Patents Represented by Attorney, Agent or Law Firm Daniel P. Morris
  • Patent number: 6693651
    Abstract: A graphical user interface for a customer self service system that performs resource search and selection including a system and method for controlling a display of resources resulting from a query initiated by a user of the system.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: February 17, 2004
    Assignee: International Business Machines Corporation
    Inventors: Debra L. Biebesheimer, Donn P. Jasura, Neal M. Keller, Daniel A. Oblinger, Mark E. Podlaseck, Stephen J. Rolando
  • Patent number: 6689540
    Abstract: Compositions comprising a polymer having silicon, germanium and/or tin; and a protecting group grafted onto a polymeric backbone are useful as resists and are sensitive to imaging irradiation while exhibiting enhanced resistance to reactive ion etching.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: February 10, 2004
    Assignee: International Business Machines Corporation
    Inventors: Ari Aviram, C. Richard Guarnieri, Wu-Song Huang, Ranee W. Kwong, David R. Medeiros
  • Patent number: 6686124
    Abstract: A multifunctional polymer comprising a polymeric chain having chromophore groups and cross-linking sites is suitable as a resist material and especially as the underlayer for bilayer and top surface imaging strategies. The multifunctional polymer can function as an antireflective coating, planarizing layer or etch resistant hard mask.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: February 3, 2004
    Assignee: International Business Machines Corporation
    Inventors: Marie Angelopoulos, Katherina E. Babich, David R. Medeiros, Wayne M. Moreau
  • Patent number: 6687383
    Abstract: A system and method for encoding sound information in image sub-feature sets comprising pixels in a picture or video image. Small differences in intensity of pixels in this image set are not detectable by eyes, but are detectable by scanning devices that measure these intensity differences between closely situated pixels in the sub-feature sets. These encoded numbers are mapped into sound representations allowing for the reproduction of sound.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: February 3, 2004
    Assignee: International Business Machines Corporation
    Inventors: Dimitri Kanevsky, Stephane Maes, Clifford A. Pickover, Alexander Zlatsin
  • Patent number: 6685853
    Abstract: The present invention is an admixture of an electrically conductive material and an energy sensitive material resulting in a conductive energy sensitive composition. The structures are useful for lithography in microelectronic fabrication to avoid the effects of charging on resists from electron beams. The compositions are also useful in applications of scanning electron metrology and static dissipation.
    Type: Grant
    Filed: July 12, 2000
    Date of Patent: February 3, 2004
    Assignee: International Business Machines Corporation
    Inventors: Marie Angelopoulos, Edward D. Babich, Inna V. Babich, Kuang-Jung Chen, Wayne Martin Moreau, David E. Seeger
  • Patent number: 6682860
    Abstract: An attenuating embedded phase shift photomask blank that produces a phase shift of the transmitted light is formed with an optically translucent film made of metal, silicon, nitrogen and oxygen. An etch stop layer is added to improve the etch selectivity of the phase shifting layer. A wide range of optical transmission (0.001% up to 15% at 157 nm) is obtained by this process.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: January 27, 2004
    Assignee: International Business Machines Corporation
    Inventors: Marie Angelopoulos, Katherina Babich, S. Jay Chey, Michael Straight Hibbs, Robert N. Lang, Arpan Pravin Mahorowala, Kenneth Christopher Racette
  • Patent number: 6684380
    Abstract: A technique for simplifying a structure so that subsequent electrical analysis can be more efficiently performed. The technique includes facility to modify the existing shapes in the structure so that they do not overlap, to determine the allowed movement of each edge of each shape in the structure, to apply a set of factors to each movement that determines how advantageous the movement is with respect to the number of unknowns and the change in geometry and/or electrical parameters of the structure, and to choose and then make the movement associated with the highest factor. The factors are unity based so that the desirability of the move is given by the product of all the factors. The technique includes facility to iterate, calculating the factors and making the movement associated with the greatest factor, until the factor falls below a given threshold. The resulting structure will be similar in electrical characteristics to the original structure, yet require fewer unknowns to analyze.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: January 27, 2004
    Assignee: International Business Machines Corporation
    Inventors: Barry J Rubin, Erik J Breiland
  • Patent number: 6681840
    Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: January 27, 2004
    Assignee: International Business Machines Corporation
    Inventor: Lawrence Shungwei Mok
  • Patent number: 6683008
    Abstract: A process of removing photoresist, previously subjected to ion implantation, from the surface of a workpiece. The process involves contacting the workpiece with a composition which includes liquid or supercritical carbon dioxide and between about 2% and about 20% of an alkanol having the structural formula CxX2x+1OH, where X is fluorine, hydrogen or mixtures thereof; and x is an integer of 1 to 8, said percentages being by volume, based on the total weight of the composition.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: January 27, 2004
    Assignee: International Business Machines Corporation
    Inventors: John Michael Cotte, Kenneth John McCullough, Wayne Martin Moreau, Keith R. Pope, John P. Simons, Charles J. Taft
  • Patent number: 6677680
    Abstract: A metal wiring plus low-k dielectric interconnect structure of the dual damascene-type is provided wherein the conductive metal lines and vias are built into a hybrid low-k dielectric which includes two spun-on dielectrics that have different atomic compositions and at least one of the two spun-on dielectrics is porous. The two spun-on dielectrics used in forming the inventive hybrid low-k dielectric each have a dielectric constant of about 2.6 or less, preferably each dielectric of the hybrid structure has a k of from about 1.2 to about 2.2. By utilizing the inventive hybrid low-k dielectric excellent control over metal line resistance (trench depth) is obtained, without no added cost. This is achieved without the use of a buried etch stop layer, which if present, would be formed between the two spun-on dielectrics.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: January 13, 2004
    Assignee: International Business Machines Corporation
    Inventors: Stephen McConnell Gates, Jeffrey Curtis Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Cristy Sensenich Tyberg
  • Patent number: 6673287
    Abstract: A method of exposing a composite organic/inorganic master to alkylchlorosilanes in the vapor phase. Chlorosilanes participate in facile reactions with hydroxyl groups existing on the surface of inorganic oxides (such as glass or the native oxides on silicon, aluminum, tin, etc.); or those in organics-containing phenolic or alcoholic groups, such as photoresists. The alkyl group on the silane can be chosen from a large selection of aliphatic or aromatic organic groups that have substituents with varying polarity and reactivity.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: January 6, 2004
    Assignee: International Business Machines Corporation
    Inventors: Tricia L. Breen, Laura L. Kosbar, Michael P. Mastro, Ronald W. Nunes
  • Patent number: 6673521
    Abstract: A process of silylation of object surfaces using a mixture of a silylation agent in admixture with an inert liquified gas, such as carbon dioxide.
    Type: Grant
    Filed: December 12, 2000
    Date of Patent: January 6, 2004
    Assignee: lnternational Business Machines Corporation
    Inventors: Wayne M. Moreau, Kenneth J. McCullough, David R. Medeiros, John P. Simons, Charles J. Taft
  • Patent number: 6667897
    Abstract: A magnetic tunnel junction device is provided that includes a free layer and a pinned layer separated by a barrier layer. According to the invention, the free layer includes a ferrimagnetic layer and an anti-parallel layer having a magnetic moment that is substantially anti-parallel to a magnetic moment of the ferrimagnetic layer at least within a predetermined temperature range of the magnetic tunnel junction device. A memory array that includes such a magnetic tunnel junction is also provided.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: December 23, 2003
    Assignee: International Business Machines Corporation
    Inventors: David W. Abraham, Philip L. Trouilloud
  • Patent number: 6661098
    Abstract: A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint receptacles with an adhesion layer, barrier layer and a noble metal layer; the device wafers are fabricated with an array of microjoining pads comprising an adhesion layer, barrier layer and a fusible solder layer with pads being located at matching locations in reference to the barrier receptacles; said device chips are joined to said carrier through the microjoint arrays resulting in interconnections capable of very high input/output density and inter-chip wiring density.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: December 9, 2003
    Assignee: International Business Machines Corporation
    Inventors: John Harold Magerlein, Kevin Shawn Petrarca, Sampath Purushothaman, Carlos Juan Sambucetti, Richard Paul Volant, George Frederick Walker
  • Patent number: 6662181
    Abstract: The field of distributed authoring systems, and more particularly to the implementing of authoring controls within the authoring system. Moreover, there is provided a selection mechanism which employs control structures for dynamically selecting content and display components of an authoring system.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: December 9, 2003
    Assignee: International Business Machines Corporation
    Inventors: Donald A. Icken, Neal M. Keller, Lisa M. Ungar
  • Patent number: 6658521
    Abstract: A system having a plurality of PCI devices, a PCI bus, a host system with a host memory, an network, and a target channel adpater. The plurality of PCI devices are attached to the PCI bus, which is connected via the target channel adpater and the network to the host system. The target channel adpater translates PCI bus transactions and PCI bus interrupts into network requests and network requests to PCI transactions. Each of the PCI devices has a PCI address range associated with it. A PCI memory window is allocated on the target channel adpater and is assigned to the host system. The PCI devices are enabled to post a pseudo address that belongs to the target channel adpater on the PCI bus when reading data via the network from the host memory or when writing data in the host memory via the network, the pseudo address comprising a base part (VABase) and an offset part (Offset).
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: December 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: Giora Biran, Vadim Makhervaks
  • Patent number: 6656308
    Abstract: A process of making a microcontact printing stamp useful in microcontact printing of microcircuits. In this process an elastomeric microcontact printing stamp is formed by curing an elastomeric monomer or oligomer in a mold in which a photoresist master, defining a microcircuit in negative relief, is predisposed above a flat and rigid backplane laminate. The flat and rigid plane member of the backplane laminate is delaminated from the backplane after the printing stamp is removed from the mold.
    Type: Grant
    Filed: April 22, 2002
    Date of Patent: December 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: Gareth Hougham, Peter Fryer, Ronald Nunes
  • Patent number: 6657305
    Abstract: A metal plus low dielectric constant (low-k) interconnect structure is provided for a semiconductor device wherein adjacent regions in a surface separated by a dielectric have dimensions in width and spacing in the sub 250 nanometer range, and in which reduced lateral leakage current between adjacent metal lines, and a lower effective dielectric constant than a conventional structure, is achieved by the positioning of a differentiating or mask member that is applied for the protection of the dielectric in subsequent processing operations, at a position about 2-5 nanometers below a, to be planarized, surface where there will be a lower electric field.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: December 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: Stephen Alan Cohen, Timothy Joseph Dalton, John Anthony Fitzsimmons, Stephen McConnell Gates, Brian Wayne Herbst, Sampath Purushothaman, Stanley Joseph Whitehair
  • Patent number: 6657291
    Abstract: The present invention is a method and apparatus for electrically decoupling conductors used to distribute power and ground potentials in electronic packages and chips. Specifically, the present invention utilizes Absorbing Plane Terminators (APTs), which are coupled between ground and power conductors of the electronic package. An APT includes a resistor with a value preferably chosen to match the approximate characteristic impedance of the conductor structures, and a decoupling capacitor connected in series with the resistor. The APT reduces electronic noise and electromagnetic radiation in electronic packages over a wide range of frequencies. The APT also dampens resonances caused by the parasitic inductance of the decoupling capacitor.
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: December 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: John Harold Magerlein, Albert E. Ruehli
  • Patent number: 6653233
    Abstract: A process of providing a semiconductor device with electrical interconnection capability wherein a sacrificial material is introduced into topographical features of the semiconductor device prior to chemical mechanical polishing so that debris formed during chemical mechanical polishing is incapable of falling into topographical features present on the semiconductor device. The sacrificial material is thereupon removed by liquid or supercritical carbon dioxide.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: November 25, 2003
    Assignee: International Business Machines Corporation
    Inventors: John Michael Cotte, Kenneth John McCullough, Wayne Martin Moreau, Keith R. Pope, John P. Simons, Charles J. Taft, Richard P. Volant