Patents Represented by Attorney Hinman, Howard & Kattell, LLP
  • Patent number: 7942799
    Abstract: A knee joint flexure progression meter and system. The knee joint flexure meter has an elongated progression meter bar with a major axis, an upper surface, a lower surface having a longitudinal recess therein, and a plurality of spaced apart indicia disposed on the upper surface thereof. A crossbar is disposed perpendicularly to the progression meter bar major axis. The crossbar is both adjustable and removable with respect to the progression meter bar. The crossbar is dimensioned smaller than the recess in the progression meter bar, so that the crossbar can be contained within the recess. A mechanism is provided for containing the crossbar within the progression meter bar for transportation or temporary storage.
    Type: Grant
    Filed: October 12, 2009
    Date of Patent: May 17, 2011
    Inventor: Gary G. Boyd
  • Patent number: 7908587
    Abstract: A method for a system control to automatically provide highly reliable calculations and decisions based on information from sources of input whose timing is less than reliable. With application of the method in a familiar environment, the program optimally and automatically suspends the execution of decisions or calculations until such time as a reliable set of input conditions can be confirmed. The method allows the use of existing computer language constructs with no need to address time-lagging, random input or intermittent device operation. With the use of the method a system automatically gains high reliability.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: March 15, 2011
    Inventor: Lee B. Knox
  • Patent number: 7892016
    Abstract: An electrical wire connector. In a housing is disposed metal bushings in which wires are inserted. The bushings are embedded in the insulation cap for permanent placement. The bushings are connected via a bridge to carry current from bushing to bushing. The insulation cap top openings are shaped with bell mouths for easy insertion of electrical wires. Each metal bushing has cutting lances to strip the wires as they are inserted into the connector. Pressure lances secure each wire in position. A spring loaded tab is provided for additional contact.
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: February 22, 2011
    Inventor: Hans Spalholz
  • Patent number: 7890574
    Abstract: An Internet-based operating system providing data and application software stored on a server that may be selectively downloaded to a client device upon request, allowing server-based applications to be accessed and executed on the client device. The end user, operating a client device may access a wide variety of application software with no need to purchase, install, and maintain the software on his machine. Using an easy-to-use GUI, a user selects an application, opens existing or creates new files. The application executable code is identified by a link embedded in a stream of markup language, typically XML. The operating system allows complex applications to be executed on thin clients having limited memory/storage capacity.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: February 15, 2011
    Inventor: Brent J. Angeline
  • Patent number: 7833959
    Abstract: The present invention relates to a method to decrease the flammability of normally flammable alcohols and solvents. The additive is Alpha Terpineol, which will increase the flash point of flammable alcohols or solvents, by blending the Terpineol into the flammable solvent or alcohol. Solvents such as acetone, methanol, ethylacetate, ethanol and xylene, to name a few, increases flash points by 50° C. to 60° C., by addition of 12-14% terpineol. The said solvent can then be blended with other organic solvents to produce performance solvents, such as paint strippers with flash points greater than 140° F. and meet Federal and state Volatile Organic Compound regulations.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: November 16, 2010
    Assignee: Tarksol International LLC
    Inventor: A. Richard Koetzle
  • Patent number: 7803688
    Abstract: A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: September 28, 2010
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, Frank D. Egitto, John M. Lauffer, How T. Lin, Voya R. Markovich
  • Patent number: 7607610
    Abstract: An ornithopter having segmented, flapping wings and capable of bird-like flight. A main drive system provides flapping motion to the wings. Servo systems are provided for independently moving each wing forward and backward along a major axis of the aircraft fuselage, thereby providing a balance subsystem. A single servomechanism controls upward and downward direction of the wings thereby providing a center angle control subsystem. Two additional servo systems are provided to control a tail assembly that provides steering and other ancillary control functions. Each subsystem is controlled by a dedicated, onboard microcontroller. One embodiment of the aircraft is remotely controlled by a wireless data communication link. The aircraft may be constructed to resemble a natural bird, in both static appearance and flight characteristics. The aircraft may be scaled from model size to a full-size, passenger carrying aircraft.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: October 27, 2009
    Inventor: Robert Sterchak
  • Patent number: 7571151
    Abstract: A system for organizing data in multiple text data files and for automatically parsing data directly into named variables within a single, user-configurable graphical user interface (GUI) or workspace. Results organization, analysis algorithms, and file viewing all take place from within the workspace. No apriori knowledge of the dimensionality or length of data is required. Results may readily be placed into reports. Multiple data files may be processed using batch commands. Metafile capability is provided wherein data within a first level file may be the name of another data file allowing cascaded processing of data files. This unification of a user-configurable workspace, an integrated file viewing method and a parsing method minimizes distraction to a researcher allowing him or her to focus on analysis of experimental data rather than on the mechanics of data processing. The system of methods interacts with third party data analysis application software packages.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: August 4, 2009
    Assignee: Gneiss Software, Inc.
    Inventor: Norman Fontaine
  • Patent number: 7478472
    Abstract: A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: January 20, 2009
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, Voya Markovich, Corey Seastrand, David L. Thomas
  • Patent number: 7470990
    Abstract: A circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof. An electrical assembly and a method of making the substrate are also provided, as is an information handling system (e.g., computer) incorporating the circuitized substrate of the invention as part thereof.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: December 30, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Robert M. Japp, Irving Memis, Kostas I. Papathomas
  • Patent number: 7429510
    Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. Photoimageable material is used to facilitate positioning of the capacitive dielectric being printed. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: September 30, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, How T. Lin, Voya R. Markovich
  • Patent number: 7429789
    Abstract: A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such dielectric layer and at least one conductive layer thereon is also provided.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: September 30, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Robert M. Japp, Voya R. Markovich, Kostas I. Papathomas
  • Patent number: 7384856
    Abstract: A method of forming a capacitive substrate in which first and second conductors are formed opposite a dielectric, with one of these electrically coupled to a thru-hole connection. Each functions as an electrode for the resulting capacitor. The substrate is then adapted for being incorporated within a larger structure to form a circuitized substrate such as a printed circuit board or a chip carrier. Additional capacitors are also possible.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: June 10, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich, James T. Matthews
  • Patent number: 7383629
    Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: June 10, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, Voya R. Markovich, Michael Wozniak
  • Patent number: 7381587
    Abstract: A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.
    Type: Grant
    Filed: January 4, 2006
    Date of Patent: June 3, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Robert M. Japp, John M. Lauffer, Voya R. Markovich, William E. Wilson
  • Patent number: 7377033
    Abstract: A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: May 27, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John M. Lauffer, James M. Larnerd, Voya R. Markovich
  • Patent number: 7354197
    Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: April 8, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
  • Patent number: 7348677
    Abstract: A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.
    Type: Grant
    Filed: April 5, 2006
    Date of Patent: March 25, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: James M. Larnerd, John M. Lauffer, Voya R. Markovich, Kostas I. Papathomas
  • Patent number: 7343674
    Abstract: A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is placed over one of the openings and a quantity of conductive paste is positioned thereon prior to bonding the substrates. At least some of the paste is then forced up into an opening in the other substrate as a result of the bonding.
    Type: Grant
    Filed: February 9, 2006
    Date of Patent: March 18, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: James W. Fuller, Jr., John M. Lauffer, Voya R. Markovich
  • Patent number: 7342183
    Abstract: A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: March 11, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Frank D. Egitto, Voya R. Markovich, Luis J. Matienzo