Abstract: An electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1,500 ?m (or more) to 20,000 ?m in an electrolytic copper plating method employing a phosphorous copper anode. Upon performing electrolytic copper plating, an object is to provide an electrolytic copper plating method of a semiconductor wafer for preventing the adhesion of particles, which arise at the anode side in the plating bath, to the plating object such as a semiconductor wafer, a phosphorous copper anode for electrolytic copper plating, and a semiconductor wafer having low particle adhesion plated with such method and anode.

Abstract: The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching a metal surface, preferably an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The compositions are effective in maintaining their etching capacity and in removing smut produced by the etching of a surface as well as in general cleaning.

Abstract: Provided is an amorphous film comprised substantially of indium, tin, magnesium and oxygen, and containing tin at a ratio of 5 to 15% based on an atomicity ratio of Sn/(In+Sn+Mg) and magnesium at a ratio of 0.1 to 2.0% based on an atomicity ratio of Mg/(In+Sn+Mg) with remnant being indium and oxygen, and having a film resistivity of 0.4 m?cm or less as a result of crystallizing the film by annealing the film at a temperature of 260° C. or lower. An amorphous ITO thin film for use as a display electrode and the like in flat panel displays is obtained by way of sputter deposition without heating the substrate and without the need of adding water during the deposition. This amorphous ITO film has the property of being crystallized by annealing at 260° C. or lower, which is not such a high temperature, and having low resistivity after crystallization. Also provided are a method of producing the film and a sintered compact for producing the film.

Abstract: A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.

Abstract: In a chain transmission, the link plates of a roller chain or rollerless bushing chain are formed with pairs of teeth. A sprocket has a central set of sprocket teeth for meshing with the rollers or bushings, and sets of side sprocket teeth for meshing with the teeth of the link plates. The teeth of the link plates function as a silent chain. After an inner flank of a link plate tooth comes into contact with a side sprocket tooth, a roller and an outer flank of the link plate tooth are seated on the sprocket.

Abstract: In endoscopic surgery, a retractor having independently spreadable retractor blades mounted at the distal end of a tube is introduced percutaneously. A balloon dissector is passed through the tube and expanded. Following dissection by expansion of the balloon, the balloon is contracted, the tube is advanced, and the dissected tissue is spread by moving the blades apart from each other. The balloon dissector is withdrawn and another instrument is then introduced to carry out surgery on the anatomical structure exposed by the dissection and spreading steps.

Abstract: A first copper alloy sputtering target comprising 0.5 to 4.0 wt % of Al and 0.5 wtppm or less of Si and a second copper alloy sputtering target comprising 0.5 to 4.0 wt % of Sn and 0.5 wtppm or less of Mn are disclosed. The first and/or the second alloy sputtering target can further comprise one or more elements selected from among Sb, Zr, Ti, Cr, Ag, Au, Cd, In and As in a total amount of 1.0 wtppm or less. A semiconductor element wiring formed by the use of the above targets is also disclosed. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics.

Abstract: A hafnium alloy target containing either or both of Zr and Ti in a gross amount of 100 wtppm-10 wt % in Hf, wherein the average crystal grain size is 1-100 ?m, the impurities of Fe, Cr and Ni are respectively 1 wtppm or less, and the habit plane ratio of the plane {002} and three planes {103}, {014} and {015} lying within 35° from {002} is 55% or greater, and the variation in the total sum of the intensity ratios of these four planes depending on locations is 20% or less. As a result, obtained is a hafnium alloy target having favorable deposition property and deposition speed, which generates few particles, and which is suitable for forming a high dielectric gate insulation film such as HfO or HfON film, and the manufacturing method thereof.

Abstract: The present invention provides methods of inducing contraception which includes delivering to a female a composition containing a compound of formula I, or tautomers thereof, in a regimen which involves delivering one or more of a selective estrogen receptor modulator, wherein formula I is: and wherein R1-R5 and Q1 are defined as described herein. Methods of providing hormone replacement therapy and for treating carcinomas, dysfunctional bleeding, uterine leiomyomata, endometriosis, and polycystic ovary syndrome is provided which includes delivering a compound of formula I and a selective estrogen receptor modulator are also described.

Abstract: Provided is a hybrid silicon wafer comprising a structure in which a single-crystal wafer is embedded in a sintered polysilicon wafer. Also provided is a method for manufacturing a hybrid silicon wafer having a structure in which a single-crystal wafer is embedded in a sintered polysilicon wafer, wherein a part of the sintered polysilicon is hollowed, a single crystal ingot is inserted into the hollowed portion, these are mutually bonded through thermal diffusion bonding based on HIP to prepare a complex of the sintered polysilicon and the single-crystal silicon ingot, and the complex is sliced. Thereby provided are a hybrid silicon wafer comprising functions of both the polysilicon wafer and the single-crystal wafer, and a method for manufacturing such a hybrid silicon wafer.

Abstract: A recombinant vector comprises simian adenovirus SAdV-31 sequences and a heterologous gene under the control of regulatory sequences. A cell line which expresses simian adenovirus SAdV-31 gene(s) is also disclosed. Methods of using the vectors and cell lines are provided.

Abstract: Provided is an adsorbent adapted to adsorb carbon dioxide by increasing the pressure, and to carry out 10% or more adsorption and adsorption of the adsorbed carbon dioxide by lowering the pressure at atmospheric pressure or higher in a range of 100 to 900 kPa without vacuuming or the like. As a result of using amorphous aluminum silicate with a Si/Al ratio of 0.7 to 1.0 and having a peak in the vicinity of ?78 ppm and ?87 ppm in a 29Si solid NMR spectrum, adsorption and desorption of 10 wt % or more can be performed in a range of 100 to 900 kPa, and this can be used as a carbon dioxide adsorbent mainly in the pressure swing adsorption method.

Abstract: Pharmaceutical compositions and kits useful for the treatment of cancer include certain alkyl esters of cystine and certain alkyl-substituted cystamine derived esters, including, for example, cystine dimethyl ester and a di-alkyl peptidyl cystamine ester, among others. These compounds may be employed in methods of treating cancers or methods of determining sensitivity of certain cancer cells to apoptosis alone, or in combination with other chemotherapeutic, radiological or apoptotic agents.

Abstract: Methods are provided which minimize loss of an anti-icing/de-icing composition from a surface. This is accomplished by adhering the anti-icing/de-icing composition to a surface using a film-forming polymeric composition. Methods are also provided for preventing snow accumulation and/or ice formation on a surface, delaying ice and/or snow formation on a surface, extending the life of an anti-icing/de-icing composition on a surface, surface anti-icing, and surface de-icing. These methods include the application of a film-forming polymeric composition and the anti-icing/de-icing composition to the surface. Desirably, the anti-icing/de-icing composition is a reagent which reduces the freezing point of water.

Abstract: In a chain transmission using a hybrid chain having inner and outer links with bushings, or with bushings and rollers, the rollers mesh with a central sprocket, and the link plates have teeth that function as a silent chain, meshing with side sprockets fixed to the central sprocket. The teeth of the link plates of the inner links have a shape different from that of the teeth of the link plates of the outer links. The outer flanks of the teeth can all have the same shape, and the shape difference can be in the shapes of the inner flanks.

Abstract: A manufacturing method of ultrahigh purity copper is provided wherein, upon subjecting copper to high purification with the electrolytic method, an anode and a cathode are partitioned with an anion exchange membrane, anolyte is intermittently or continuously extracted and introduced into an active carbon treatment vessel, a chlorine-containing material is added to the active carbon treatment vessel so as to precipitate impurities as chloride, active carbon is subsequently poured in and agitated so as to adsorb the precipitated impurities, the adsorbed impurities are removed by filtration, and the obtained high purity copper electrolytic solution is intermittently or continuously introduced into the cathode side and electrolyzed. This technology enables the efficient manufacture of ultrahigh purity copper having a purity of 8N (99.999999 wt %) or higher from a copper raw material containing large amounts of impurities.

Abstract: Provided is a copper anode or a phosphorous-containing copper anode for use in performing electroplating copper on a semiconductor wafer, wherein purity of the copper anode or the phosphorous-containing copper anode excluding phosphorous is 99.99 wt % or higher, and silicon as an impurity is 10 wtppm or less. Additionally provided is an electroplating copper method capable of effectively preventing the adhesion of particles on a plating object, particularly onto a semiconductor wafer during electroplating copper, a phosphorous-containing copper anode for use in such electroplating copper, and a semiconductor wafer comprising a copper layer with low particle adhesion formed by the foregoing copper electroplating.

Abstract: A package for storing and dispensing tablets includes a blister card having blister compartments and a hollow plastic sleeve providing a protective housing for the blister card when the blister card is in a storage position within the sleeve. The sleeve includes a pair of latches that extend toward the blister card, and the blister card includes a pair of latch-catchers for cooperatively engaging and catching the latches when the blister card is in a storage position to automatically lock the blister card in the storage position within the sleeve when the blister card is slid to the storage position. The sleeve also includes a deactivator positionable between a first position in which the blister card is permitted to automatically lock to the sleeve when the blister card is slid to the storage position and a second position for preventing the blister card from becoming locked to the sleeve.

Abstract: A protective plate assembly comprises a plurality of overlapping rigid plates (1, 2, 3) for covering a wearer's chest and abdomen, the plates being attached together such that the amount of overlap between successive plates is variable. Elements (13, 16) of compressible material are provided, distributed on an inner side of the assembly, such that when the amount of overlap between the plates (1, 2, 3) increases, the elements move closer together in the direction in which said overlap increases, and vice versa. Two adjacent plates of the assembly are attached to each other by means of a peg (12) extending from one of said plates, which peg is captive within a slot (9) on the other of said plates, the slot running substantially perpendicular to the overlapping edges of the plates.