Abstract: A substrate is provided for mounting semiconductor devices and comprises an electrically conductive circuit layer, a base layer of an aluminum metal material, and an electrically insulating hard coating dielectric layer of amorphous aluminum oxide which is directly adherent to the base layer for mounting the electrically conductive circuit layer thereon.

Abstract: A motor winding system having a main winding and a start winding circuit with a start winding and a PTC resistor in series therewith wherein the resistor is electrically removed from the circuit at a predetermined time after motor starting and remains in this state until motor shut off. The start winding circuit also includes a bimetallic switch in series with the resistor and a series circuit of a capacitor and an electromagnet in parallel with the resistor and switch. At motor start up, current from the main power source is applied across the main winding and the start winding circuit heats up the resistor and causes an increase in the resistance thereof. Also, current through the switch and PTC heat causes the bimetallic element to snap or move when it has reached a predetermined temperature to open the start winding circuit.

Abstract: A universal sensor has a selectivity scaled condition responsive element such as a capacitive pressure transducer mounted on a common support with signal conditioning means embodied in an integrated circuit to provide a control signal precisely corresponding to a sensed condition. Electrically actuatable means on the support are incorporated in the circuit for low cost, mass producible calibration of the circuit and condition-responsive element relative to each other after assembly on the common support. Preferably, a capacitive pressure transducer and a reference capacitor are arranged in a charge-locked loop relation with a common node while an array of switches cycles the voltage across the transducer and reference capacitors with opposite transitions with a predetermined frequency so change in transducer capacitance results in a differential voltage at the common node.

Abstract: A high limit thermostat for gas furnace applications is shown having a molded base plate and an elongated housing formed integrally with the base plate which mounts a thermostat at a free end of the housing in order to be positioned within an air stream of a heat exchanger to sense temperature conditions of the air stream.

Abstract: A fuel injection system having an air supply and a fuel injection spray valve furnishing an air-fuel mixture to an internal combustion engine has a fuel heating device for heating the fuel just prior to spraying from the valve to enhance fuel-air mixing, the heater having a housing comprising a pair of stiffly compressible housing elements clamped in sealing relation to each other for capturing a flat ceramic heating device of positive temperature coefficient of resistivity between the compressible housing elements, the elements each having a central opening and a spiral groove therein cooperating to form a chamber holding the heating device and for guiding fuel through the grooves in heat-transfer relation to the disc along spiral paths extending along each flat side of the heating disc, the housing having terminals sealed therein for electrically engaging opposite sides of the heating disc.

Abstract: A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together.

Abstract: An internal combustion engine of the injector type has self-regulating electrical resistance heating devices of positive temperature coefficient of resistivity arranged in cylinder head air-fuel inlet channels to intercept fuel directed into the channels by fuel injectors for heating and deflecting the fuel into respective cylinder intake valve openings. The heating devices and/or fuel injectors are movable after engine warm-up so that the fuel injectors thereafter spray fuel directly onto warmed-up intake valves in the valve openings without being intercepted by the heaters, whereby the heaters are adapted to be deenergized after engine warm-up without creating a cold spot in the engine fuel supply system at the heater location.

Abstract: A circuit breaker has two thin flat terminals embedded in an electrically insulating housing exposing respective broad flat sides of the terminals in spaced side-by-side relation to each other in a housing chamber. The circuit breaker has a thermostat metal member secured at one end to one exposed side of one terminal to mount the member extending along a chamber wall and has a contact at its opposite end to engage and disengage the other terminal to close and open a circuit in response to a selected current in the circuit. The contact comprises a material which erodes during repeated cycling of the circuit breaker. The thermostat metal member has a portion of reduced cross-sectional area adapted to burn out and separate the member into two sections to open the circuit if the contact welds or sticks to the other terminal. A stop on the housing intercepts movement of one of the member sections after burn out to avoid shorting of the circuit.

Abstract: A normally closed pressure responsive switch has upper and lower housings attached to one another with an electrically conductive snap acting disc placed therebetween. The lower housing includes a base having a recessed area in which a stationary electrical contact is mounted. The snap acting disc is placed on top of the base with a side having a convex configuration facing the stationary contact. An electrically conductive member is placed over the disc with a plurality of contact tabs engageable with the outer peripheral portion of the disc. The upper housing includes a retainer having a bore in which a pressure converter slides. Ribs formed on the bottom of the pressure converter are adapted to engage the outer peripheral portions of the disc between the contact tabs and are captured in grooves of the retainer to restrict angular movement of the pressure converter.

Abstract: An extractor tool for removing a circuit module from a connector where the module has a substantial length, has a plurality of electrical contacts resiliently engaged with corresponding connector contacts, and has latch means at opposite ends receiving engagement by separate connector latches for detachably retaining the module on the connector. The tool has a thin flat body with spaced parallel legs extending from one side of the body to accommodate the substantial module length between the legs and has tapered surfaces on the edges of the distal ends of the legs to be pressed against the separate connector latches to release both of the latches at the same time to permit removal of the module from the connector free of damage to the latches or the resiliently engaged contacts.

Abstract: A humidity sensor composed of interdigitated electrodes and a material therebetween which is composed of perfluorosulfonic acid substituted poly (tetrafluoroethylene) copolymer wherein H+ sites have undergone ion exchange with at least one of NH4+ and Li+, Na+, Ag+ and Mg+.

Abstract: A pressure responsive variable capacitive transducer is shown in which a flat flexible diaphragm having a capacitor plate disposed thereon is mounted overlying a recess in a substrate having a capacitor plate disposed on the surface of the recess so that the plates are spaced apart a selected distance determined by the depth of the recess. In one embodiment a glass seal is located between the diaphragm and the substrate inwardly of the outer perimeter of the disphragm while in a second embodiment a glass seal is located outwardly from the outer perimeter of the diaphragm. The substrate is formed with bores adapted to receive electrical connection pins. Electrically conductive traces extend from electrically conductive layers to wells formed in the substrate contiguous with the bores to provide a gradual transition for the traces and an electrically conductive epoxy is infilled to electrically connect the pins to the traces.

Abstract: A temperature responsive electric switch is shown having an operating bimetallic member adapted to sense the temperature of a heat source coupled to an over-center switch mechanism and an ambient temperature bimetallic member to maintain a predetermined temperature delta in the operation of a thermostat regardless of changes in ambient temperature.

Abstract: The bond of a layer of glass dielectric material applied to metal substrates of the type which are capable of forming solid solutions with copper is enhanced by first coating the substrate with a layer of thick film copper, curing the thick film at a temperature which results in the formation of the solid solution at the interface between the substrate and the thick film copper and then applying the dielectric layer to the thick film copper and curing the dielectric layer. Circuit patterns and components can then be built on the dielectric layer.

Abstract: A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together.

Abstract: The device is intended to be used for recording the position reached by a moving part, such as the arm of an industrial robot moved by a rotary motor (M). The device comprises, in an assembly capable of being associated with the said moving part, an angular-position transducer such as a resolver (2), capable of generating at least one signal (4, 5) indicating the position reached by the motor (M) during a rotation, counting means (12) connected to the angular-position transducer (2), capable of storing a cumulative count of the signal generated by the transducer (2) itself and indicating the position reached by the moving part, and power supply means such as a buffer battery (18) capable of keeping the position transducer (2) and the counting means (12) active even when there is no external power supply.

Abstract: A dual function circuit board substrate has a layer or sheet of ultrathin metal of relatively high electrical resistivity having a selected sheet resistivity characteristic bonded to a thin layer or sheet of metal of relatively high electrical conductivity. The layer of high electrical resistivity material is adhered to one side of a layer of organic electrically insulating material, and a heat-sink metal layer is adhered to an opposite side of the organic insulating layer to withdraw heat from the layer of high electrical resistivity material. The thin layers of high electrical resisivity and conductivity materials are selectively etched from the organic layer material to form a select circuit, and the layer of high electrical conductivity material is selectively etched from portions of the circuit to form one or more resistor elements having selected electrical resistances in the circuit.

Abstract: A method of forming an enclosure for an electric circuit and the enclosure wherein there is provided a boat of material having a bottom and side wall, placing a material having a substantially higher thermal conductivity and a lower melting point than that of the boat in the boat bottom, heating the material to a temperature above the melting point thereof and below the melting point of the boat to cause the material to flow along the bottom to form a layer of the material thereon and join the layer to the bottom and side wall and removing a sufficient amount of the bottom of said boat to expose the layer. In accordance with a second embodiment, a depression is formed in the bottom, and when the material flows along the bottom, it fills the depression and become joined to the bottom. Plural such depressions can be provided. The exterior portion of the bottom is removed to expose the material if the depressions do not extend completely through the bottom.

Abstract: Differentially connected capacitive sensors are mechanically coupled with the flexible capacitor plate of one sensor coupled to the source of pressure to be measured, the flexible capacitor plate of the other sensor coupled to ambient pressure. In a second embodiment, inaccuracies due to forces on the flexible plate are minimized by providing a housing with a tapered inner wall, an O-ring and a support to apply a radial load to the sensor due to clamping action from the tapered housing against the O-ring to provide a seal for the pressure sensing chamber. In a further embodiment, the cost of fabrication of the pressure transducer is minimized by providing the housing as a one piece cup. The electronics are mounted on the exterior surface of the low pressure side of the ceramic capacitor pressure sensing element and sealed in thereat by potting with an epoxy.

Abstract: A pressure sensing element having a housing including a flexible membrane receiving portion, a flexible disc member of predetermined shape secured within the housing, and a flexible membrane disposed within the housing, the flexible membrane being substantially more flexible than the disc member, the membrane having an outer portion hermetically secured to the membrane receiving portion, a central portion impinging against the disc member and conforming to the shape thereof and an intermediate unsupported portion joining the interior portion of the outer portion and the exterior portion of the central portion.