Abstract: A vertical support shaft projects down from the underside of a telephone booth shelf and supports the inner end of an arm swivelable horizontally about the shaft. The outer end of the arm is hingedly coupled to a telephone directory binder so that the binder is pivotable about a horizontal axis at such end and transverse to the arm's centerline. The binder's centerline is parallel to a reference line passing through such axes at an acute angle b. When the arm is on "in" position the binder is stored beneath the shelf in primary alignment with its width. When the arm is pulled out and the binder is pivoted out, up and over, the binder goes through a motion equivalent to an angular displacement of 2b to come to rest face-up with an alignment parallel to its former widthwise alignment.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A jacketed telephone cord is jacketed with a clear, flame retardant, stable composition which essentially does not exhibit vertical burn characteristics comprising an all phosphate plasticized PVC stabilized with the combination of a metallic stabilizer and a cycloaliphatic epoxy.

Abstract: In a method for making a printed circuit board employing an aqueous type photoresist and including etching of the substrate surface with chromic acid after application of the photoresist mask, chromium is washed from the surface with a reducing agent at a pH of .ltoreq.10.

Abstract: A method of plating a ductile Ni-Sb alloy on a substrate from a solution containing a Ni salt and a mixed alkali metal-antimony salt comprises pulse plating wherein the off-time is much longer than the on-time.

Abstract: An article of manufacture comprises an electronic device having a silicone resin encapsulant thereover, wherein the silicone resin is an oxime and water free formulation derived from curing a mixture consisting essentially of a heat curable silicone elastomer prepolymer and a dialkylaminoalkoxysilane. The mixture may also contain fillers and a small amount of curing catalyst and stabilizer.

Abstract: A solder flux comprises rosin, an activator, an optional surfactant and the dimer of linoleic acid.

Abstract: A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.

Abstract: An encapsulant for an electronic device comprises a silicone resin having a highly colored porphyrin compound doped therein.

Abstract: A selective metallization process particularly suited for making printed circuit boards comprises the step of treating a substrate having a negative mask thereon with a reactant, e.g., acetic acid, which modifies the surface of the mask without affecting the substrate so as to remove or prevent an active catalytic layer from remaining on the surface of the mask thereby preventing electroless plating on the mask.

Abstract: A diverter and coextrusion diverter are described which include means for adjusting the cavity of the diverter so as to control the uniformity of extrudate exiting the diverter. The diverter including a gap having beveled opposing faces.

Abstract: A method for depositing aluminum films on a substrate comprises exposing the substrate to vapors of an aluminum hydride-trialkylamine complex and exposing the surface to ultraviolet light in the areas where aluminum deposition is desired.

Abstract: We have discovered that by pretreating a thioether (R'--S--R) containing organic phase to be used as an extractant in a solvent extraction process for separating platinum group metals from base metals and/or each other in aqueous solution with a mild oxidant, e.g., cupric chloride, in an acidified aqueous phase, the tendency of stable emulsion formation during extraction can be substantially eliminated.

Abstract: A rosin free, water soluble solder flux suitable for use as a fusing fluid in high temperature solder operations has been developed. The novel flux comprises a high molecular weight amine activator, at least one other activator selected from a water soluble organic acid activator and an inorganic acid activator, and a solvent mixture. The acid activators are present in an amount which essentially neutralizes the amine.

Abstract: In manufacturing a circuit which includes the step of etching a polymeric material in the presence of exposed metallic conductors, the polymer is etched with an aqueous solution comprising chromic acid [which may be added in the form of chromic oxide (CrO.sub.3)], sulfuric acid, phosphoric acid and water wherein the water added does not exceed 55 volume percent of the total volume.

Abstract: An apparatus useful for double crucible Czochralski crystal growth comprises an inner crucible fixed within an outer crucible wherein the inner crucible contains an extra volume or reservoir of semiconductor melt when flow of semiconductor melt from the outer crucible into the inner crucible through means interconnecting the crucibles ceases.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A process of electrodepositing a metal from an organic phase containing a salt or complex of that metal includes the steps of creating a dispersion of the organic phase in a conducting aqueous electrolyte with which it is immiscible and electrodepositing the metal onto a cathode which is immersed in the organic phase or the dispersion.

Abstract: A coating material is applied to drawn lightguide fiber in a manner which substantially prevents the inclusion of bubbles and which causes the fiber to be disposed substantially concentrically within the coating layer. The lightguide fiber is advanced through a continuum of coating material, which extends from a free surface of a reservoir and through two dies that are arranged in tandem, at a velocity which causes air to be entrained in the coating material. A pressure gradient is established between portions of the first die adjacent to its exit orifice. A first one of the dies communicates with the reservoir and the second die and further communicates at the interface of the dies with a pressurized supply of the coating material.

Abstract: A method is described for recovering palladium from spent catalytic colloidal palladium baths by dissolving the palladium to form a true solution followed by electrodeposition employing a nickel anode and a nickel or copper cathode.