Abstract: One or more MIC's (microwave integrated circuits) are included in an assembly having a structurally continuous ground plane of conductive material for the microwave circuitry. Individual MIC's are mounted on a carrier and attached thereto by a layer of a dielectric adhesive. The adhesive is in contact with and interposed between the lower side of each MIC substrate and the carrier which may be, for example, a metal chassis. The carrier serves as, or includes, the structurally continuous ground plane of conductive material. Ground plane metallization on the lower side of MIC substrates is thereby made unnecessary. The dielectric adhesive may be maintained in a liquid or tacky state to permit convenient removal from the assembly of an MIC requiring rework or replacement. In addition, the layer of dielectric adhesive provides a thermally conductive path between an MIC and the carrier making the invention particularly well suited for MIC assemblies which are intended to be operated in a vacuum.

Abstract: A semiconductor image sensor comprises an array of charge collection elements buried within the semiconductor for collecting charge photogenerated in response to the image. This sensor is easily configured to discern changes in an image. One or more charge transfer devices (CTD's) of an array are associated with each column of charge collection elements. For readout, the charge collected by each charge collection element is transferred to an associated storage cell of an array CTD associated with the column in which that charge collection element is disposed.For discernment of moving targets or image changes, a difference between the charge collected by a given charge collection element during a first frame and a second frame is determined.

Abstract: An electrically and thermally conductive adhesive containing a metal alloy dispersed in a resin is disclosed. The composition of the adhesive may include a resin mixture and a gallium-metal alloy. The composition is very stable, is a liquid at room temperature and cures at a relatively low temperature with excellent adhesion and conduction properties and is resistant to relatively high temperatures.

Abstract: A monolithic multiple magnetic layer composite comprising a substrate of a magnetic-wave-inactive material and a layer of magnetic-wave-active material deposited on each of the two opposing sides of the substrate. The composition and, consequently, the internal magnetization of each layer of magnetic-wave-active material is different from that of the other layer. The composite can be used in a magnetostatic surface wave delay line having a ground plane and means for providing a uniform bias magnetic field for the composite. Along with the geometrical parameters of the composite and the delay line, the internal magnetizations of the two layers of magnetic-wave-active material are preselected to provide a time-delay versus frequency characteristic for the delay line which is either approximately linearly dispersive or nondispersive.

Abstract: A multilayer dielectric mirror wherein the mirror substrate is of garnet. Chemical-mechanical final polishing of the substrate provides a surface relatively free of inhomogeneous strain for the deposition thereon of relatively homogeneous individual layers for a multilayer dielectric mirror coating.

Abstract: A monometallic batch process for forming beam leads of a preferred metal such as aluminum or gold. The process is applied to a wafer of finished microelectronic devices already having metal contact pads of the same preferred metal. Where aluminum is the desired metal, high deposition rates are used to minimize aluminum oxide contamination. High yield is achieved by forming the beam leads to have an elevated cantilevered configuration, by deep scribing of the wafer and, when desired, by providing an energy absorbing cushion to reduce the effect of collisions between chip edges and beam leads.

Abstract: A method for attaching a silicon-on-sapphire (SOS) device to a gold-plated surface of a package for the device. A layer of a metal adherent to both sapphire and gold such as, for example, tungsten, is deposited on the back side of a wafer of the devices. A layer of gold is then deposited on the tungsten layer. A preform of an alloy compatible with gold, such as gold-germanium, interposed between and in contact with the die and the package, is heated and then cooled to bond the die to the surface of the package.

Abstract: Apparatus for providing alternating current electrical energy to a load wherein an alternating current energy source includes one or more direct current energy sources coupled to one or more inverters each having at least one switching element therein. Switching elements are controlled to provide alternating current waveforms having a relatively low harmonic content. A preferred embodiment has two alternating current sources. The two alternating current sources are coupled to the load in a manner which causes their output voltages to be summed vectorially across the load. The phase difference between the output voltages of the two sources is controlled to regulate the resultant load voltage by controlling the operation of the switching elements in the inverters.

Abstract: An oscillator for operation in the frequency range from about 2 GHz to at least 18 GHz using a magnetostatic surface wave delay line as a frequency control element in a feedback loop connected around an amplifier. The oscillator is tunable by varying the magnetic field intensity at the magnetostatic surface wave propagating medium and by varying the distance between input and output rf couplers along the propagation surface.

Abstract: Monolithic acoustoelectric imager using a multistrip coupled convolver. The multistrip coupler of the convolver senses the electric fields associated with counter-propagating surface acoustic waves on a piezoelectric film. The interaction product of the sensed electric fields scans a screen including one or more strips of radiation-sensitive semiconductor material and the convolver output is modulated by the varying intensity of illumination from an image projected onto the screen.

Abstract: A treated copper surface for bonding, using adhesive such as epoxy glass, in applications such as multilayer circuit boards. The copper surface is covered with a thin layer of chromium having a roughened (etched) outer surface. The chromium layer precludes chemical reactions which destroy the polar groups of epoxy molecules and which thereby cause delamination of copper-epoxy bonds. The etched surface greatly enhances the bond strength by providing a roughened cracked surface which provides a strong mechanical bond. Copper surfaces treated in this manner form epoxy glass bonds having tensile strengths of about 2750 psi.

Abstract: A composite comprising a flexible substrate structure including a base and support members projecting therefrom; a network of resistor segments; a conductor network interposed between the resistor network and the base of the substrate structure for cooperating with the projecting support members of the substrate structure to support the resistor segments and for supplying power to the resistor segments; and, a backup board affixed to the substrate on the side thereof opposite the resistor segments. The composite can be used, e.g., as the printing element in thermal print heads. The resistor network can be formed on top of the conductor network by casting the flexible projecting support members on the base between the conductors flush with the outer surfaces of the conductors for supporting the resistor network thereon. Alternatively, the projecting support members and the base can be formed as one piece.