Abstract: A telephone system for providing a telephony feature includes a phone system controller and a first telephone system interface. The first telephone system interface is coupled between a first telephone handset and a telephone line. Moreover, the first telephone system interface is operable to selectively couple the first telephone handset to the telephone line. The first telephone system interface is also operable to establish a first wireless control channel to the phone system controller. The wireless control channel is operable to carry control signals associated with the telephony feature between the first telephone system interface and the phone system controller. The phone system controller is operable to (i) receive the first control signals via the wireless control channel, and (ii) process the first control signals to provide the telephony feature to the telephone handset.

Abstract: A method of converting a document from a first page size to a second page size includes the step of determining a first line length from the document formatted for the first page size. Another step of the method includes determining a first page length from the document formatted for the first page size. The method also includes the steps of defining a second line length for the second page size that is equal to the first line length, and defining a second page length for the second page size that is equal to the first page length. Yet another step of the method includes formatting the document to utilize the second page size, the second line length, and the second page length.

Abstract: A system, apparatus and/or method is provided for removing water vapor from a wafer processing chamber generated as a byproduct of wafer processing. A water vapor trap is used to collect the water vapor byproduct from the processing chamber interior. The water vapor trap has at least a portion thereof in communication with an interior of the processing chamber for collection of the water vapor and another portion thereof in communication with an exterior of the processing chamber. The portions are movable with respect to the interior and exterior of the processing chamber such that the portions may switch places. This allows the processing chamber to be in at least a substantially continuous mode of operation while still providing for the removal of water vapor byproduct via the water vapor trap. The “used” portion of the water vapor trap is regenerated while the “clean” portion is collecting water vapor.

Abstract: A method of making a semiconductor device includes providing a first element formed of a first substantially electrically conductive material and having an upper surface. A second element adjacent to the first element is provided. The second element is formed of a first substantially non-electrically conductive material. An upper surface of the second element slopes downwardly toward the upper surface of the first element. A first layer of a second substantially non-electrically conductive material is disposed over the upper surface of the first element and the upper surface of the second element. The first layer has a thickness in the vertical direction that is greater in an area over the downward slope of the second element than in an area over the first element. An etching process is performed such that the layer is perforated above the upper surface of the first element and imperforated in the vertically thicker area above the downwardly sloping upper surface of the second element.

Abstract: A method of determining temperature of a semiconductor wafer during wafer fabrication includes the step of providing a response circuit on the semiconductor wafer. The method also includes the step of transmitting an interrogation signal with a signal transceiver so as to excite the response circuit. The method further includes the step of receiving a response signal which was generated by the response circuit as a result of excitation thereof. In addition, the method includes the step of determining temperature of the semiconductor wafer based on the response signal. Moreover, the method includes the step of fabricating a circuit layer on the semiconductor wafer. Both the transmitting step tri and the receiving step are performed contemporaneously with the fabricating step. An apparatus for determining temperature of a semiconductor wafer during wafer fabrication is also disclosed.

Abstract: A method of testing the processing of a wafer on a CMP apparatus includes processing a control wafer with the CMP apparatus with a predetermined control consumable combination under a predetermined set of control conditions and generating a control data set which describes the processing of the control wafer with the CMP apparatus, the control data set being based upon the control conditions and a removable rate of the control wafer. The method further includes processing a test wafer with a CMP apparatus with a test consumable combination substantially the same as the control consumable combination under a set of test conditions substantially the same as the set of control conditions. The method further includes generating a test data set which describes the processing of the test wafer with the CMP apparatus.

Abstract: A door latching or locking mechanism or module for a self-cleaning oven includes latching linkage of the door latch module that enables use of lighter duty, less expensive motor. The mechanical advantage and vector optimization of the latching linkage avoids stalling especially from a locked position. The latching mechanism includes a plurality of switches having a corresponding plurality of terminals. The terminals are grouped or ganged to allow connection with a single connector interface. The switches are selectively actuable/de-actuable by a cam and cam plate that utilizes linear motion translated from rotational motion of a driven (motor) to selectively actuate and/or de-actuate the switches.

Abstract: A method of processing a semiconductor wafer and an associated semiconductor wafer arrangement which inhibits “punch through” and increases the yield of functional semiconductor wafers during the fabrication thereof is disclosed.

Abstract: A system, apparatus and/or method is provided for fabricating an integrated capacitor during the fabrication of a transistor employing chemical mechanical polishing of a gate electrode of the transistor. Components of the integrated capacitor, particularly the lower electrode of a parallel plate capacitor in one form thereof, and an outer plate of a cylindrical-like capacitor in another form thereof, are defined by the polish stop layer during chemical mechanical polishing (CMP) of a gate of the transistor. According to an aspect of the subject invention, the polish stop layer may be an oxide or a nitride.

Abstract: A retail terminal is utilized as a gateway to an electronic billing application that allows a user to gain access to the electronic billing application and thereafter tender payment for the bill. A paper bill that is sent to a user is encoded with user login information that is obtainable by the retail terminal. The retail terminal obtains the user login information from the bill and logs the user into the electronic billing application. Various peripheral devices associated with the retail terminal are configured to accept payment for the bill. In one form, the user login information is encoded as a bar code on the bill that contains a user ID and, optionally, a password. The present invention improves the usability and reliability of an electronic billing application. Further, the present invention minimizes the chance that a user will erroneously enter someone else's account number, and provide a level of security by ensuring that the user is in possession of the printed bill.

Abstract: A PIN device utilizes a preferably removable IC card to store and process data to provide a tamper resistant PIN entry system. The IC card is a tamper resistant module that provides four functions for the PIN device. The IC card: stores secure data for the PIN device; provides authentication for verifying that the IC card can be trusted; provides a mechanism for the loading of secure data into the PIN device; and provides a mechanism to authenticate its identity to other parties. The subject PIN entry system allows for servicing of the PIN device in the field.

Abstract: A semiconductor memory device includes at least one memory cell for storing digital data. A local sense amplifier is operably coupled to the at least one memory cell for receiving a first signal representative of the digital data stored in the at least one memory cell, and outputting a second signal representative of the received first signal in response to a first strobe signal. A global sense amplifier is operably coupled to the local sense amplifier for receiving the second signal, and outputting a third signal representative of the received second signal in response to a second strobe signal. Dummy circuitry is provided for-enabling generation of the first and second strobe signals.

Abstract: A portable writing board presentation structure has a collapsible writing surface, such as a dry-erase or “white board” surface, and an integral, height-adjustable tripod stand. The writing board structure is defined by first and second injection molded plastic panels, each panel having a writing surface on one side thereof and a non-writing surface on an opposite side thereof. The panels are pivotally coupled to one another to define an open position and a closed position. The open position situates the writing surface in a co-planar relationship to provide a continuous writing surface. The closed position situates the writing surface sides of each panel in a parallel relationship. With respect to the tripod stand, an end section of a telescoping leg is integrally molded into each panel such that the remaining telescoping section of the telescoping leg extends into a recess formed in a non-presentation side surface of the panel.

Abstract: Various piezoelectric transducers are provided. In one form, a polymer film or thin ceramic piezoelectric transducer is formed of various piezoelectric (active) and dielectric (inactive) layers in which the piezoelectric effect may be attenuated locally at any given point on the surface of the transducer, by use of printed circuit patterns, preferably made by photolithography. This provides a practical realization of a distributed piezoelectric transducer with a bi-dimensional polarization profile that varies smoothly over the surface of the piezoelectric structure. Flexibility of the fabrication procedure provides a way to optimize the design of a distributed piezoelectric transducer for applications such as active vibration control. In another form, a segmented piezoelectric transducer includes a set of active elements such as piezofilms, electronics and flexible printed circuits and connected with external electronic circuitry.

Abstract: A system determines the level of paper available in paper supply for printing. The system comprises a signal emitter and a variably activated receiver. The receiver alters an electrical parameter such as a resistance in accordance with the portion of the emitted signal received at the receiver. This alterable electrical parameter is in an electrical circuit that generates a signal proportional to the received portion of the emitted signal. An array of variably activated receivers may be arranged opposite a signal emitter to receive the signal portion not blocked by a paper supply. Alternatively, the array of variably activated receivers may be located adjacent to the signal emitter to receive the portion of the emitted signal reflected from the paper supply. The receiver uses the received or reflected signal to generate a signal having a magnitude proportional to the received or reflected signal.

Abstract: A prosthetic component is configured to have intentional interruptions in an articulating face thereof. The intentional interruptions are configured to yield an optimum contact area or bearing surface, particularly with regard to low wear and greater lubricity through the application of lubrication and contact mechanics theory for the particular prosthetic component. Such optimization is applied to a wide range of prosthetic component sizes of the particular prosthetic component. The optimum range of percentage area of relief or interruptions, defined as a percentage of a baseline uninterrupted bearing surface area to be removed by the features of the interrupted bearing surface configuration is from 0.3% to 73.7% for hard-on-hard bearing components and from 5.7% to 83.2% for polyethylene-on-hard bearing components. The range for both hard-on-hard and polyethylene-on-hard implants translates to a relieved area ranging from 0.3% to 31.

Abstract: An electricity meter includes a current sensor, an analog to digital (A/D) converter coupled to the current sensor, and a processor coupled to the A/D converter. The current sensor and the A/D converter cooperate to generate a digital current signal having a waveform representative of the current waveform on the power lines connected to the electricity meter. The processor is operable to analyze a digital current waveform signal produced by the current sensor and A/D converter to detect a rectified (DC) load. In particular, the processor perform analysis on the digital current signal to generate a peak positive current value and a peak negative current value, and then detect the presence of a rectified load coupled to the power network based on said peak positive current value and said peak negative current value.

Abstract: A variable angle clamp is provided for use with a spinal implant assembly having a spinal rod, a Schantz screw having an elongated shank, and a variable angle connector receiving the spinal rod and having a washer mounted on the body with a first surface defining a variable angle feature, and a stem projecting from the body, the stem terminating in a T-bar having a second surface facing the first surface. The variable angle clamp includes a clamping portion defining a bore configured to receive the shank Schantz screw therein. The clamp further includes a pair of clamp halves forming a slot therebetween that intersects the bore in the form of a split clamp. An outer surface of one of the clamp halves defines a variable angle feature for interengagement with the first surface of the washer. The outer surface of the other of clamp half is configured for pressure contact with the second surface of the T-bar.

Abstract: A retail terminal/customer service workstation integrates various retail devices and consolidates all of the associated functions of the retail devices and non-associated functions into a single, easy to use workstation. In accordance with one embodiment, the customer service workstation includes a large, touch-screen display, various customer payment devices, and other peripherals in electronic communication with and under the control of a microprocessing unit. A plurality of windows or areas is shown on the display according to the mode of the customer service workstation and/or transaction currently being processed by the customer service workstation. The customer service workstation is intelligently couplable with existing retail systems in order to supplement the existing retail system and obtain and use information/data therefrom, as well as provide various payment options.

Abstract: In a clamping apparatus for fixing a work piece carrier with a clamping pin in a clamping chuck, the clamping chuck is provided with a central opening for receiving the clamping pin and with a clamping mechanism firmly keeping the clamping pin in the central opening. The central opening has a conical inserting portion, and the clamping pin comprises a rear section with exposed aligning surfaces, engaging the conical inserting portion, to align the clamping pin with regard to the clamping chuck in X- and/or Y-directions. Circular seat portions on top of the clamping chuck constitute the Z-stop for the work piece carrier. For pneumatically cleaning the exposed aligning surfaces, the conical inserting portion is provided with gas outlet openings, located corresponding to the arrangement of the exposed aligning surfaces. The surface areas of the work piece carrier that will rest on the seat portions are pneumatically cleaned by gas outlet openings located in the center of the seat portions.