to form a cap atop copper lines, to improve corrosion resistance, which fully covers the surface. Structure and methods are also described to improve the electromigration and corrosion resistance by incorporating carbon atoms in copper interstitial positions.

Abstract: Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates.

Abstract: The present invention relates generally to high density pluggable connector array and process thereof. More particularly, the invention encompasses a structure comprising high density pluggable connector arrays. A process for making such types of high density pluggable connector arrays is also disclosed.

Abstract: Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. Methods for forming tunnels through lamination and etching are employed. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste.

Abstract: A method to repair Aluminum Nitride (AlN) substrates is disclosed wherein a frequency doubled Q-switched Nd:YAG laser is used to remove unwanted metallurgy. The substrate is place in a liquid filled work chamber which acts to prevent metallic species of AlN from forming. The repair site can be sealed with a novel polymer coating to prevent contamination or corrosion. Repairs can be made to buried or surface metallurgy.

Abstract: Multilayer glass ceramic substrate electronic components having enhanced flexibility and strength are prepared using greensheets as a top and/or bottom layer, which greensheets are made from a glass-ceramic greensheet casting composition comprising crystallizable glass, a binder resin and a solvent system, and preferably a plasticizer. The top and/or bottom greensheets have a lower coefficient of thermal expansion (CTE) than the greensheets used to make the internal layers of the MLC and both greensheets are characterized by having, after sintering, a microstructure which is greater than 99% crystalline. A crystalline matrix forming material such as P2O5 is preferably used in the composition. This type structure, in combination with the lower CTE, has been found to provide an MLC having enhanced strength and flexibility.

Abstract: A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.

Abstract: A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Abstract: A process and system for entering and retrieving previously stored data at a client computer in an HTML form accessed from an intra- or internet source. A set of data in a form file is provided in a program storage device accessible by the client computer. The form file further contains information concerning time of creation of the data and a unique identification which distinguishes the form file from other forms. A blank form is then accessed from an intra- or internet source and viewed on the client computer. The form file is then accessed from the program storage device and data from the form file is utilized to complete the blank form and the completed form is transmitted to the intra- or internet source. Each form file may be stored as an HTML source file combined with a set of data for the source file, and the program storage device includes a combined form table containing a list of the form files.

Abstract: The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.