Abstract: A method for interconnecting a waveguide (102), an optoelectronic component 101, and an electronic component (103). A first surface (108) is formed from a portion of cladding region(107) and a second surface (109) is formed from a portion of core region and a portion of the cladding region. A substrate (104) having electrical tracings (212', 213') is attached to the waveguide (102) so that an electronic component receiving area (111') and an optoelectronic component area (112') are attached to the first and second surface (108, 109) of the waveguide (102) respectively. An electronic component (103) and an optoelectronic component (101) are mounted to the electronic component receiving area (111') and the optoelectronic receiving area (112') respectively.

Abstract: A method and apparatus are provided for making a continuous wire bond (139) around an angle of a workpiece (101). A pivotal stage (110) having clamp assembles (104, 107) are mounted onto a base (102). A workpiece (110) is placed and secured in clamp assemblies (104, 107). A first wire bond site on a first surface is selected and formed. Workpiece (110) is pivotally rotated to a second surface position at an angle to the first surface where a second wire bond site is selected and formed, thereby making a continuous wire bond from the first selected site to the second selected site.