Abstract: A method for preserving the solderability of copper conductors comprises stabilizing a cleaned, mildly etched conductor surface with a phosphoric acid-glycol solution then immersing the surface in imidazole followed by a rinse to remove excess imidazole.

Abstract: Polymeric coatings can be applied to substrates such as metal foils by first coating the foil with a wetting hydrosol followed by applying a coupling agent thereto and thereafter coating the substrate with the desired polymer.

Abstract: A printed circuit board is made from a substrate having a copper clad layer thereon by means of first providing spaced through-holes through the substrate, mechanically scrubbing the surface of the substrate and then sputter etching the surface of the substrate so as to remove at least 50A. thereof from the surface and then vacuum metallizing the through-holes subsequent to sputter etching without breaking the vacuum and then finally forming a circuit pattern on the substrate by usual subtractive techniques.

Abstract: A method for repairing faults or defects in the insulation of insulated wire is disclosed together with an apparatus for operation of the method. The method comprises passing insulated wire to be tested for insulation faults at high speed through a fault detector. This fault detector senses the presence of a fault or defect in the wire insulation. Upon sensing a fault, the speed of the wire passing through the apparatus is considerably slowed and the area having the fault is passed through a second fault detector which locate the essentially exact spot of the fault. Thereafter, the wire is automatically moved at the slowed speed through various repair stations where a plastisol coating is applied to the fault, spread evenly over the fault area, cured and then cooled. The cured plastisol repairs the fault and the wire can then proceed at high speed through the apparatus until another fault is detected.

Abstract: A method of selectively depositing a metal on a surface is disclosed. The method comprises selectively coating a surface with a surface active agent, having a first surface energy, to form a coated surface having a coated portion capable of burying a higher surface energy material applied thereto and an uncoated surface pattern not so capable. The selectively coated surface is then treated with a solution, having a second surface energy higher than the first, comprising a species selected from the group comprising (1) a species capable of reducing an activating metal ion to an activating metal and (2) an activating metal species capable of participating in an electroless metal deposition, to form a surface having the species deposited atop the uncoated pattern.

Abstract: A method for removing lead and other basic impurities from copper during refining of the copper comprises treating molten copper to be refined with a slag having a final composition including iron oxide, calculated as Fe.sub.2 O.sub.3 and silica (SiO.sub.2) wherein the weight ratio of iron oxide to silica is from 0.4 to 0.8. The novel slag preferably contains less than 10% boric oxide and up to 30% phosphorus pentoxide.

Abstract: Copper scrap from chopped and separated copper wire and cable is treated to remove contaminants still remaining on or mixed with the copper by sequential treatment, first in a sodium nitrate-postassium nitrate fused salt bath followed by a cuprous chloride fused salt bath.

Abstract: A substrate is plated by a process which includes the steps of catalyzing a substrate by coating its surface with a silver-pyridine complex dissolved in an organic solvent, converting the complex to silver oxide by immersion in a basic solution, and reducing the silver oxide to metallic silver and then electroless plating. When the substrate is copper, the silver oxide is spontaneously converted to a reflective and continuous layer of metallic silver upon immersion in the basic solution. The process as disclosed is used in the manufacture of insulated conductors and cord from nylon filaments.

Abstract: A method of depositing a stress-free electroless copper deposit is disclosed. The method comprises contacting a catalyzed surface with a solution comprising a source of cupric ions; a reducing agent for the cupric ions; a complexing agent for the solution selected from (a) ethylenediaminetetraacetic acid, (b) a salt of (a), (c) a modified ethylenediamine acetic acid, (d) a salt of (c), and (e) a mixture of at least two of the foregoing complexing agents; a stabilizer for the solution comprising a mercury compound; and an accelerator for the solution comprising a water-soluble compound containing a cyanide radical (CN.sup.-) complexed with a metal selected from Group VIII of the Periodic Table of the Elements.

Abstract: A polyvinyl chloride surface, such as plasticized polyvinyl chloride telephone cord jacket, is coated with a coating formulation comprising a medium molecular weight methyl methacrylate copolymer, cellulose acetate butyrate and a carbalkoxy benzyl phthalate plasticizer. The coating affords good adhesion, fast drying and stain resistance.

Abstract: A printed circuit board is disclosed which comprises a metal substrate having a first coating thereon and through holes through said coating and substrate with non-linear, undercut walls and a dielectric film coating over said first coating and said non-linear, undercut walls of said through hole. Electrical circuitry is then formed on the dielectric coat in conjunction with the through hole.

Abstract: A method of fabricating a body having a plurality of conductors is disclosed. The method comprises forming a dielectric base which has a plurality of extensions projecting therefrom, the extensions corresponding to the desired plurality of conductors. A conductive path is then formed on each of the extensions.

Abstract: A soldering flux is disclosed. The soldering flux comprises a mixture comprising rosin, an activator having at least one halogen atom and at least one destabilizing substituent and an acid solder surfactant selected from the polybasic carboxylic acid, a hydroxyl substituent thereof, a keto acid and a mixture of any of the foregoing surfactants.

Abstract: A method for depositing a metal on a surface is disclosed. The method comprises treating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal and a radiation-sensitive reducing agent for the salt to form a sensitized surface. The sensitized surface is exposed to a source of light radiation to reduce the metal salt to a reduced metal salt species. Either or both of the preceding sensitizing or radiation exposing steps is restricted to a selected pattern on the surface to form a catalytic real image capable of directly catalyzing the deposition of a metal thereon from an electroless metal deposition solution. The catalytic real image is treated with a stabilizer comprising (a) a reducing agent for the non-noble metal ions of said reducible salt, (b) a complexing agent and (c) an accelerator to at least stabilize the catalytic real image.

Abstract: A fluid bearing for supporting, independently of each other, a plurality of webs. The bearing comprises a housing, for containing a fluid within its interior, having an outer surface for cooperating with a surface of each web of the plurality of webs. A guide flange is provided on the outer surface, defining with the outer surface a support channel. The guide flange maintains the plurality of webs within the boundaries of the defined support channel. A fluid outlet and a fluid inlet are provided for passing the fluid from the interior of the housing through the outer surface, within the channel, to form a fluid layer thereover having a fluid spike therein, for independently supporting each web.

Abstract: A method of depositing a metal on a surface is disclosed. The method comprises coating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal. The coated surface is selectively treated to reduce the metal salt to metallic nuclei to form a catalytic pattern thereon capable of directly catalyzing the deposition of a metal on the nuclei from an electroless metal deposition solution. The selectively treated surface is then exposed to a stripping solution comprising an organic acid selected from (a) a carboxylic acid having a structural formula of ##STR1## where R is a member selected from the hydrogen radical, H, and an alkyl group having 1 to 3 carbon atoms, (b) citric acid and (c) a mixture of any of the foregoing acids, to essentially remove portions of the coated surface which have not been selectively treated.

Abstract: A powder coating composition is disclosed. The composition comprises at least one 1, 2 epoxy compound combined with a functionally terminated elastomer and a curing agent mixture. The curing agent mixture comprises an imidazoline derivative combined with an adduct of (a) a polyhydroxyl compound and (b) a diglycidyl ether of the polyhydroxyl compound, where reactant (b) is present in a less than equimolar amount to reactant (a).

Abstract: A method of removing a cured epoxy from a surface is disclosed. The method comprises treating at least the epoxy with a suitable swelling agent to swell the epoxy. The swelled epoxy is then treated with an oxidizing agent to oxidize the swelled epoxy. The oxidized epoxy is then treated with an etchant comprising sulfuric acid to remove the epoxy from the surface.

Abstract: A soldering flux is disclosed. The soldering flux comprises a mixture comprising rosin, an activator having at least one halogen atom and at least one destabilizing substituent and an acid solder surfactant selected from a polybasic carboxylic acid, a hydroxyl substituent thereof, a keto acid and a mixture of any of the foregoing surfactants.

Abstract: A method of depositing a stress-free electroless copper deposit is disclosed. The method comprises contacting a catalyzed surface with a solution comprising a source of cupric ions; a reducing agent for the cupric ions; a complexing agent for the solution selected from (a) ethylenediaminetetraacetic acid, (b) a salt of (a), (c) a modified ethylenediamine acetic acid, (d) a salt of (c), and (e) a mixture of at least two of the foregoing complexing agents; a stabilizer for the solution comprising a mercury compound; and an accelerator for the solution comprising a water-soluble compound containing a cyanide radical (CN.sup.-) complexed with a metal selected from Group VIII of the Periodic Table of the Elements.