Abstract: A fluid cooling system for electronic systems particularly adapted to cool large scale integrated circuit chips mounted on substrates. The system has one or more heat exchangers through which a liquid coolant is circulated. Each heat exchanger has a flexible wall and is mounted so that its flexible wall is in close proximity to a surface of the substrate to be cooled. A low thermal impedance contact is made through the flexible wall of the heat exchanger between the substrate to be cooled and the coolant flowing through the heat exchanger because of the pressure of the coolant in the heat exchanger. The heat exchangers are connected into the cooling system through flexible conduits so that a heat exchanger can readily be moved out of contact with a substrate without disrupting the flow of coolant through the cooling system.

Abstract: Apparatus for blanking an integrated circuit (I.C.) chip and the chip's thin flexible ductile leads which extend beyond the four sides of each chip from a segment of film to which the leads are attached and forming the leads including forming a foot at the free end of each lead of the chip in a single operation of a hollow punch having contiguous cutting and forming edges with a contiguous forming surface between them and a hollow die having cutting edges with a forming block having contiguous forming edges and forming shoulders positioned within the die. The punch and die are mounted on a punch press. Alignment means accurately position the chip and its leads with respect to the punch and die. A pressure pad is mounted in the punch and presses the leads against a portion of the forming block to isolate the bonds between the leads and the integrated circuit chip from forces applied to the leads during cutting and forming.

Abstract: A fluid cooling system for electronic systems particularly adapted to cool large scale integrated circuit chips mounted on substrates. The system has one or more heat exchangers through which a liquid coolant is circulated. Each heat exchanger has a flexible wall and is mounted so that its flexible wall is in close proximity to a surface of the substrate to be cooled. A low thermal impedance contact is made through the flexible wall of the heat exchanger between the substrate to be cooled and the coolant flowing through the heat exchanger because of the pressure of the coolant in the heat exchanger. The heat exchangers are connected into the cooling system through flexible conduits so that a heat exchanger can readily be moved out of contact with a substrate without disrupting the flow of coolant through the cooling system.

Abstract: A reusable fixture for a segment of a film strip having a flexible beam lead frame mounted on the segment and an integrated circuit chip bonded to the inner portions of the leads of the lead frame. The fixture is made from an integral laminar layer of a suitable material. The improvements are in providing a plurality of pairs of projections with protuberances which overlie, to a slight degree, the attachment webs of a segment. The fixture is also provided with detachment openings to provide access to the attachment webs which detachment openings facilitate removal of a segment from the fixture.

Abstract: A transfer mechanism for withdrawing an object from the bottom of a stack of such objects in a first magazine and for inserting said object at the bottom of a stack of such objects in a second magazine. The magazines are removably mounted on bases positioned with respect to each other so that the openings in the magazines through which an object is removed from one and inserted into the other are essentially opposite one another and are spaced apart less than the corresponding dimension of an object. An extractor removes the bottommost fixture from the first magazine and inserts that object into the second magazine. Cam surfaces which project into the second magazine cause the stack of such objects therein to clear the opening in the second magazine and cause the object being loaded to move the stack of such objects upwardly with the most recently inserted object at the bottom of the stack.

Abstract: Apparatus for blanking an integrated circuit (I.C.) chip and the chip's thin flexible ductile leads from a segment of film and forming the leads of the chip in a single operation of a hollow punch having cutting and forming edges and a hollow die having cutting edges with a forming block having forming edges positioned within the die. The punch and die are mounted on a punch press. Alignment pins are provided which at the beginning of each blanking and forming operation engage reference sprocket holes of a film segment to which an I.C. chip is mounted to accurately position the chip and its leads with respect to the punch and die. A pressure pad is mounted in the punch and presses the leads against a portion of the forming block to isolate the bonds between the leads and the integrated circuit chip from forces applied to the leads during cutting and forming.

Abstract: A method of protecting active and passive electronic components on a portion of one surface of a multilayer substrate of a micropackage from deleterious constituents of the ambient atmosphere, primarily water vapor. A segment of a thin, flexible, substantially nonpermeable and nonadhering membrane, or sheet, has its perimeter secured to the substrate by a bead of sealant adhesive. The exposed surface of the segment has applied to it a thicker coating of a substantially nonpermeable sealant adhesive material which adheres to the membrane and the bead of sealant adhesive. A small opening is formed through the coating and the segment to provide communication with the area between the surface of the substrate on which the components are mounted and the inner surface of the segment. The substrate is placed in a chamber which is substantially evacuated to remove gases trapped under the segment.

Abstract: A sequencer for assembling into a transferee magazine predetermined numbers of fixtures from a predetermined plurality of transferor magazines, each of which transferor magazines is adapted to hold a plurality of fixtures. Each of the fixtures stacked in a transferor magazine holds an integrated circuit (IC) chip of the same type. The transferor magazines are removably mounted on transferor bases mounted on a support member. Positoning means are also mounted on the support member and a transferee magazine is removably mounted on a transferee base secured to the positioning means. A transfer mechanism is mounted on the positioning means to transfer a fixture from a transferor magazine to the transferee magazine when the transferee magazine is in fixture transfer position with respect to a transferor magazine.

Abstract: A magazine into which a plurality of fixtures holding integrated circuit chips can be inserted serially by a machine and from which the fixtures can be removed serially by a machine. The fixtures are loaded through an opening in the bottom of the magazine and are removed from the magazine through the same opening. The magazine provides protection to the fixtures and chips held by the fixtures during storage and handling encountered in the typical manufacturing environment for electronic systems. The magazine facilitates automating the processes of accumulating fixtures holding integrated circuits of a given type and of assembling in one magazine the desired number of fixtures holding integrated circuit chips of the appropriate types preparatory to mounting the chips on a multilayer substrate.

Abstract: A warp-resistant heat sink suitable for soldering to one side of a relatively fragile, ceramic semiconductor substrate comprises a plate of heat-conducting material having a plurality of slits along two sides thereof, and a plurality of U-shaped heat-conducting members each of which extends through a respective one of the slits in the plate. The U-shaped heat-conducting members are soldered to the same side of the plate, the members along one edge of the plate being off-set with respect to the members along the opposite side of the plate in order to increase the heat transfer efficiency when air is forced through the heat sink. The plate material is selected so as to have a substantially identical thermal coefficient of expansion as that of the substrate material.

Abstract: A liquid cooled heat exchanger particularly adapted to cool heat sinks of an electrical power supply for large electronic systems. The heat exchanger has thin flexible walls. Pressure of the coolant within the heat exchanger assures a positive mechanical contact between the heat exchanger and the heat sink, one that can accommodate changes in dimensions of the heat sink or heat exchanger and a lack of planarity of the surfaces of the heat sink without increasing the thermal impedance between the liquid in the heat exchanger and the heat sink. Fluid flow within the heat exchanger is controlled so that heat transfer efficiency between certain areas of the flexible walls and the coolant is maximized, which areas are proximate to the heat sources mounted on the heat sink.

Abstract: A fixture for a segment of a film strip having a flexible beam lead frame mounted on the segment and an integrated circuit chip bonded to inner portions of the leads of the lead frame. The fixture is provided with an aperture so that when a segment is held by the fixture, the aperture provides access to the integrated circuit chip and a portion of the lead frame so that the chip and a part of the lead frame may be removed from the fixture prior to the chip being mounted on a substrate. The fixture protects the chip and its lead frame from damage during various manufacturing processes such as testing, sorting, and accumulating the proper number and types of chips prior to their being mounted on a substrate while facilitating automation of these processes.

Abstract: A circuit circuit tester is provided for testing circuit runs of a circuit board for electrical continuity and electrical shorts. An electrical probe connected to one side of a capacitance meter is used to contact a particular circuit run, and an electrically conductive plate connected to the other side of the capacitance meter is maintained co-planar with and in close proximity to the circuit board to provide a suitable ground in the electrical test circuit, the capacitance of which circuit is a function of the electrical integrity of the circuit run. The measured capacitance is compared to a predetermined capacitance value for an identical circuit run of known acceptable quality to determine the electrical integrity of the tested circuit run.

Abstract: An apparatus is disclosed for calling a microinstruction stored in main memory while another microinstruction from main memory is executing, thus permitting an overlap of the executing phase with the call phase of an instruction. A hardware sequencer examines predetermined characteristics of an executing microinstruction and takes appropriate action in response to such examination.

Abstract: A multiple-generating register generates one of several possible multiples of a binary number which is input thereto in response to a respective one of a plurality of multiple-generating commands. The multiple-generating register comprises a control circuit for generating the multiple-generating commands in response to a three-bit control signal and comprises further a plurality of selector latch logic circuits. Each selector latch logic circuit receives as a first input a respective bit of the input binary number and receives as a second input the next lowest order bit of the input binary number, except that the selector latch logic circuit which receives as a first input the lowest order bit of the input binary number receives as a second input a zero-valued binary bit. The plurality of selector latch logic circuits generate a binary number that is a multiple of the input binary number, which multiple is equal to the input binary number times .+-.1, .+-.

Abstract: A method of fabricating conductivity connected charge-coupled devices (C4D's) is disclosed wherein N+ barriers are ion-implanted in an N-type substrate and wherein P++ conductivity connecting regions are formed by diffusion of impurity atoms into the substrate. The process is compatible with the known silicon gate process, enabling semiconductor devices of other types and with different thresholds to be formed on the substrate at the same time the C4D's are fabricated.