Patents Represented by Attorney, Agent or Law Firm Darla P. Fonseca
-
Patent number: 6331080Abstract: A colored adhesive useful for an optical fiber connection or termination, containing an adhesive component having a viscosity between about 200 centipoise and about 5000 centipoise, a colorant which is soluble in the adhesive component having a first color before exposure to radiation having a wavelength of from about 400 to about 1100 nanometers, and a second color after exposure to radiation, and an initiator system to cure the adhesive composition by exposure to the radiation.Type: GrantFiled: October 9, 1998Date of Patent: December 18, 2001Assignee: 3M Innovative Properties CompanyInventors: Brian M. Cole, William V. Dower, Joel D. Oxman
-
Patent number: 6320137Abstract: A printed circuit including a dielectric substrate and a conductive trace attached to a surface of the dielectric substrate. The trace includes a base layer and a coverplate layer on a portion of the base layer. The coverplate layer defines a coverplate edge on the base layer. A protective layer is formed on a portion of the coverplate layer. The protective layer extends beyond the coverplate edge onto at least a portion of the base layer of the trace. A key aspect of the present invention is that the protective layer overlaps the coverplate edge of each trace to reduce the potential for corrosion of the base layer at the coverplate edge.Type: GrantFiled: April 11, 2000Date of Patent: November 20, 2001Assignee: 3M Innovative Properties CompanyInventors: Lora C. Bonser, Terry F. Hayden, Robert J. Schubert
-
Patent number: 6316734Abstract: Circuit and circuit carries include a dielectric substrate having a conductive layer mounted thereon. The conductive layer is patterned to define a plurality of spaced apart conductive elements. A static charge dissipative layer is in contact with and extending between at least two of the conductive elements. The static charge dissipative layer has a surface resistivity of between about 1×105 and about 1×1010 ohms/□. The static charge dissipative layer is made of a material selected from the group consisting of diamond-like carbon, silicon nitride, boron nitride, boron trifluoride, silicon carbide and silicon dioxide. Circuits and circuit carriers according to the present invention allow static charges to be controllably and reliably dissipated from a surface of the circuit or circuit carrier such that the potential for damage from static discharge to electrical components connected to the circuit is reduced.Type: GrantFiled: March 7, 2000Date of Patent: November 13, 2001Assignee: 3M Innovative Properties CompanyInventor: Rui Yang
-
Patent number: 6313435Abstract: A Method and Apparatus for ablating features from a substrate, such as drilling holes in a polymer substrate for an ink jet printhead, by illuminating the substrate that has passed through a mask that is continuously orbited or moved in a two dimensional pattern. The mask is capable of following a trajectory perpendicular to the angle of the radiation.Type: GrantFiled: November 20, 1998Date of Patent: November 6, 2001Assignee: 3M Innovative Properties CompanyInventors: Curtis L. Shoemaker, Luis A. Aguirre
-
Patent number: 6298548Abstract: A tool for use in joining wire pairs via wire connector assemblies such as those utilized in telecommunications includes a housing and a force applicator connected to a T-bar for applying force to a wire connector assembly. A wire connector holder is provided which receives the wire connector assemblies to be connected along with the wire pairs. A pivotal wire guide is provided on one side of the wire connector holder which allows easy removal of the wires and connectors after the connection is made. An adjustable gauge wire guide is provided on the other side of the wire connector holder which accommodates different gauges of wire. The force applicator includes a removable spacer which adjusts the stroke of the force applicator to accommodate stacks having more than one connector assembly in the wire connector holder.Type: GrantFiled: November 20, 1997Date of Patent: October 9, 2001Assignee: 3M Innovative Properties CompanyInventor: Wilson E. Suarez
-
Patent number: 6283670Abstract: A closure system includes two longitudinally-extending shell members, each having flanges. Each of the flanges have inner and outer surfaces such that in a closed state the inner surfaces of each of the flanges contact one another to form at least one longitudinal seam. Several longitudinally extending ramp pairs are disposed on the outer surfaces of the flanges One ramp of each ramp pair is disposed on the outer surface of one flange and another ramp of each ramp pair is disposed on the outer surface of the other flange. The ramp pairs are inclined away from the longitudinal seam when viewed along a first direction. A clamping rail has an inner surface that includes a guide channel interlocking with the ramp pairs so that the first and second flanges compress the seam. Additional longitudinally extending ramp pairs can be disposed on the outer surfaces of the flanges, in which case a second clamping rail having an inner surface that includes a second guide channel interlocks with the additional ramp pairs.Type: GrantFiled: September 30, 1999Date of Patent: September 4, 2001Assignee: 3M Innovative Properties CompanyInventors: Jenny L. Blankinship, Michael L. Black
-
Patent number: 6284976Abstract: A cable splice closure includes a closure body having mating surfaces sealed together. An end seal in the closure has an opening for receiving a cable. The end seal is sealed to the closure body by an adhesive bond. An adhesive injection port in the end seal. The port is provided to communicate an adhesive injected into the end seal to bond surfaces of the end seal and the cable to be received, into a sealed unit. The adhesive is a low surface energy adhesive based on acrylic monomers with organoborane are complexes.Type: GrantFiled: May 11, 2000Date of Patent: September 4, 2001Assignee: 3M Innovative Properties CompanyInventors: Jacqueline J. Pulido, Kenneth D. Rebers, Thomas S. Croft, Alan J. Oshinski, Kwang H. Chu, Daniel G. Lee, Russell P. Smith
-
Patent number: 6252714Abstract: A diffractive homogenizer is provided for receiving a beam of laser energy and producing a desired illumination pattern in a target plane. The homogenizer is made up of a plurality of diffractive sub-elements, each of which contributes to all or a portion of the desired image. By combining the contributions of many sub-elements to form the final image, a homogenizing effect is realized. In preferred embodiments, the sub-elements are designed to compensate for the finite spatial coherence of the incident laser beam and to control the numerical aperture distribution of the transmitted light. Each sub-element is composed of a large number of discrete pixels, each of which alters the phase of radiation passing therethrough by a selected amount. The pixel arrangement is chosen, using computer modeling and optimization techniques, such that the interference pattern created by the collective pixels in a sub-element makes up the desired image (or a portion thereof).Type: GrantFiled: February 24, 2000Date of Patent: June 26, 2001Assignee: 3M Innovative Properties CompanyInventors: Reid L. Guenther, Curtis L. Shoemaker
-
Patent number: 6248953Abstract: An end seal is provided for sealing the space between at least one cable and a closure such as a splice case. The end seal includes a centrally located support structure having a plurality of radially extending members each defined by spaced, opposing end faces and an outer peripheral surface. Each of the radially extending members has first and second mating surfaces and a notch located in the first and second mating surfaces. The first and second mating surfaces are connected to, and extend between, the end faces of their respective radially extending members. The end seal also includes a plurality of segments having spaced, opposing end faces. The plurality of segments each interlock with the support structure so that each of the end faces of the segments extend in a common plane with one of the end faces of the support structure. Each segment includes an outer peripheral surface and first and second end surfaces connected to and extending between the end faces of the segment.Type: GrantFiled: October 21, 1999Date of Patent: June 19, 2001Assignee: 3M Innovative Properties CompanyInventor: James R. Miller
-
Patent number: 6211304Abstract: Novel mordants based upon a poly(alkylene oxide) backbone and either pendant phosphonium or quaternized-nitrogen compounds are disclosed. The mordants find use in stopping or controlling ink-bleeding in ink-jet receptors and photographic films.Type: GrantFiled: August 30, 1995Date of Patent: April 3, 2001Assignee: 3M Innovative Properties CompanyInventor: Omar Farooq
-
Patent number: 6211468Abstract: A flexible circuit includes a flexible non-conductive substrate having a first surface and a second surface. A first electrically conductive trace is provided on the first surface and a second electrically conductive trace is provided on the second surface. A passage extends through the substrate from an end of the first trace to an end of the second trace. The passage includes a beveled opening of a first size formed in the first side and axially aligned with a second beveled opening of the first size formed in the second side. The first and second openings are interconnected by an aperture axially aligned therewith and being of a second size less than the first size. An electrically conductive surface is provided on the passage for electrically interconnecting the first trace and the second trace.Type: GrantFiled: August 12, 1998Date of Patent: April 3, 2001Assignee: 3M Innovative Properties CompanyInventor: David J. Windschitl
-
Patent number: 6204343Abstract: A curable composition for electrical applications, the curable composition comprising (i) a compound having at least two &agr;,&bgr;-unsaturated groups and an equivalent weight of less than 250 g/mol, (ii) a catalyst capable of initiating a Michael reaction and (iii) a Michael donor having an equivalent weight of less than 250 g/mol, and a package for using this composition in electical splices.Type: GrantFiled: June 3, 1999Date of Patent: March 20, 2001Assignee: 3M Innovative Properties CompanyInventors: Dieter Barucha, Dean M. Moren, Manfred Stepputtis, Frank Y. Xu
-
Patent number: 6196730Abstract: A curable adhesive composition for forming a bond between silicone coated optical fibers and fiber connector bodies, said composition comprising: an epoxy resin component; and a curative admixed therewith. The curative comprises an amino-substituted polysiloxane including more than one primary amino group and having a molecular weight from about 150 to about 1,000. The adhesive composition has an initial viscosity, before curing, below about 100 Pascal-seconds, and the bond has a fiber pull-out force above about 1 Kg. Also provided is fiber optic connector including a holder for one or more optical cables, each optical cable having an optical fiber surrounded by strengthening fibers, both of which are surrounded by at least one polymeric coating layer wherein the optical cable is bonded to the connector by means of the curable adhesive.Type: GrantFiled: June 22, 1998Date of Patent: March 6, 2001Assignee: 3M Innovative Properties CompanyInventor: Walton J. Hammar
-
Patent number: 6177357Abstract: A process for making flexible circuits wherein the etching of a polymeric film is accomplished by dissolving portions thereof with concentrated aqueous base using a UV-curable 100% active liquid photoresist as a mask, comprising the steps of laminating the resist on a polymeric film, exposing a pattern into the resist, developing the resist with a dilute aqueous solution until desired image is obtained, etching portions of the polymeric film not covered by the crosslinked resist with a concentrated base at a temperature of from about 50° C. to about 120° C., and then stripping the resist off the polymeric film.Type: GrantFiled: April 30, 1999Date of Patent: January 23, 2001Assignee: 3M Innovative Properties CompanyInventor: David D. Lu
-
Patent number: 6172329Abstract: This invention concerns a process useful for increasing the accuracy of the shape of a laser ablated feature formed on a substrate, especially where the substrate is a polymeric article. The process includes irradiating the polymeric article with laser light that has passed through a retardation plate selected from stationary adjustable plates, rotating plates or spinning plates, preferable in multiples of quarter-waves or half-waves. This invention also concerns a laser apparatus useful for making ablated features in a substrate having a radiation source; a mask positioned between the radiation source and a substrate to be irradiated, and a retardation plate which is stationary and adjustable, rotating or spinning plates.Type: GrantFiled: November 23, 1998Date of Patent: January 9, 2001Assignees: Minnesota Mining and Manufacturing Company, MicroLas Lasersystem GmbH, Lambda-Physik GmbHInventors: Curtis L. Shoemaker, Daniel J. Treadwell, Berthold Burghardt, Sergei V. Govorkov
-
Patent number: 6150071Abstract: The invention provides a process for fabricating a flexible printed circuit with at least one etched or plated feature on each major surface of said flexible circuit, comprising the steps of providing an input material with two major surfaces, including a dielectric substrate and at least one conductive base layer, laminating a photoresist with a cover sheet onto at least one major surface of the input material, and printing an image onto the cover sheet or removing the coversheet and printing the image onto the photoresist directly.Type: GrantFiled: October 15, 1998Date of Patent: November 21, 2000Assignee: 3M Innovative Properties CompanyInventors: Paul M. Harvey, William V. Dower, William V. Ballard
-
Patent number: 6140707Abstract: A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads.Type: GrantFiled: May 7, 1998Date of Patent: October 31, 2000Assignee: 3M Innovative Properties Co.Inventors: Anthony R. Plepys, Paul M. Harvey
-
Patent number: 6090728Abstract: An EMI shielding enclosure, for an electronic assembly, comprising a ground plane of a printed circuit connected to a shaped EMI shielding cover. The cover results from thermoforming a composite sheet of several layers, including a carrier for a fibrous metal mat that has fibers substantially surrounded by a fiber-coat. Connection of the cover to the ground plane, to form the EMI shielding enclosure, requires the fiber-coat to adhere to the printed circuit in the vicinity of the ground plane.Type: GrantFiled: May 1, 1998Date of Patent: July 18, 2000Assignee: 3M Innovative Properties CompanyInventors: Donald M. Yenni, Jr., Jose P. de Souza, Mark G. Baker
-
Patent number: 6075072Abstract: A corrosion protective coating composition, applied over a metal surface, contains frangible microcapsules which rupture and release fluid upon impact or other stress likely to damage the coating. The fluid, from the microcapsules, contains a film forming component to cover the damaged area of the coating and a corrosion inhibitor for the metal surface.Type: GrantFiled: March 13, 1998Date of Patent: June 13, 2000Assignee: 3M Innovative Properties CompanyInventors: Curtis R. Guilbert, David G. Enos, Charles E. Boyer, III
-
Patent number: D444452Type: GrantFiled: January 27, 1999Date of Patent: July 3, 2001Assignee: 3M Innovative Properties CompanyInventor: Russell P. Smith