Patents Represented by Attorney Hinman, Howard & Kattell, LLP
  • Patent number: 8333262
    Abstract: A reconfigurable, modular ergonomic sit harness or saddle for use by linesmen, arborists, or the like includes a gender-specific back pad assembly that supports a number of removable, optional attachments allowing customization for user preference or job environment. Gender-specific angled wing portions of the back pad contain an armor layer and extra padding to protect the bony protrusions of both the male and female pelvis. A “one size fits all” approach includes a waistband having length adjustability over approximately a 3:1 range. Each component and sub-system of the sit harness is ergonomically designed to maximize comfort and minimize stresses on a user's body. The back pad features interchangeable lumbar support pads. Optional, removable features include a seat, an abdominal support, and a body harness for use with a fall restraint device. Interchangeable suspension bridges allow user attachment to a wide range of support systems.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: December 18, 2012
    Assignee: Buckingham Manufacturing Company, Inc.
    Inventors: Amanda Carpenter, Edgar P. Carpenter, Christopher A. de la Vera, Scott Hall, James J. Rullo
  • Patent number: 8311313
    Abstract: An imaging inspection machine for inspecting objects located within articles, with the imaging inspection machine having an inspection location for articles having a quantity of objects located along a path of travel through an inspection location located within the imaging inspection machine. Imaging inspection devices are positioned on the frame and adapted for directing beams through articles as articles move through the inspection location within the imaging inspection machine. As a result of inspecting the articles, output signals are applied to a processing and analysis assembly which performs only simple table lookups into an appropriately formed table and one multiplication for each pixel to correct nonlinearities matched by a cubic polynomial.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: November 13, 2012
    Assignee: SureScan Corporation
    Inventor: Thomas D. Gamble
  • Patent number: 8299371
    Abstract: A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: October 30, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr.
  • Patent number: 8288266
    Abstract: A method of making a circuitized substrate in which the substrate includes circuit elements having exposed surfaces defined by two thin layers of permanent photoimaged solder mask material which are applied through fine mesh screens. The use of two thin layers assures effective coverage of the material to precisely expose the desired surfaces in high-density circuit patterns. A circuitized substrate assembly and an information handling system adapted for having one or more such assemblies therein are also provided.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: October 16, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Norman A. Card, Richard A. Day, John J. Konrad
  • Patent number: 8288857
    Abstract: A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: October 16, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, Voya R. Markovich, James J. McNamara, Jr., Mark D. Poliks
  • Patent number: 8272533
    Abstract: A device for dispensing cutlery utensils individually, having a housing containing a quantity of utensils with the housing having sides and product guides within. The front wall contains an opposing leaf escapement mechanism connected to it, to hold and singulate the utensils such that they dispense seriatim, without a user being required to physically touch or interface with any part of dispenser other than the actual desired utensil.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: September 25, 2012
    Inventors: Anthony D'Amelia, Mark V. Pierson
  • Patent number: 8262408
    Abstract: A structure for the back end of repairable connectors, applicable for a variety of RF connectors, that facilitates superior mechanical and electrical characteristics of the resulting coax cable assembly. Also disclosed is a method of attaching one of various repairable connectors to coax cable that is both simple and stronger than existing methods. The outside insulation is removed from the end of the cable and the braiding is folded back out of the way. Depending on the number of layers of braiding, this step may be performed more than once. The dielectric surrounding the center conductor is then trimmed to expose the conductor. In one embodiment, a pin is soldered in-line with the center conductor. The connector is then placed on one end of the prepared cable and the braiding is unfolded. A band is then applied to secure the braiding against the connector, making a strong bond.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: September 11, 2012
    Assignee: Distinct Intuitive Designs, LLC
    Inventor: Mark A. Kelly
  • Patent number: 8247703
    Abstract: A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: August 21, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich
  • Patent number: 8245392
    Abstract: A method of making an electronic package designed for interconnecting high density patterns of conductors of an electronic device (e.g., semiconductor chip) and less dense patterns of conductors of hosting circuitized substrates (e.g., chip carriers, PCBs). In one embodiment, the method includes bonding a chip to a single dielectric layer, forming a high density pattern of conductors on one surface of the layer, forming openings in the layer and then depositing metallurgy to form a desired circuit pattern which is then adapted for engaging and being electrically coupled to a corresponding pattern on yet another hosting substrate. According to another embodiment of the invention, an electronic package using a dual layered interposer is provided. Also provided are methods of making circuitized substrate assemblies using the electronic packages made using the invention's teachings.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: August 21, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Timothy Antesberger, Frank D. Egitto, Voya R. Markovich, William E. Wilson
  • Patent number: 8240959
    Abstract: A geosynthetic tufted drain barrier (GTDB) for preventing vertical migration of fluids. On a substantially impermeable woven or non-woven continuous layer is disposed a membrane. The tensile strength of the impermeable layer is at least 5 lbs/lineal ft (3.0 kg/lineal m). The permeability of the membrane is no greater than 10?4 cm/sec. Tufted tensile elements are attached to the membrane, each one being attached to the membrane at a density of at least 25 tufted tensile elements per square foot (30 square cm). The tufted tensile elements are formed in rows and are disposed at a density of at least four rows per square foot (30 square cm). Infill material can be introduced to the tufted tensile elements. The drain barrier may be constructed with integrated letters, logos, and signage and one or more colors.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: August 14, 2012
    Assignee: Turf Services, Inc.
    Inventors: Charles Rhoades, Peter J. Ianniello
  • Patent number: 8240031
    Abstract: A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: August 14, 2012
    Assignee: Endicott International Technologies, Inc.
    Inventors: Voya R. Markovich, Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das, William E. Wilson, Rajinder S. Rai
  • Patent number: 8231132
    Abstract: A heavy duty wheelbarrow/yard cart with two vertical fixed front wheels and one or two rear caster wheels for steering. An ergonomic pushbar handle is bolted to the frame and allows it to be pushed or lifted to dump the material. A brake keeps the wheelbarrow from moving on sloped terrain.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: July 31, 2012
    Inventor: Ronald Louis DiLorenzo, Sr.
  • Patent number: 8215557
    Abstract: A low profile, color-based counting system. A housing has a light source, such as a matrix of LEDs, preferably disposed in the housing for generating electromagnetic radiation upwardly. A removable, translucent tray is disposed above the light source. A second light source can be added above the tray, directing light downwardly thereto. A color camera is mounted on the housing and above the removable translucent tray.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: July 10, 2012
    Assignee: Innovation Associates, Inc.
    Inventors: Mary Reno, Doyle M. Jensen, Joseph H. Boyer, William Bennett, James G. McGonigal, Mark D. Jones, Todd E. Bower, Alecia K. Lashier, Fletcher Chapin, Jr., Yan L. Liang, John P. Boyer
  • Patent number: 8211790
    Abstract: A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: July 3, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papathomas, Mark D. Poliks
  • Patent number: 8196889
    Abstract: Introduced Disposition In Support For Plasma Television Sets And Its Similar, idealized in the form of a practical and functional support kit for holding plasma or LCD (‘liquid crystal display’) television sets, belonging to the field of mechanics, and to which was given an original manufacturing disposition, by consisting of a set of television set (1) fixing elements, formed by two or more hinged disks (2), two or more supports (3) and two or more catches or wedges (4), besides the standard screws M4, M5, M6 or M8 (P), screws with corresponding sleeves and washers, that promote the installation in independent fixing points, thus making the model universal, easily adaptable, and not needing the previous determination of the perforations contained on the television set, in the VESA standards, at the time of acquisition of the support kit.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: June 12, 2012
    Inventor: Carlos Sangiuliano
  • Patent number: 8143530
    Abstract: A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of each PTFE layer. A layer of liquid crystal polymer (LCP) is placed on both layers of etched copper foil. An external layer of etched copper foil is placed on the external surface of the LCP layers.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: March 27, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, Michael Rowlands
  • Patent number: 8144480
    Abstract: A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: March 27, 2012
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Irving Memis, Steven G. Rosser
  • Patent number: 8139863
    Abstract: A system that offers a method of capturing, analyzing, and visualizing a matrix of data for object and feature extraction. This is accomplished by reading a matrix of data represented by a plurality of data types into a processor via a data capture system. The matrix of data is overlaid by a control grid to form a regular matrix having a plurality of cells. A data search spatial radius is created from a point in each cell. Data is then processed from the matrix and certain characteristics are captured and represent each variable in each cell of the matrix, and then output, respectively.
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: March 20, 2012
    Inventor: Shin-yi Hsu
  • Patent number: 8112936
    Abstract: A container-based plant husbandry apparatus and a horticultural environment designed to optimize growth of plants therein. A liquid-tight container is filled to a first, predetermined height with a first media that, while providing support to an upper layer, is substantially liquid saturated. A second layer of growing media is physically placed upon and supported by the first media. Consequently, a wet zone and a dry zone are defined and established. The wet zone never encroaches the dry zone. An irrigation system adds water and/or nutrients. A controlled horticultural environment specifically designed for use with the containers is provided. The environment optimizes all environmental factors such as temperature, humidity, and light cycles in a controlled, sterile environment where pests, molds, fungus, and other hindrances to maximal plant growth may be effectively controlled if not eliminated.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: February 14, 2012
    Inventors: Andy Eugene Maslin, Brooks Alan Washburn
  • Patent number: 8018348
    Abstract: An electrical circuit tracing apparatus wherein uniquely identifiable electrical signals are injected into deenergized electrical circuits at a circuit breaker panel. Once the apparatus is electrically connected to multiple deenergized branch circuits, a user may connect a circuit analysis box to successive electrical outlets. The circuit analysis box contains a readout that indicates the circuit number (i.e., 1-n, where n is the number of branch circuits simultaneously testable by the apparatus to which the particular electrical outlet is connected). If a particular electrical outlet is accidentally connected to more than one branch circuit, all of the circuits to which the analyzer box is connected are identified.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: September 13, 2011
    Inventor: David Pagnani