Abstract: Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.

Abstract: A curable composition comprises a compound having at least one epoxy group and at least one maleimide, styrenic or cinnamyl group per molecule. A representative compound has the structure in which Z′ and Z are any monomeric, oligomeric or polymeric organic moiety; X is a direct bond or a functional group; and R and R′ are hydrogen, an alkyl group having 1 to 12 carbon atoms, or an aromatic or heteroaromatic ring or fused ring having 3 to 10 carbon atoms within the ring structure.

Abstract: Adhesion promoting compounds or resins containing a thiazole functionality (including benzothiazole) and a polymerizable functionality (Z) give improved adhesive strength to metal substrates. A representative structure is the following, in which R1 and R2 together can form a cyclic or aromatic structure, or are linear or branched organic moieties.

Abstract: Compounds with both vinyl ether and carbamate, thiocarbamate or urea functionality are suitable for use in microelectronics applications and show enhanced adhesive strength compared to compounds that do not contain carbamate, thiocarbamate or urea functionality.

Abstract: A process for the manufacture of copolymers of formaldehyde and diphenyl oxide and a carboxylic acid uses and acid with a pKa in the range of 1.2 to 3 as the catalyst.

Abstract: Fabrication of a CSP or a stacked chip CSP can be accomplished with an unsupported film adhesive or an adhesive supported on a rigid carrier, using standard die attach equipment constructed for use with a paste adhesive.

Abstract: Curable compositions comprise a benzoxazine compound or resin in combination with at least one additional curable compound or resin. Optionally, the composition will further comprise a curing agent and/or a filler. These compositions have utility as adhesives, coatings and encapsulants, especially for use within the semiconductor fabrication industry, with particular utility as die attach adhesives, films, and underfill materials, such as no-flow underfills, capillary flow underfills, wafer level underfills, and as lead free solders.

Abstract: Compounds containing vinyl silane and epoxy functionality can be used as adhesion promoters or the main resin in curable compositions.

Abstract: Compounds containing vinyl silane and electron donor or electron acceptor functionality can be used as adhesion promoters or as the main resin in curable compositions.

Abstract: A curable composition comprises a compound having at least one epoxy group and at least one styrenic or cinnamyl group per molecule.

Abstract: An adhesion promoter containing silane, and carbamate, thiocarbamate or urea functionality, and electron donor or electron acceptor functionality, displays low volatility.

Abstract: Allylated amide compounds are formulated into curable compositions with a free radical curing agent, and optionally, one or more fillers, for use as adhesives in the manufacture of microelectronic devices.

Abstract: A polymer composition, a process for its preparation and a molded article formed from the polymer composition are claimed. The polymer composition comprises (a) a base polymer that is a poly(alkyl(meth)acrylate; and (b) a rubber toughening agent selected from the group consisting of (i) copolymers of (alkyl)acrylate rubbers, (ii) copolymers of vinyl aromatic monomers with (alkyl)acrylates, (iii) copolymers of vinyl aromatic monomers with conjugated diolefins; (iv) copolymers of vinyl aromatic monomers with monoethylenically unsaturated monomers, in which the rubber toughening agent is present in the polymer composition as discrete islands substantially surrounded by the base polymer and in which islands are sub-islands of the base polymer.

Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Abstract: This invention relates to underfill encapsulant compositions prepared from allylated amide compounds to protect and reinforce the interconnections between an electronic component and a substrate in a microelectronic device.

Abstract: A curable composition for encapsulating an electronic component comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free radical curing agent, and optionally, one or more fillers.

Abstract: Underfill encapsulants are prepared from allylated amide compounds and a curing initiator.

Abstract: A curable composition for encapsulating an electronic component comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free radical curing agent, and optionally, one or more fillers.

Abstract: Hybrid electron donor compounds, suitable for use as adhesives or as components in adhesives, contain a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the aromatic ring and a vinyl ether moiety.

Abstract: Compounds containing both electron donor and electron acceptor functionality are suitable for use in adhesives. The electron donor group is a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the ring. The electron acceptor group is a maleimide, acrylate, fumarate or maleate.