Abstract: A method of treating a solution comprising ions of gold and cyanide is disclosed. The method comprises treating the solution with metallic gold to precipitate therefrom metallic silver.

Abstract: Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.

Abstract: A fluid bearing for supporting, independently of each other, a plurality of webs. The bearing comprises a housing, for containing a fluid within its interior, having an outer surface for cooperating with a surface of each web of the plurality of webs. A guide flange is provided on the outer surface, defining with the outer surface a support channel. The guide flange maintains the plurality of webs within the boundaries of the defined support channel. A fluid outlet and a fluid inlet are provided for passing the fluid from the interior of the housing through the outer surface, within the channel, to form a fluid layer thereover having a fluid spike therein, for independently supporting each web.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.

Abstract: A polymeric composition is disclosed. The composition comprises a solid halide polymer, selected from vinyl halide polymers and vinylidene halide polymers, a terpolymer comprising by weight (a) 40 to 80 percent ethylene, (b) 3 to 30 percent carbon monoxide and (c) 5 to 60 percent of one or more monomers copolymerizable therewith in order to produce solid copolymers and a mixture comprising (a') a mixed alkyl phthalate and (b') a copolymer of from about 5 to about 95 percent by weight of an alkyl acrylate wherein the alkyl radical contains from 1 to 12 carbon atoms and from about 95 to about 5 percent by weight of a dissimilar alkyl acrylate wherein the alkyl radical contains from 3 to 24 carbon atoms, the alkyl phthalate being present in an amount by weight at least equal to the amount of the copolymer (b').

Abstract: A medical appliance useful for the detection and analysis of skin lesions consists of a magnifier having a flat bottom surface and a scale in combination therewith, the magnifier being mounted on a frame which includes a vertically extending metal rod having a light source attached thereto.

Abstract: Catalysts for activating dielectric substrates preparatory to electroless metal deposition are prepared by admixing a soluble metal salt of a non-precious catalytic metal with a secondary compound which causes the formation of a colloidal dispersion and an extraneous colloid stabilizer. The substrates are immersed in the colloidal dispersion, rinsed, activated, rinsed, and then immersed in an electroless plating bath.

Abstract: Catalytic compositions useful in the preparation of substrates prior to chemical deposition (autocatalytic plating) comprises an excess hydrolyzable stannic ion relative to stannous ions together with catalytic metal(s) and selected chemical additives. By simple adjustments, a plurality of substrates may be treated.

Abstract: A method for the formation of novel colloidal catalytic electroless plating compositions comprises admixing a highly stable non-active colloidal dispersion with an activity modifier. The mixture so formed is used in electroless plating processes wherein a pre-cleaned substrate is contacted with the novel colloidal catalytic composition, rinsed, contacted with a reducing or activating solution and then contacted with an electroless plating solution.

Abstract: Improved processes and systems are described for the reception of electroless plating of non-metallic substrates, the processes comprising forming a coating of metal ions onto the non-metallic substrate, immersing the coated substrate in a developer solution containing ions selected from nickel, cobalt and copper ions and mixtures thereof and a reducing agent, and thereafter immersing the substrate in conventional electroless plating baths, e.g., nickel or cobalt-hypophosphite baths or a copper-formaldehyde bath.

Abstract: Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.

Abstract: In the electroless plating of dielectric or non-conductive substrates by first priming the surface of the substrate with aqueous solutions containing stannous and copper ions, followed by developing the substrate with a reducing agent capable of reducing the valence state of the copper ions, the substrate is contacted with a linking agent for the stannous ion either prior to or concurrently with the priming step permitting the use of lower amounts of stannous and copper ions while achieving improved plating and improved primer usefulness.

Abstract: An electrochromic device comprises, in a layered structure, a first electrode, an electrochromic material, an electrolyte and a back electrode which is of a material different than said first electrode. The device is characterized as having a nonlinear voltage response, a well defined threshhold, and an internal electromotive force which is uniquely determined by the color state of the device.

Abstract: A converter utilizes a low voltage battery to develop a higher potential by the use of capacitors which are charged sequentially according to digital waveforms provided by counting type circuits and gates. The charge transfer circuits afford a low impedance charging path and a high impedance discharge path via a series of transmission gate controlled capacitors.The apparatus permits the conversion of low battery voltages while being completely compatible with ultra-miniature electronic systems.

Abstract: There is disclosed an integral instrument providing timekeeping and display with calculator functions and display accomplished by means of a keyboard assembly mounted on the watch casing and adapted to be worn about a user's wrist. Included is time sharing circuitry to enable common display drivers for the timekeeping and calculating modes as well as power sharing circuitry to enable the use of inexpensive and reliable P-MOS circuitry in the calculator mode without constantly dissipating power. A time-zone setting circuit utilizes logic circuitry to automatically enable the user to change time by direct access to the existing keyboard assembly.

Abstract: A method of forming a laminate is disclosed. The method comprises placing a metal film in juxtaposition to a surface to be joined thereto. A buffer medium having an explosive charge on at least one surface thereof is positioned proximate the film. The explosive charge is detonated to propel the film against the surface to shear a portion of the film, corresponding in shape to the surface, away from the buffer medium to bond the sheared portion to the surface.