Patents Represented by Attorney Daniel K. Nichols
  • Patent number: 5079674
    Abstract: An electrode (34) for use in supercapacitors is provided, comprising a sheet of a first active electrode (30) comprising metal oxides, chlorides, bromides, sulfates, nitrates, sulfides, hydrides, nitrides, phsophides, or selenides (22) coated onto porous carbon particles (20). The coated carbon particles are bound together in a matrix (24) of a fluorocarbon resin. The first electrode (30) is laminated to a dielectric separator (32), and a second active electrode (30) similar in composition to the first is laminated to the other side of the dielectric separator (32).
    Type: Grant
    Filed: December 24, 1990
    Date of Patent: January 7, 1992
    Assignee: Motorola, Inc.
    Inventor: Francis P. Malaspina
  • Patent number: 5075644
    Abstract: Briefly, according to the invention, a voltage controlled oscillator 200 having a control input, an information signal input, and an output is disclosed. The voltage controlled oscillator 200 comprises a tank circuit 202 for generating a carrier signal and a modulator 206 for modulating the carrier signal in response to the information signal 210 at the information signal input of the voltage controlled oscillator 200. The voltage controlled oscillator 200 includes a filter 208 coupling the modulator 206 to the tank circuit 202 for rejecting out of band signals from altering the bias point of the modulator 206.
    Type: Grant
    Filed: December 3, 1990
    Date of Patent: December 24, 1991
    Assignee: Motorola, Inc.
    Inventor: Clarke J. Calvin
  • Patent number: 5075820
    Abstract: A circuit component 100 or (200) comprising typically of a hollow body 101 (201) and a plurality of solderable terminations (102 and 103 (202 and 203) is being disclosed. Internal to said circuit component 100 (200) is a plurality of electrodes 104 and 106 (204 and 206). A filling point 108 (208) is provided so as to fill the volume of said circiut component (100 (200 ) with a specific compound 114 (214) having a desired electrical characteristics including dielectric constant. A method for manufacturing said circuit component 100 (200) is disclosed.
    Type: Grant
    Filed: August 6, 1990
    Date of Patent: December 24, 1991
    Assignee: Motorola, Inc.
    Inventors: Frank J. Juskey, Anthony J. Suppelsa, Anthony B. Suppelsa
  • Patent number: 5075643
    Abstract: An improved frequency modulation apparatus (100) is provided comprising a generator (102), a biasing voltage line (116), and an interface circuit (110). The generator (102) is utilized to generate a carrier signal. A control line input (104) on the generator (102) adjusts the frequency of the carrier signal. The biasing voltage line (116) provides DC power in order to DC bias the generator (102). The interface circuit (110) couples an information signal (114) to the biasing voltage line (116) for altering the biasing of the generator (102) in response to the information signal (114). The alteration of the biasing of the generator (102) results in the carrier signal being frequency modulated by the information signal (114).
    Type: Grant
    Filed: December 24, 1990
    Date of Patent: December 24, 1991
    Assignee: Motorola, Inc.
    Inventor: Stephen B. Einbinder
  • Patent number: 5070521
    Abstract: Calls made to a communication unit from the telephone network include a code which can be appended as a predetermined prefix or suffix to the units address code, for alerting the operator that the call was made from the telephone network. Conversely, calls made to the communication unit from another communication unit do not include the code thereby alerting the operator that the call was made from a communication unit. The alert can be accomplished by using visual indicators or and alphanumeric display and/or can be accomplished by use of two distinct audible signal.
    Type: Grant
    Filed: January 11, 1991
    Date of Patent: December 3, 1991
    Assignee: Motorola, Inc.
    Inventors: Shawn A. Warner, Thomas R. Moder
  • Patent number: 5064481
    Abstract: Fluxing compositions are described containing as fluxing agents compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water or formic acid. Very little or no undesired residue remains. Such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.
    Type: Grant
    Filed: May 17, 1990
    Date of Patent: November 12, 1991
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Bobby D. Landreth
  • Patent number: 5065122
    Abstract: A multilayer substrate having an integral transmission line structure 300 is disclosed. The transmission line structure 300 is formed by metallizing a fluroplastic substrate on the inner surface 112 and outer surface 114 in order to form a transmission line. The metallized inner surface forms a conductive runner 106, while the outer metallized surface 114 forms a ground plane, with the fluroplastic substrate being the dielectric. The transmission line structure 300 is then encapsulated by two substrate layers (402, 404).
    Type: Grant
    Filed: September 4, 1990
    Date of Patent: November 12, 1991
    Assignee: Motorola, Inc.
    Inventors: Frank J. Juskey, Anthony B. Suppelsa, Jill L. Flaugher
  • Patent number: 5063357
    Abstract: A high stability oscillator circuit 100 having an output 150 and a multiple of reference oscillators 102, 104, and 106 for enhanced stability and reliability is disclosed. The output signals of these oscillators 108, 110, and 112 are mixed and analyzed for determination of excessive frequency shift including component failure. Additionally a switch 148 decouples the shifted oscillator signal from the output of the circuit 150 and couples another one of the oscillators in its place.
    Type: Grant
    Filed: August 3, 1990
    Date of Patent: November 5, 1991
    Assignee: Motorola, Inc.
    Inventors: William R. Williams, Edgar H. Callaway, Jr.
  • Patent number: 5058172
    Abstract: A cable assembly 100 capable of electromagnetic interference suppression a cable strain includes relief 106, a tubular electromagnetic interference suppressor 110 located within the strain relief 106, both of which are disposed around electrical cable 102. The electromagnetic interference suppressor 110 attenuates any electromagnetic interference ("EMI") which might get coupled to electrical cable 102. By attenuating the EMI coupled to electrical cable 102 the problems associated with the electromagnetic interference can be minimized.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: October 15, 1991
    Assignee: Motorola, Inc.
    Inventors: Bruce W. Ross, John C. Dzung, Harold J. Sanderson
  • Patent number: 5046415
    Abstract: A composite stencil for screen printing solder paste includes a layer of metalic material such as brass and a layer of flexible material bonded to the metalic layer. The metalic layer has a thickness of 0.002 to 0.010 inches, while the flexible layer is 0.002 to 0.010 inches thick. The combined thickness of the composite stencil is approximately 0.008 to 0.012 inches. The stencil can be manufactured by forming openings in the metalic sheet and then applying a layer of photosensitive flexible material to the metalic sheet. The metalic sheet is then used as a stencil to expose the photosensitive material.
    Type: Grant
    Filed: February 4, 1991
    Date of Patent: September 10, 1991
    Assignee: Motorola, Inc.
    Inventor: William L. Oates
  • Patent number: 5045128
    Abstract: Fluxing compositions containing compounds that generate acids upon photoinitiation from a light source such as Hg/Xe ultraviolet (UV) light sources are described. The acids clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water. The compounds that release an oxide removing agent, sometimes called a "photoacid" include metal and organic onium salts and furyl compounds bearing a carbonyl group. Such fluxing compositions can be used mixed with typical solder formulations, such as lead/tin solders, or applied topically thereto; both techniques permit the assembly of PCBs more easily and with high quality bonds.
    Type: Grant
    Filed: August 13, 1990
    Date of Patent: September 3, 1991
    Assignee: Motorola, Inc.
    Inventors: Bobby D. Landreth, Robert W. Pennisi, James L. Davis, Fadia Nounou
  • Patent number: 5040189
    Abstract: The pulse communication system includes a plurality of pulse repeaters 10 for receiving and transmitting pulse signals. Each of the pulse repeaters include a frequency controller 22 for selecting one of a sequence of transmit and receive frequencies. The frequency controller 22 causes the transmit and receive frequency to change after the reception of each pulse in order to receive and transmit the next pulse on another frequency.
    Type: Grant
    Filed: August 15, 1988
    Date of Patent: August 13, 1991
    Assignee: Motorola, Inc.
    Inventor: William V. Braun
  • Patent number: 5039965
    Abstract: A multilayer circuit board (200) providing a feedthrough filter having metallized via (234) having input and output ports (232, 226) which are coupled to metallized areas (206, 214). Each of the metallized areas (206, 214) being opposed by ground planes (202, 210, and 218) which are separated from the metallized areas (206, 214) by dielectric layers (204, 208, 212, and 216) forming a reactive coupling between the metallized areas (206, 214) and the ground planes (202, 210, and 218). The multilayer circuit board as employed in the present invention, may be advantageously utilized in a variety of applications where multilayer circuit boards require attenuation of unwanted RF signals.
    Type: Grant
    Filed: August 24, 1990
    Date of Patent: August 13, 1991
    Assignee: Motorola, Inc.
    Inventor: Robert J. Higgins, Jr.
  • Patent number: 5031027
    Abstract: A flexible substrate (100) carries circuitry (102) in one area of the substrate and other portions of the substrate are at least partially covered with conductive material (206) to provide a ground plane. The substrate is folded about the circuitry to form an enclosure shielding the circuit.
    Type: Grant
    Filed: July 13, 1990
    Date of Patent: July 9, 1991
    Assignee: Motorola, Inc.
    Inventors: Dale W. Dorinski, Barry M. Miles, David E. Reiff
  • Patent number: 5028306
    Abstract: A ceramic article is treated to increase the adhesion of metals to the ceramic article by placing the ceramic article under at least a partial vacuum. A thin film of metal is then deposited on the ceramic article by sputtering or evaporating. The metallized ceramic article is further bombarded by high energy ions, resulting in the formation of a metal-ceramic compound that renders the article more receptive to further metal deposition.
    Type: Grant
    Filed: September 4, 1990
    Date of Patent: July 2, 1991
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Ernest G. Garza
  • Patent number: 5024372
    Abstract: A method of forming solder bumps includes the steps of applying a thick layer of solder resist to a substrate. The resist is selectively removed to provide wells at solder pads on the substrate. The solder paste is applied to the substrate in the wells. The solder paste is reflowed to form solder bumps on the pads. A socket for a solder bumped member is obtained by first providing a substrate having metalized pads corresponding to the solder bumps of the member. A thick layer of photo definable solder resist is applied to the substrate. The resist is selectively removed to provide wells at the metalized pads of the substrate. Solder paste is then deposited in the wells. The solder bumped member can then be positioned so that the solder bumps are located in the wells. The solder paste is reflowed to bond to the solder bumps and the metalized pads. The solder paste can be selected to have a lower melting temperature than the solder bumps.
    Type: Grant
    Filed: May 9, 1990
    Date of Patent: June 18, 1991
    Assignee: Motorola, Inc.
    Inventors: Leonard F. Altman, Jill L. Flaugher, Anthony B. Suppelsa, William B. Mullen, III
  • Patent number: 5020107
    Abstract: Various functions (or portions thereof) are associated with some of the words or instructions recognizable by a speaker independent voice recognition device (128). This association is presented to an operator via one or more menus (200a-200d) so that the operator may select any of several functions by use of a limited set of speaker independent commands.
    Type: Grant
    Filed: December 4, 1989
    Date of Patent: May 28, 1991
    Assignee: Motorola, Inc.
    Inventors: Kaymar Rohani, R. Mark Harrison
  • Patent number: 5011066
    Abstract: A soldered electrical interconnection is made between a device and a circuit carrying substrate. A device (200) is formed with two solderable surfaces, the second solderable surface (204) adjacent to, but not touching, the first solderable surface (202). A sphere of solder (206) is placed upon a solderable surface (202) of the device and reflowed. The component and solder sphere assembly is placed on a circuit carrying substrate (210) and reflowed, such that the solder sphere reflows and is wetted to both solderable surfaces on the device.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: April 30, 1991
    Assignee: Motorola, Inc.
    Inventor: Kenneth R. Thompson
  • Patent number: 5006073
    Abstract: A snap fit contact (30) is provided for attachment to a housing (40) wall. The contact (30) includes a contact surface (31) having a peripheral depending wall (32). Snap features (34) are formed in the wall. A flange or lip (35) is carried by the wall for attachment to a flex circuit (41). The contact is received in an opening (44) in the housing. The opening includes a shoulder (47) with the snap feature engaging the shoulder.
    Type: Grant
    Filed: May 15, 1990
    Date of Patent: April 9, 1991
    Assignee: Motorola, Inc.
    Inventor: Vincent J. Mennona, Jr.
  • Patent number: 5001038
    Abstract: Printed circuit patterns are photolithographically defined on a three dimensional "projection" surface (204) of a printed circuit substrate (202) using a projection image aligner and a photomask (210) having a planar image (210A). The geometry of the projection is restricted such that the slope of the projection surface, as measured at any point on the projection surface and relative to a reference plane which is parallel to the focal plane of the projection image aligner, is less than 90 degrees. A solution of photoresist includes a photoresist solvent, a fluorosurfactant and an aromatic hydrocarbon solvent, and is preferably sprayed over the projection surface. In one method of manufacture, the printed circuit substrate is moved from one position to another during the exposure of the photoresist layer (206). In another method, after a first portion of the projection surface is exposed by a first photomask (502), a second photomask (504) is substituted and the remainder of the projection surface exposed.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: March 19, 1991
    Assignee: Motorola, Inc.
    Inventors: Dale W. Dorinski, M. William Branan, Jr., Glenn F. Urbish, Anthony B. Suppelsa, Martin J. McKinley, Douglas W. Hendricks