Abstract: Selectively coupling to feed points of an antenna system. At least some of the illustrative embodiments are systems comprising an antenna system, an antenna communication circuit, a first diode coupled between the antenna communication circuit and a first feed point of the antenna system, and a second diode coupled between the antenna communication circuit and a second feed point of the antenna system. The antenna communication circuit is configured to couple the antenna communication circuit to the first and second feed points by forward biasing the diodes.

Abstract: Apparatus and method for determining a real time, non-contact temperature measurement of semiconductor wafers is provided in a computer-based data gathering system. The apparatus includes a moving carrier containing semiconductor wafers and a pyrometer and a reflectometer positioned above the spinning wafer carrier for providing temperature and reflectivity data samples taken from the semiconductor wafers and spinning carrier. The data are then provided to an attached computer. The attached computer receives the reflectivity and temperature data pairs, stores them in a data table and records the frequency of occurrence of each of the reflectivity values in the series of reflectivity and temperature data.

Abstract: A fused deposition process is used to form three-dimensional solid objects from a mixture including a particulate composition dispersed in a binder. The article is formed by depositing the mixture in repeated layers of predefined thickness, with each layer solidifying before the next adjacent layer is dispensed. Following formation and a binder removal step, the article may be at least partially densified to achieve preselected properties. The process permits three-dimensional articles to be formed relatively quickly and inexpensively, without the need for molds or other tooling.