Abstract: A touch panel is disclosed. The touch panel mentioned above includes at least a touching detection column and a touching detection module. The detection column includes N first touching detection units, N is a positive integer. Each of the first touching detection units transfers a first capacitance varying value according to an area cover by a touching point. The touching detection module operates a differential operating on the first capacitance varying values from two of the first touching detection units which is disposed adjoining in sequential for obtaining a capacitance varying order distribution. The touching detection module obtains a number of at least one first touching point and coordinates thereof by calculating the capacitance varying order distribution.

Abstract: An integrated memory control apparatus including a first interface decoder, a second interface decoder and an interface controller is provided. Wherein, the first interface decoder is coupled to a control chip through a first serial peripheral interface (SPI), the second interface decoder is coupled to a micro-processor unit through a general transmission interface, and the interface controller is coupled to a memory through a second SPI. When the interface controller receives the request signals from the control chip and the micro-processor unit, the control chip may correctly read data from the memory through the first and second SPI. On the other hand, the micro-processor unit may stop reading data from the memory through the general transmission interface. Therefore, the control chip and the micro-processor unit may share the same memory.

Abstract: An integrated memory control apparatus including a first interface decoder, a second interface decoder and an interface controller is provided. Wherein, the first interface decoder is coupled to a control chip through a first serial peripheral interface (SPI), the second interface decoder is coupled to a micro-processor unit through a general transmission interface, and the interface controller is coupled to a memory through a second SPI. When the interface controller receives the request signals from the control chip and the micro-processor unit, the control chip may correctly read data from the memory through the first and second SPI. On the other hand, the micro-processor unit may stop reading data from the memory through the general transmission interface. Therefore, the control chip and the micro-processor unit may share the same memory.

Abstract: An integrated memory control apparatus including a first interface decoder, a second interface decoder and an interface controller is provided. Wherein, the first interface decoder is coupled to a control chip through a first serial peripheral interface (SPI), the second interface decoder is coupled to a micro-processor unit through a general transmission interface, and the interface controller is coupled to a memory through a second SPI. When the interface controller receives the request signals from the control chip and the micro-processor unit, the control chip may correctly read data from the memory through the first and second SPI. On the other hand, the micro-processor unit may stop reading data from the memory through the general transmission interface. Therefore, the control chip and the micro-processor unit may share the same memory.

Abstract: Disclosed is a computer-implemented method to generate a placement for a plurality of device modules within an analog integrated circuit (IC) subject to a set of constraints. By building a constraint hierarchy tree according to the constraints, conflicts of constraints can be identified and resolved. Furthermore, placements can be generated based on the hierarchy tree through a bottom-to-top dimension optimization process and a top-down wire length optimization process. Furthermore, a graphical user interface can be used to display the tree, and the user can edit the tree visually and interactively.

Abstract: An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

Abstract: A MOSFET pair with a stack capacitor is disclosed herein. It can regulate the input voltage and optimize a short EMI loop. It has a bottom lead frame and an up lead frame, which can simultaneously dissipate the heat generated by two MOSFETs to achieve excellent thermal-dissipation. It can adopt solder, Ag epoxy, or gold balls to implement the electrical bonding of two MOSFETs with the bottom lead frame and the up lead frame to achieve excellent structural flexibility. A device, such as an IGBT, a diode, an inductor, a choke, and a heat sink, can be stacked above the up lead frame to form a powerful SiP module. A corresponding method of manufacturing the MOSFET pair with a stack capacitor is also disclosed herein, which is simple, time-saving, flexible, cost-effective, and facile.

Abstract: A placer produces a global placement plan specifying positions of cell instances and orientations of macros within an integrated circuit (IC) by initially clusterizing cell instances and macros to form a pyramidal hierarchy of blocks. Then the placer iteratively repeats the declusterization and routability improvement process from the highest level to the lowest level of the hierarchy. An objective function is provided in Cartesian coordinate for representing the position of each movable instance and in polar coordinate for representing the orientation of a macro relative to its the center. For each movable instance and each rotatable macro, its position or orientation is determined by conjugate gradient method to minimize total wire length. Finally, the placer uses a look-ahead legalization technique to rotate rotatable macros to legal orientations and move cell instances to legal positions in the end of global placement.

Abstract: A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

Abstract: A capacitance interface circuit is provided. An external inductive capacitor is divided into a variable portion and an invariable portion. The capacitance of an internal adjustable capacitor is designed to be equal or close to the fixed capacitance of the external inductive capacitor. The internal adjustable capacitor is used for storing charges having a polarity opposite to that of the invariable portion of the external inductive capacitor in order to neutralize the effect of the invariable portion of the external inductive capacitor. Thus, a charge converter composed of a fully-differential amplifier and feedback capacitors needs only work on the variable portion of the external inductive capacitor, and accordingly the accuracy in subsequent data processing is increased.