Patents Represented by Attorney, Agent or Law Firm Daniel P. Morris
  • Patent number: 6591154
    Abstract: A system and method for repairing defects in semiconductor wafers utilizing a repair tool including a device for applying energy to obliterate defects at locations on the wafer, the method being a graphical approach implementing a graphical user interface (GUI) comprising a pixel screen display and comprising the steps of: via the interface, identifying a wafer defect to repair and enclosing the defect within a polygonal repair outline drawn using a default line thickness; graphically adjusting the line thickness to modify the enclosed polygonal repair outline area; automatically detecting one or more areas within an interior region of the modified polygonal repair outline area; and, scanning the modified polygonal repair outline, and for each pixel location inside the one or more detected areas, applying energy to the wafer coordinated to the pixel location for repairing the defect, whereby the identification of said pixel location is accomplished using standard graphical tools with minimal operator interven
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: July 8, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard A. Haight, Peter P. Longo, Alfred Wagner
  • Patent number: 6587151
    Abstract: On a portable computer, a video camera is integrated as a feature by mounting the camera as an assembly made up of a lens and associated pixel electronics in a camera base that is positioned on the perphery of the display in the cover of the portable computer when the cover is open, and the providing of a cavity in the base portion of the portable computer positioned so that the camera assembly enters the cavity when the cover of the portable computer is closed.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: July 1, 2003
    Assignee: International Business Machines Corporation
    Inventors: Thomas Mario Cipolla, Rama Nand Singh
  • Patent number: 6587128
    Abstract: The dynamically sized window automatically adjusts its right border if the text on the line exceeds beyond the window size, thereby eliminating a need for a manual adjustment of the window size and/or scrolling through the window. Moreover, the present invention enables a capability to increase only the selective parts of the window that displays a longer line. Similarly, adjustments to the window are enabled for those windows having graphical pictures whose size exceeds the window size. Windows overlapping other windows may be made transparent so that the underlying window is visible.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: July 1, 2003
    Assignee: International Business Machines Corporation
    Inventors: Dimitri Kanevsky, Alexander Zlatsin, Clifford A. Pickover
  • Patent number: 6584425
    Abstract: A smart thermometer distributed system comprising a thermometer with a screen that allows one to enter a variety of data for the thermometer. The thermometer is connected to a computer and to a network and can retrieve from a history data base information about family members, including their dress, names, ages, previous illnesses and other information. The smart thermometer system thus provides the user with specific weather information, and will enable him or her to choose appropriate dress for family members given their ages, previous illnesses and other information.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: June 24, 2003
    Assignee: International Business Machines Corporation
    Inventors: Dimitri Kanevsky, Mariusz Sabath, Jan Sedivy, Alexander Zlatsin
  • Patent number: 6577011
    Abstract: The present invention includes a multilevel air-gap-containing interconnect wiring structure including: a collection of interspersed line levels and via levels, the via levels and line levels containing conductive via and line features embedded in a dielectric having an air-gap and solid dielectric. The air-gap and solid dielectric includes (i) one or more solid dielectrics only in the shadows of the conductive features in overlying levels and (ii) a gaseous dielectric elsewhere in the structure. The collection of line levels and via levels are topped by a laminated thin, taut insulating cover layer having openings to selected conductive features in the topmost underlying line or via layer, and the openings are filled with conductive material connecting to terminal pad contacts on the insulating cover layer.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: June 10, 2003
    Assignee: International Business Machines Corporation
    Inventors: Leena P. Buchwalter, Alessandro Cesare Callegari, Stephan Alan Cohen, Teresita Ordonez Graham, John P. Hummel, Christopher V. Jahnes, Sampath Purushothaman, Katherine Lynn Saenger, Jane Margaret Shaw
  • Patent number: 6573606
    Abstract: In the invention an electrically isolated copper interconnect structural interface is provided involving a single, about 50-300 A thick, alloy capping layer, that controls diffusion and electromigration of the interconnection components and reduces the overall effective dielectric constant of the interconnect; the capping layer being surrounded by a material referred to in the art as hard mask material that can provide a resist for subsequent reactive ion etching operations, and there is also provided the interdependent process steps involving electroless deposition in the fabrication of the structural interface. The single layer alloy metal barrier in the invention is an alloy of the general type A—X—Y, where A is a metal taken from the group of cobalt (Co) and nickel (Ni), X is a member taken from the group of tungsten (W), tin (Sn), and silicon (Si), and Y is a member taken from the group of phosphorous (P) and boron (B); having a thickness in the range of 50 to 300 Angstroms.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: June 3, 2003
    Assignee: International Business Machines Corporation
    Inventors: Carlos Juan Sambucetti, Xiaomeng Chen, Soon-Cheon Seo, Birenda Nath Agarwala, Chao-Kun Hu, Naftali Eliahu Lustig, Stephen Edward Greco
  • Patent number: 6569575
    Abstract: Optical lithography scheme making use of light coupling structures, and elastomeric light coupling structures in particular. These light coupling structures comprise protruding portions and connecting portions. The protruding elements are designed to be brought into conformal contact with a resist to be exposed such that the light guided into the protruding elements is coupled from there directly into the resist. The lateral shape and size of the protruding elements defines 1:1 the lateral size and shape of small features to be exposed in the resist.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: May 27, 2003
    Assignee: International Business Machines Corporation
    Inventors: Hans Biebuyck, Bruno Michel, Heinz Schmid
  • Patent number: 6569707
    Abstract: A method for improving the performance of an organic thin film field effect transistor including the steps of: (a) forming a transistor structure having patterned source and drain electrodes; and (b) treating the patterned source and drain electrodes with a thiol compound having the formula, RSH, wherein R is a linear or branched, substituted or unsubstituted, alkyl, alkenyl, cycloalkyl or aromatic containing from about 6 to about 25 carbon atoms under conditions that are effective in forming a self-assembled monolayer of said thiol compound on said electrodes. Organic thin film transistor structures containing the self-assembled monolayer of the present invention are also disclosed.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: May 27, 2003
    Assignee: International Business Machines Corporation
    Inventors: Christos Dimitrios Dimitrakopoulos, Ioannis Kymissis, Sampath Purushothaman
  • Patent number: 6561220
    Abstract: A method and an apparatus, the apparatus including appropriate valves and conduits, for increasing throughput in pressurized fluid processing including storing in a storage chamber of the apparatus a quantity of fluid at a pressure higher than a pressure at which an operation is to take place, while a processing chamber is depressurized to allow reception of a new object; sealing the processing chamber; and allowing fluid stored in the storage chamber to pass to the processing chamber to re-pressurize the processing chamber before performing the operation. The fluid may be preheated in the storage chamber to further reduce processing times.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: May 13, 2003
    Assignee: International Business Machines, Corp.
    Inventors: Kenneth J. McCullough, Wayne M. Moreau, John P. Simons, Charles J. Taft, John M. Cotte
  • Patent number: 6558475
    Abstract: The present invention provides an apparatus for cleaning a workpiece with a cleaning medium that is maintained at a single fluid phase. The apparatus includes means for providing the cleaning medium; a pressurizable cleaning vessel for receiving the cleaning medium and the workpiece; and means for maintaining a single fluid phase of the cleaning medium in the cleaning vessel. The present invention further provides a process for cleaning the workpiece with cleaning medium under conditions such that the workpiece is exposed to a single fluid phase of the cleaning medium. The present invention further includes a process for a storage media that includes instructions for controlling a processor for the process of the present invention. The storage media includes means for controlling the processor to control contacting conditions of the workpiece and the cleaning medium such that the workpiece is exposed to a single fluid phase of the cleaning medium.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: May 6, 2003
    Assignee: International Business Machines Corporation
    Inventors: Jesse Stephen Jur, Kenneth J. McCullough, Wayne Martin Moreau, John Patrick Simons, Charles Jesse Taft
  • Patent number: 6549995
    Abstract: In a processing system having a main memory wherein information is stored in a compressed format for the purpose of gaining additional storage through compression efficiencies and, wherein information stored within the main memory is indirectly accessible by a processor through a compression and decompression mechanisms, an improved memory architecture that accommodates the necessary compressed information data structures, together with a memory region and mapping method for storing information that bypasses the compression and decompression mechanisms to provide low latency processor access to certain address spaces.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: April 15, 2003
    Assignee: International Business Machines Corporation
    Inventors: Charles O. Schulz, T. Basil Smith, III, Robert B. Tremaine, Michael Wazlowski
  • Patent number: 6543617
    Abstract: The present invention includes a packaged coated workpiece. The packaged coated workpiece has: (1) a workpiece coated with a resist film sensitive to optical radiation, particulates or chemical contaminants; (2) an inner barrier sealed to enclose the coated workpiece and optionally a first getter agent, to produce a sealed first enclosure; and (3) an outer barrier sealed to enclose the sealed first enclosure and optionally a second getter agent, provided that the packaged coated workpiece has at least one getter agent, to produce a packaged coated workpiece suitable for storage for a period of at least one week without substantial loss of sensitvity, resolution or performance. The present invention also includes a process for preparing a packaged coated workpiece and a method of increasing the storage time of a coated workpiece to at least one week without substantial loss of sensitivity, resolution or performance.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: April 8, 2003
    Assignee: International Business Machines Corporation
    Inventors: Marie Angelopoulos, Wu-Song Huang, Ranee Wai-Ling Kwong, David Robert Medeiros, Wayne Martin Moreau, Karen Elizabeth Petrillo, Herman Russell Wendt, Christopher Karl Magg
  • Patent number: 6545295
    Abstract: A thin film transistor and a liquid crystal display panel are provided. These devices include a layer of ammonia-free silicon nitride formed between the gate and the gate insulator of the device.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: April 8, 2003
    Assignee: International Business Machines Corporation
    Inventors: John Batey, Peter M. Fryer, Jun Hyung Souk
  • Patent number: 6537908
    Abstract: A cost effective and simple method of patterning interconnect structures is provided in which spun-on materials are used as the hard mask. The use of spun-on materials for the hard mask ensures that the process is carried out in a single tool and it permits the use of a single curing step which is not typically employed in patterning processes wherein CVD hard masks are employed. The effective dielectric constant of the resultant structure is not significantly increased since the use of spin coating allows for selection of a polish stop layer (formed on a surface of a low-k dielectric) that has substantially the same dielectric constant as the underlying dielectric. In the present invention, the hard mask employed includes at least two spun-on dielectric materials that have different etch rates.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: March 25, 2003
    Assignee: International Business Machines Corporation
    Inventors: Ann Rhea-Helene Fornof, Stephen McConnell Gates, Jeffrey Curtis Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman, Christy Sensenich Tyberg
  • Patent number: 6531343
    Abstract: A method of encapsulating a circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate by applying an encapsulant adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.
    Type: Grant
    Filed: June 5, 2000
    Date of Patent: March 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Michael Anthony Gaynes, Stephen Leslie Buchwalter
  • Patent number: 6526655
    Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: March 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da-Yuan Shih
  • Patent number: 6525551
    Abstract: A probe structure for probing an electronic device.
    Type: Grant
    Filed: May 19, 1998
    Date of Patent: February 25, 2003
    Assignee: International Business Machines Corporation
    Inventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Eugene John O'Sullivan, Da-Yuan Shih
  • Patent number: 6523255
    Abstract: Method for repairing, reworking or replacing damaged probes that are formed using a flying lead wire bonding process used for testing integrated circuit devices and other electronic devices, with the same column and row spacing as the original probes and using the same height as the original probes.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: February 25, 2003
    Assignee: International Business Machines Corporation
    Inventors: Da-Yuan Shih, Keith Edward Fogel, Paul Alfred Lauro, Brian Samuel Beaman
  • Patent number: 6522693
    Abstract: A system and method for generating an MPEG compliant video stream with satisfactory visual quality. The method employs re-encoding at a higher (or lower) bit rate, only the segments with unsatisfactory visual picture quality while retaining other parts of the original video stream and then merging the re-encoded segments with the remaining original portions. If the original video stream is coded at a reasonable bit rate, the number and length of those segments with unsatisfactory visual picture quality will be few and short. Re-encoding only those segments can save very significant amount of cost and only requires minimal additional storage space. Furthermore, the portions with satisfactory picture quality will be retained. The system and method is applicable to MPEG and non-MPEG compliant data streams.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: February 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Ligang Lu, Jack L. Kouloheris, Cesar A. Gonzales
  • Patent number: 6518794
    Abstract: The invention teaches a technique for A C equilibration of the signaling levels and time of 1—>h and h—>1 transitions of CMOS drivers as received at CMOS receivers, so as to improve the rate at which data can be communicated between two CMOS devices. It permits minimization of a switching delay in Double Data Rate Dram memories.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: February 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Paul William Coteus, Alan Gene Gara