Abstract: In a communication network (200) having an IPv6 communication backbone (210), each multi-protocol subnet (215 and 220) comprises: a mixture of IPv4 (215B and 220B), IPv6 (215D and 220D), and dual-stack (215C and 220C) hosts; and a communication protocol interface (215E and 220E). A corresponding gateway subnet (225) for communication beyond the communication network (200), includes a gateway communication protocol interface (225C). The communication protocol interfaces (215E and 220E) transport IPv4 data packets across the IPv6 communication backbone (210) within IPv6 data packets, allowing IPv4 hosts operating in any of the subnets to communicate with each other. The gateway communication protocol interface (225C) operates with the communication protocol interfaces (215E and 220E) to extend communication between IPv4 hosts in any of the subnets, to communication with IPv4 (108) hosts on the Internet 107.

Abstract: A code division multiple access (CDMA) system and methods for processing symbol blocks of a spread signal in both frequency and time domains are described. A transmitter (10) of the CDMA system spreads pilot symbols and data of the symbol blocks to derive a spread sequence. Thereafter, the spread sequence is extended with a predetermined number of chips and pulse shaped for transmission as the spread signal. A receiver (400) of the CDMA system receives the spread signal, removes the predetermined number of chips and then orthogonally transforms the spread signal to the frequency domain to derive a transformed signal. The transformed signal is equalized in the frequency domain to derive an equalized signal. The equalized signal is then inverse orthogonally transformed to an output in the time domain. The output is then despreaded to derive the symbol blocks.

Abstract: A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC), CompactFlash™ (CF) card and PC card, by moulding over to encapsulate a populated printed circuit board (PCB) (10) to form the standard external dimensions and features of the memory card. The method comprises holding the populated PCB (10) in place in a cavity (44) of at least one mould piece; and moulding over both sides of the populated printed circuit board (10) to encapsulate said board. Various embodiments are disclosed, including means for holding the populated PCB (10) in the moulding cavity (44) for the encapsulation process, which includes transfer moulding and injection moulding processes, one or more moulding steps, and moulding over one part of one side of said board before the other side, and/or simultaneously moulding over both sides of said board.

Abstract: A method of determining the endpoint of an etch layer in a semiconductor element fabrication, wherein said element is comprised of at least a first material layer, a second material layer on said first material layer, said endpoint determining method comprises the steps of (i) determining the total emission intensity wavelength of the first material layer; (ii) determining the total emission intensity wavelength of the second material layer; (iii) plotting the scalar of the wavelength differential of the upper and lower layers; and (iv) choosing the highest peak of wavelength differential as the best range of endpoint detection wavelength. This method is particularly useful for etching stacks where the first and second material layers have endpoint emission wavelengths that are close to each other. This include nitrogen-rich silicon layer which is overlaid by an antireflective coating (ARC) layer, e.g. silicon nitride, Si3N4 overlaid by bottom antireflective coating (BARC).

Abstract: A probability distribution transformer (110) in a multi-carrier modulation (MCM) transmitter (101) receives a MCM signal comprising data packets that represent amplitude values, where the amplitude values are characterized by a Gaussian probability density function. The probability distribution transformer (110), which is provided by a number of piecewise linear transforms, produce a transformed MCM signal comprising transformed data packets which represent transformed amplitude values, where the transformed amplitude values are characterized by a uniform probability density function. When transmitted, the transformed MCM signal results in reduced peak-to-average power ratio (PAPR). In a corresponding MCM receiver (102), a probability distribution inverter (180) inverts the transformation.

Abstract: The method of the present invention comprises the steps of: (a) laying on a prior layer, a first oxide layer doped in one form; (b) laying on said first oxide layer, a second oxide layer doped in a different form; (c) patterning said layers; (d) etching the second layer with an etchant having high selectivity to said second doped oxide layer; and (e) etching the first layer with an etchant having high selectivity to said first doped oxide layer. As the etch rate is higher for the highly doped oxide than that for the lightly doped oxide, high selectivity of etching between such layers can therefore be attained. A lightly doped silicon oxide layer may therefore be used to stop etching at an optimal thickness over the complicated layer of substrate. The lightly doped silicon oxide area may be covered with a layer of highly doped silicon oxide layer which may be etched with a specific etchant.

Abstract: A docking system (10) and method for docking a test head (16) of a device tester to a device handler. The docking system (10) has a handler plate (12) and a tester plate (14), respectively mountable to the device handler and the test head (16). The handler plate (12) has two conversion bars (18a, 18b). Each of the two conversion bars (18a,18b) has two lateral protrusions (40a,40b). The tester plate (140 has four slot mounts (26a,26b,26c,26d), each with an escalating slot (50) that is laterally oriented for respective linear engagement with the lateral protrusions (40a,40b) for the docking. The method involves making a quick alignment of the handler plate (12) to the tester plate (14) by inserting two pre-docking guide pins into (20a,20b) two pin sockets (22a,22b) and, thereafter, actuating one or both of two actuating cams (28a,28b) for the respective linear engagement.

Abstract: An on-column detector for electrophoresis samples based on the principles of potential gradient detection, in which the electrodes for detection are physically isolated from the electrophoretic separation process, but maintains the same electrical potential as the corresponding interior of the electrophoretic separation channel. Potential gradient detection is used to measure the applied electrical field at two points within the electrophoretic channel during electrophoresis. When sample components with conductivity different from the electrophoretic medium passes between these two points, it causes a change in the potential gradient between the two points, which would be sensed by the sensing electrodes of the detector and registered by a data acquisition system. The apparatus can make use of conventional separation channel as well as separation channels on microchips.

Abstract: A method of treating the surface of a rough, plastic object to produce a high gloss, textured and/or coloured finish. A rapid prototype treated according to the present method assumes the appearance of an injection molded part, without the usual high costs associated with producing the injection mold. In one embodiment, first step involves of removing the pores in the porous part, at least at the outer layers of the part, followed by a smoothening process of filling the voids between the miniature steps with a hardener to give a smooth surface, on which further post-processing may be performed.

Abstract: A transparent and flexible composite membrane produced from two immiscible polymers. The first polymer is a polymeric fibrous network with interconnecting pores. The second polymer is an elastomer with a refractive index matching the first polymer. The resultant composite membrane is a transparent interpenetrated network of polymers with an altered molecular structure, and mechanical strength superior to the parent polymers. A method of producing the new composite membrane involves dissolving the elastomer in a suitable solvent to form a diluted elastomeric solution, impregnating the polymeric membrane with the elastomer by adding the diluted elastomeric solution to the membrane to form a wet composite membrane, and then drying the wet composite membrane to form an interpenetrated membrane.

Abstract: A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die (40) on the substrate (300) with bumps (45) abutting upper surfaces (310) of the raised terminal portions (305), and reflowing the assembly. During the reflow process, the raised terminal portions (305) and the bumps (45) melt and displace the filler (27) in the underfill compound (5) away from between the bumps (45) and the raised terminal portions (305). This prevents the filler (27) from forming a barrier. The molten solder forms interconnects between the pads (46) and the raised terminal portions (305).

Abstract: An indicator controller (18), an optical assembly (10) having the indicator controller (10), a traffic light system that comprises at least one of the optical assembly (10) and a method for fault indication by the indicator controller (10) is disclosed. A control signal from a control signal generator (20) of the indicator controller (18) is disabled to block off current supply to a diode chain of three light emitting diodes (LEDs) of an array (12) of LEDs. Input to the control signal generator (20) has a frequency setting section that sets the control signal at a predetermined frequency. Consequently, the three LEDs are made to blink according to the predetermined frequency. The control signal is generated when the amplitude of current supply to the array (12) exceeds a threshold setting.

Abstract: A method and apparatus for the removal of mold flash from an IC device using a non-thermal laser ablation method. Ablation is achieved under conditions in which the mold flash is converted to plasma under short laser pulses which do not give sufficient time or energy for significant thermal processes to occur. As a result, the heat sink underneath the mold flash is prevented from heating up due to lack of heat transfer, thereby protecting the heat sink from heat damages. According to one feature of the invention, a mask is provided to protect the molded packaging of the IC device from the laser beam. The mask has at least one hole which corresponds to the heat sink of the device wherethrough the laser beam can pass. According to another feature of the invention, a large beam diameter is provided to increase the efficiency of the deflashing process.