Abstract: A method of manufacturing a semiconductor device. The method includes providing a metal carrier, attaching chips to the carrier, and applying a metal layer over the chips and the metal carrier to electrically couple the chips to the metal carrier. The metal carrier is segmented, after applying the metal layer, to obtain metal contact elements.

Abstract: A sensor including a substrate and magnetic material. The substrate has a main major surface and includes at least two spaced apart ferromagnetic layers. The magnetic material encapsulates the substrate such that the magnetic material is adjacent the main major surface.

Abstract: A self-propelled vehicle comprises a frame and a platform pivotally mountable to a rear portion of the vehicle frame. The platform is pivotally movable between a first position in which the platform extends generally horizontally from the rear portion of the frame to support a rider during operation of the vehicle, and a second position in which the platform is removably secured in a generally upright position adjacent the rear portion of the frame to enable walk-behind operation of the vehicle.

Abstract: Belting for use in a conveyor belt that includes a fabric base and a rubber coat. The fabric base has an upper surface and a lower surface. At least one of the upper surface and the lower surface has a plurality of depressions formed therein. The rubber coat is applied to at least one of the upper surface and the lower surface having the plurality of depressions formed therein.

Abstract: An integrated circuit includes an array of diodes and an electrode coupled to each diode. The integrated circuit includes a layer of resistance changing material coupled to the electrodes and bit lines coupled to the layer of resistance changing material. The layer of resistance changing material provides a resistance changing element at each intersection of each electrode and each bit line.

Abstract: An electronic component includes a metal substrate, a semiconductor chip configured to be attached to the metal substrate, and a buffer layer positioned between the metal substrate and the semiconductor chip configured to mechanically decouple the semiconductor chip and the metal substrate. The buffer layer extends across less than an entire bottom surface of the semiconductor chip.

Abstract: A surgical cutting instrument including a first elongated member, a second tubular member, a handpiece, a first hub, a second hub, and an actuator assembly. The first tubular member has cutting tip and is co-axially disposed within the second tubular member such that the cutting tip is exposed at a cutting window. The first hub is mounted to the first tubular member and is moveably coupled to the handpiece. The second hub is mounted to the second tubular member and defines a hub axis. The actuator assembly rotatably couples the second hub to the handpiece and includes an actuator. Movement of the actuator is translated to rotational movement of the second hub so as to effectuate spatial rotation of the cutting window. In this regard, the actuator movement is not co-axial with the hub axis.

Abstract: A system including a first transistor, a first capacitor and a circuit. The first transistor has a first control input and is configured to regulate an output voltage. The first capacitor is coupled at one end to the first control input and at another end to a circuit reference. The circuit is configured to provide a first voltage to the first control input, where the first voltage includes an offset voltage that is referenced to the output voltage and adjusted to compensate for variations in the first transistor.

Abstract: A semiconductor device including a wafer-level LED includes a semiconductor structure coupled to first and second electrodes. The semiconductor includes a P-doped portion of a first layer to an N-doped portion of a second layer. The first layer includes a surface configured to emit light. The first electrode is electrically coupled to the P-doped portion of the first layer on a first side of the semiconductor structure. The first side is adjacent to the surface that is configured to emit the light. The second electrode is electrically coupled to the N-doped portion of the second layer on a second side of the semiconductor structure. The second side is also adjacent to the surface that configured to emit light.

Abstract: A surgical tissue cutting instrument having an irrigation system comprises an elongate tubular outer member having a proximal end, a distal end and an opening at the distal end, an elongate inner member rotatably disposed within the outer member and having a proximal end, a distal end and a cutting element at the distal end exposed from the opening, a handpiece mounted to the proximal ends of the outer and inner members, and an irrigation system comprising an irrigation channel composed of a first irrigation passage within the handpiece and a second irrigation passage within the thickness of the annular wall of the outer member, and a sleeve having a rearward end disposed over a front end of the handpiece and a forward end disposed over the outer member adjacent an outlet opening of the second irrigation passage near the distal end of the outer member.

Abstract: A tube-positioning system for loading tubing into a peristaltic pump includes a holder and a first tube segment. The holder includes a shell configured to slidably fit onto an exterior of a pump and a pair of guides extending upward from opposite side walls of the shell. The first tube segment has a fixed length and extends between the pair of guides with each end of the first tube segment secured within one of the respective guides.

Abstract: A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.

Abstract: A semiconductor device with a dynamic gate drain capacitance. One embodiment provides a semiconductor device. The device includes a semiconductor substrate, a field effect transistor structure including a source region, a first body region, a drain region, a gate electrode structure and a gate insulating layer. The gate insulating layer is arranged between the gate electrode structure and the body region. The gate electrode structure and the drain region partially form a capacitor structure including a gate-drain capacitance configured to dynamically change with varying reverse voltages applied between the source and drain regions. The gate-drain capacitance includes at least one local maximum at a given threshold or a plateau-like course at given reverse voltage.

Abstract: An integrated circuit arrangement containing a via is disclosed. The via has an upper section having greatly inclined sidewalls. A lower section of the via has approximately vertical sidewalls. In one embodiment, a liner layer is used as a hard mask in the production of the via and defines the position of the sections of the via.

Abstract: One aspect is an ultrasonic crusher including a pipe system having at least one elutriator. A pump is configured to pump a slurry through the pipe system and the at least one elutriator. A first ultrasound sonotrode is configured proximate to the at least one elutriator.

Abstract: A quick-release latch assembly includes a plate, a latch pivotally coupled to the plate, and a locking assembly movable relative to the latch between a first, unlocked position and a second, locked position. When the locking assembly is in the unlocked position, the latch is allowed to rotate with respect to the plate. In contrast, when the locking assembly is in the locked position, the latch is prevented from rotating with respect to the plate.

Abstract: A portable user interface device for performing wireless communications. The device includes a case, a display screen, a speaker, a microphone, a sensor, and a computer. The computer is disposed behind the display screen to define a display side, and the sensor is located adjacent the display side. The computer is programmed to control operation of the display screen and to operate a wireless form-filling module, a wireless data transfer module, and an application module. The form-filling module is of a type adapted to promote source data-type interface with a client server servicing the user interface device and limited data transfer capacity. The data transfer module includes a wireless transceiver and is adapted to communicate with a data transfer service on a non-priority, limited size basis. The application module performs a designated operation via the form-filling module and the data transfer module, displaying indicia immediately adjacent the sensor.

Abstract: A vertical semiconductor component having a semiconductor body, which has an inner region and an edge region that is arranged between the inner region and an edge of the semiconductor body. At least one semiconductor junction between a first semiconductor zone of a first conduction type, said first semiconductor zone being arranged in the region of a first side of the semiconductor body in the inner region, and a second semiconductor zone of the second conduction type, said second semiconductor zone adjoining the first semiconductor zone in the vertical direction.