Abstract: A process and apparatus for cleaning filters prior to recycling or disposal. In this process and apparatus liquid or supercritical carbon dioxide contacts the plugged pores of a filter under conditions in which carbon dioxide remains in the liquid or supercritical state.

Abstract: A system includes first and second virtual machines (VM) representing a master and a client respectively. A class file is loading by the first virtual machine into shared memory. The class file includes sharable and non-sharable data, and also references sharable and non-sharable data (including code). When it is desired to load the same class into the second virtual machine, the class is first located within said shared memory. A mirror copy of the class is then formed within private memory in the second virtual machine. Finally the non-sharable data of the class is completed in the private memory. Thereafter, an application in the second virtual machine can utilise the class on the basis of the sharable data in the shared memory of the first virtual machine, and the non-sharable data from the private memory of the second virtual machine.

Abstract: A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.

Abstract: The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.

Abstract: A microjoint interconnect structure comprising a dense array of metallic studs of precisely controllable height tipped with a joining metallurgy. The array is produced on a device chip that is to be attached to a carrier, or to a carrier along with other devices, some of which may be selected to have similar interconnect structures so as to form all together an assembled carrier that functions as a complete computing, communications or networking system.

Abstract: An attenuating embedded phase shift photomask blank that produces a phase shift of the transmitted light is formed with an optically translucent film made of metal, silicon, nitrogen and oxygen. An etch stop layer is added to improve the etch selectivity of the phase shifting layer. A wide range of optical transmission (0.001% up to 15% at 157 nm) is obtained by this process.

Abstract: The invention modifies and converts neutral dye molecules (D) to ionic salts (D-A+ X− or DA− X+), and employs them as emitting or charge transport layers in organic light emitting diodes (OLED's). This is achieved by attaching ionizable substituents (A) on the dye molecule during initial synthesis, and then reacting it with an appropriate agent that contains charge balancing ions (X). These ionic compounds can be deposited as amorphous films using conventional evaporation techniques. In addition, they are thermally stable to crystallization. OLED devices incorporating such dye salts for emitting layers exhibit superior efficiencies and durability compared with devices using neutral dye molecules.

Abstract: An interlayer dielectric for preventing Cu ion migration in semiconductor structure containing a Cu region is provided. The interlayer dielectric of the present invention comprises a dielectric material that has a dielectric constant of 3.0 or less and an additive which is highly-capable of binding Cu ions, yet is soluble in the dielectric material. The presence of the additive in the low k dielectric allows for the elimination of conventional inorganic barrier materials such as SiO2 or Si3N4.

Abstract: A distributed Java virtual machine method and system for managing distributed heterogeneous network nodes to timely and efficiently meet demand for service requests. Upon receipt of a request for service, Java workload manager (JWLM) of the present invention classifies the request into a particular type of service, places the work on a logical queue to be executed. Routing queues place the work on one of many available nodes. The work is distributed to the nodes based on accounting, availability and past performance of all nodes considered. Changes are made periodically to the system to meet demands for service and/or conserve resources. JWLM of the present invention learns the needs of programs over time and does not require the intervention of a system administrator. The system does not rely on system specific metrics. JWLM may use performance metrics.

Abstract: The present invention provides a method for automatically determining trackers along a contour of a particular object in a displayed image and a storage medium storing a program for implementing the method. This method comprises the steps of: establishing an initial region containing the particular object therein and setting a plurality of initial points on a boundary of the initial region; setting a target point for scanning the image from each of the plurality of initial points toward an inside of the initial region; selecting one or more tracker candidate points along a line segment between each of the plurality of initial points and the target point, in accordance with magnitude of the contour; and determining a set of tracker candidate points which minimizes a cost, by using dynamic programming, starting from a selected initial point among the plurality of initial points.

Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

Abstract: A spin-on cap useful as a post-CMP cap for Cu interconnect structures is provided. The inventive spin-on cap includes a low-k dielectric (on the order of 3.5 or less) and at least one additive. The at least one additive employed in the present invention is capable of binding Cu ions, and is soluble in the spun-on low-k dielectric. The spin-on cap of the present invention may further include a spun-on low-k (on the order of 3.5 or less) reactive-ion etch (RIE) stop layer. Spin-on caps containing a bilayer of low-dielectric plus at least additive and low-k RIE stop layer are preferred. It is noted that the inventive spin-on cap of the present invention does not significantly increase the effective dielectric constant of the interconnect structure and does not add additional cost to the fabrication of the interconnect structure since a single deposition tool, i.e., spin coating tool, is employed. Moreover, because of the presence of the additive in the spin-on cap, Cu migration is substantially minimized.

Abstract: A low-k dielectric metal conductor interconnect structure having no micro-trenches present therein and a method of forming such a structure are provided. Specifically, the above structure is achieved by providing an interconnect structure which includes at least a multilayer of dielectric materials which are applied sequentially in a single spin apply tool and then cured in a single step and a plurality of patterned metal conductors within the multilayer of spun-on dielectrics. The control over the conductor resistance is obtained using a buried etch stop layer having a second atomic composition located between the line and via dielectric layers of porous low-k dielectrics having a first atomic composition. The inventive interconnect structure also includes a hard mask which assists in forming the interconnect structure of the dual damascene-type.

Abstract: There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.

Abstract: An interconnect structure including a patterned multilayer of spun-on dielectrics as well as methods for manufacturing the same are provided. The interconnect structure includes a patterned multilayer of spun-on dielectrics formed on a surface of a substrate. The patterned multilayer of spun-on dielectrics is composed of a bottom low-k dielectric, a buried etch stop layer, and a top low-k dielectric, wherein the bottom and top low-k dielectrics have a first composition, the said buried etch stop layer has a second composition which is different from the first composition and the buried etch stop layer is covalently bonded to said top and bottom low-k dielectrics. The interconnect structure further includes a polish stop layer formed on the patterned multilayer of spun-on dielectrics; and metal conductive regions formed within the patterned multilayer of spun-on dielectrics.

Abstract: This invention involves tracking and backing all the information that a user generates on its computer devices (including embedded devices) in real time. The local user server records all user actions and gestures (via various means that include TV cameras). All of this information (user actions and saved files in a computer) is then sent to a remote server via the Internet. This remote server has a virtual map of all the embedded devices on a computer that the person uses. The remote server immediately starts to interpret the user's actions (including user gestures). In one implementation, the invention stores user actions that are related to data generation (e.g. actions that called some links where data is stored, or executed some programs that generated data). In another variant, the remote server generates and downloads the same files that are downloaded on the local user computer devices.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: A customer self service system and method for performing resource search and selection.

Abstract: A matrix addressed display system designed so as to enable data line repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line repair utilizes additional data driver outputs, a defect map memory in the TFT/LCD module and modification of the data stream to the data drivers by additional circuits between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.

Abstract: In a virtual machine environment, the invention enables creation of a long running, reusable, virtual machine are disclosed. The environment includes a shared heap where requisite runtime code to bring the virtual machine into a ‘ready’ mode are loaded, linked, verified, initialized and compiled. Subsequent virtual machines are started and jointly use the shared heap. Applications create their objects in ‘private heaps’ that are exclusively reserved for the respective applications. At the end of execution of an application, each private heap is reinitialized. Static initializers are run in a persistent area of each private heap. This persistent area is reset to its initial values in between execution of applications. This obviates the need to terminate the virtual machine.