Abstract: A wire processing machine is disclosed having a wire feed unit (14) that draws wire (22) from an endless source (20). A wire processing unit (12) receives the wire from the feed unit for performing a manufacturing operation therewith, the wire being intermittently fed by the feed unit (14). A dereeling unit (18) is provided having a drive mechanism (28,30) in driving engagement with the wire (22) for removing the wire at a constant speed. A tensioning device (42, 46, 74, 76) is provided to maintain a desired tension on the wire (22) during dereeling. A wire marking unit (16) is provided including a wire storage mechanism (110, 114, 138, 140) arranged for storing a selected length of wire so that the marking unit can be positioned close to the machine (10).

Abstract: An applicator (10) for crimping electrical terminals onto conductors is provided with a ram (16) having outer facing surfaces (28, 42, 44, 46) that are unobstructed by the slide (32, 34) coupling the ram to the applicator frame (12). A ram retention device is provided that includes a retention screw (50) extending through the ram (16) and into the slide coupling for engagement with a shoulder (64) to limit movement of the ram (16) and to hold it captive to the frame (12).

Abstract: A perimeter independent precision locating member (22) for a semiconductor chip (10) so that contact sites upon the chip will be reliably positioned relative to connection members (18), such as contacts or leads, so that the chip may be electrically engageable. The locating member (22) is disposed upon the surface of the semiconductor chip (10) at a specific position relative the contact sites within the perimeter (24) of the chip and being closely matable with a complementary portion of a housing that contains the connection members (18). The method of making the perimeter independent precision locating member (22) for a semiconductor chip (10) involves coating the chip with a layer of photocurable material, masking the material in relation to the contact sites so that the portion of the material that will become the locating member (22) is exposed, illuminating the exposed portion of the photocurable material, and stripping from the chip the uncured portion to define the locating member (22).

Abstract: An assembly for connecting inputs and outputs to a printed circuit board subassembly is disclosed. The assembly includes an electrical connector 2 that includes a housing 4 and a plurality of terminals 6 located in openings 28 extending between a mating face 22 and a rear face 24 on the housing 4. Both the terminals 6 and the openings 28 are C-shaped and adjacent terminals and openings are inverted. The terminals have a contact tab portion 12 for forming a separable connection with a mating connector 56 and a termination or weld tab section 14 for attachment to a conductor 8 joining each connector terminal 6 to a printed circuit board 10. The termination tabs 14 are located in a single row to facilitate the attachment of a wire 8 to each terminal 6 by a process such as the use of an ultrasonic bonding applicator 62.

Abstract: A component, for example, a pin header (2), is provided with latches (16) for insertion through holes (20) in a substrate (14) to secure the component (2) to the substrate (14). The latches (16) are formed integrally with the component (2) which is made of a stiffly resilient plastics material. Each latch (16) has a pair of latching legs (18) each including a flexing member (22) connected to a mounting surface (10) of the housing (6) and a barb (24) presenting a lip (26) which is substantially parallel with the mounting surface (10). As each latch (16) is inserted through the hole (20) in the substrate (14), the barbs (24) are cammed into crossed relationship. When the lips (20) have cleared the lower surface (40) of the substrate (14) the latching legs (18) resile so that the lips (26) snap into engagement beneath the lower surface (40) of the substrate (14).

Abstract: An electrical connector (2) comprises an insulating housing (4) supporting a row of electrical terminals (6). Each terminal (6) has a mating portion (18) and solder tail (20). The solder tail (20) constructed as a spring leg consists of a first portion (22) for engaging against an internal wall of a hole (H) in a circuit board (PCB) and a second portion (24) for engaging against the bottom edge of the hole (H). The first and second portions (22, 24) of each solder tail (20) are obtusely angled with respect to each other and are connected by a bight (23). The solder tail (20) can be inserted through the hole (H) and the housing (4) rotated on the board PCB so that the solder tail is elastically deformed about the bight (23) and is thereby stressed between the internal wall of the hole (H) and the bottom corner of the hole (H).

Abstract: A header receptacle (10) which is protected against moisture and both conducted and radiated electromagnetic interferences. A flange (12) has a cured in place first sealant (20) disposed on the back side (14) of the flange wherein the first sealant (20) covers an opening in the center portion (16) of the flange (12). A metal shield (21) covers the first sealant (20) and is in electrical contact with the flange (12) by a conducting adhesive (18) which also adheres the metal shield (21) to the flange (12). An electromagnetic filter (26) is mounted adjacent to the metal shield (21). A plurality of spaced-apart male terminals (25) pass through the filter (26), the metal shield (21) and the first sealant (20). Each male terminal (25) is joined to the filter (26) to prevent exit/entry of electromagnetic interferences. A housing (30) is disposed on the center portion (16) on the front side (13) of the flange (12). The housing (30) contacts the first sealant (20) and forms a waterproof seal therebetween.

Abstract: An integrated circuit chip module assembly (10) is disclosed that electrically interconnects the bond pads of the various integrated circuit chips (20) in the module to circuitry (42) on a thin film multilayer membrane (22). The module assembly includes a heat sink (16) with the back surfaces of the chips (20) in thermal engagement therewith. Contacts (40) of the bond pads of the chips (20) are in electrical engagement with the circuitry (42) on the membrane (22) and are accurately positioned by means of nests (28) formed on the surface of the membrane (22). A contact pressure equalizer (12) engages only selected areas (98) of the membrane (22) opposite the contacts (40) of the chips (20) to urge the contact surfaces (44) on the membrane (22) into electrical engagement with raised contacts (40). The contact pressure equalizer (12) includes a relatively large pressure plate (70) having a layer (74) of relatively soft rubber thereon.

Abstract: An electrical connector (10) having a housing (12) of resilient plastic material of a type molded in a closed mold with bores defined by core pins; the housing including at least a bore (22) extending therealong leading from an insertion segment (36) of a given diameter to receive a contact (12) to a reduced diameter defining a support segment (28) supporting the contact in the housing, and a forward segment (25), with the various segments extending along a common axis (A) and with a beveled transition defined by surfaces (34) extending between the bore of the insertion segment and the bore of the support segment as defined by a series of recesses (30) and segments (32) arranged around the support segment periphery to define a lead-in for the said contact and maintain an approximate constant thickness of material to minimize plastic sinking and distortion.

Abstract: An optical connector (2) includes housing halves (4A) and (4B) having Y-shaped contours (6A, 6B, 8A, 8B) in the abutting faces of the housing halves (4A, 4B). A Y-shaped member (30) is inserted into the housing halves and sandwiched between the two housing halves. An optically transparent gel (20) is inserted into the housing adjacent to the end faces of the Y-piece, such that upon insertion of the optical fibers into the openings created by the Y-shaped contours, the unfinished fiber ends are in optical connection with the gel (20) and split into separate signals.

Abstract: A contact (10) has an intermediate body portion (11) provided with respective side edges (14, 15) formed with a protruding convex portion (16) and a recessed concave portion (17), respectively. The contacts (10) are slidably inserted into respective channels (22) in the insulated housing (21) of an electrical connector (20), the channels (22) being separated by respective walls (23). When the contacts (10) are thus inserted into the channels (22), the convex portion (16) of one contact (10) cooperates with the concave portion (17) of an adjacent contact (10) to trap and deform the wall (23) therebetween, thereby exerting a resilient biasing force for retaining each contact (10) in its respective channel (22).

Abstract: A method of manufacturing a guide plate for use in a chip carrier socket or other electrical connector provides the precision required for close-center line spacing while minimizing the cost associated with production. A block of ceramic or the like is ground to the precise outside dimensions required. Grooves are then cut in the block of ceramic, and the ceramic is then sliced into respective guide plates. The guide plates are inserted into openings provided in the electrical connector an retained therein. The grooves are dimensioned to cooperate with contact pins of the electrical connector to precisely maintain the pins in position, whereby when a chip is positioned in the electrical connector, the pins will be in position to make an electrical connection with the pads of the chip.

Abstract: An electrical connector (2) has a dielectric housing with contact terminals (22) which extend therethrough. The contact terminals (22) are provided to electrically connect a mother board (4) to a daughter card (6). A board-receiving opening (20) is provided in the housing for reception of the daughter card (6) therein. Proximate to the board-receiving opening (20) are latch receiving openings (24) which are dimensioned to receive insertable latch members (40) therein. The latch members (40) are manufactured from material having the desired resilient and strength characteristics, thereby insuring that the latch members (40) will be effective over many cycles. Each latch member (40) has a resilient section (42) for cooperating with the daughter card (6) and a mounting section (44) for cooperating with the mother board (4). The resilient section (42) is able to accommodate a range of board sizes without taking a permanent set.

Abstract: A connector housing includes a pair of latch arms along sides thereof which extend forwardly to latch with corresponding latching means of a housing of a mating connector. Each latch arm is joined integrally to the housing sides by flexible hinge joints which allow the deflection of the latch arm during mating and unmating. The hinge joints include midsections which have enlarged ends extending therefrom. Radiused sections are provided on the enlarged ends, the radiused sections are configured to properly distribute the stresses associated with the latch arms, such that as forces are applied to the latch arms concentration of stresses will be avoided on the hinge joints.

Abstract: A connector for electrically connecting circuit members having a high density of contact pads located in an area array, the connector having an area array specific holder that is simple to produce for retainably positioning mass-produced standardized contact modules containing a deformable contact within a module body for interconnecting the contact pads, where the contact is constructed to be supportingly engaged by the module body to provide sufficient opposing spring force to effect a wiping interconnection between the contact and the contact pads.

Abstract: An anchor pin, for anchoring one component upon another, such as an electrical connector upon a printed circuit board, by way of a passage defined by a mounting hole in one of the components that is substantially aligned with an opening in the other component. The anchor pin having a first form with a volume larger than the volume defined by the passage while being receivable within the passage and a second form in response to an external energy input, whereby the anchor pin within the passage becomes fluid deforming to substantially fill the passage, automatically accommodating any misalignment, and overflowing therefrom to form opposing heads. The mounting pin hardens in this form to anchor the components together.

Abstract: An edge connector (1) having metal latching devices (5) to latch and unlatch a circuit board (4) is disclosed. More particularly the latching devices (5) include a latching section (53) for latching the board (4) and an unlatching section (54) for releasing the board (4).

Abstract: The present invention is a socket for removably connecting electrical conductors directly to the bond pads of an integrated circuit chip, and includes a chip holder that locks into the socket for burn-in and other testing and then can be removed and easily handled by automated equipment in the further processing of the chip. The socket has a series of contacts that are guided into electrical engagement with the bond pads through precisely positioned openings in a ceramic plate. The ceramic plate and the chip holder are aligned by a pair of guide pins that project from a housing. A pair of latching members secure the chip holder to the housing during burn-in and testing.

Abstract: A protective sleeve (100) for a pair of cantilevered spring contacts (15, 16) is formed by a blanking, forming and bending process (rather than a deep-drawn process) thereby providing a superior product at less cost. During the blanking process, a hole (104) is pierced within a transverse end wall (103) formed between respective first and second sleeve portions (101, 102). These sleeve portions (101, 102) are bent into semi-cylindrical shapes and are then bent towards each other and at right angles to the wall (103) to form the cylindrical sleeve (100). The hole (104) is sized to accommodate a given pin (20) but prevents an oversized pin (20') from being inserted therethrough, thereby preventing inadvertent damage to the contacts (15, 16) or to the sleeve (100).

Abstract: The shut height of a crimping die set (9) for crimping an electrical terminal (T) on an anvil (22) to a lead (L) is adjustable stepwise by means of a disc (60) which can be driven by a servo motor (M1) to a plurality of angular positions each setting a theoretical ideal shut height for a particular combination of lead and terminal sizes. Since anvil wear, in particular, and/or minor variations in lead and terminal dimensions can falsify the ideal crimp height set, the actual crimp height achieved, is measured electronically or mechanically, and the height of the anvil (22) is automatically adjusted in accordance with such measurement, by means of a further servo motor (M2) to adjust the shut height of the die set (9) and anvil (22), so that the ideal shut height is achieved.