Abstract: A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle between ?90 degrees and 90 degrees, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.

Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion.

Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primary metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining.

Abstract: A network sensor system is provided that is capable of extremely low-power operation. The network sensor system implements a communication protocol that allows the sensors to operate at most times in a sleep mode, where only a low-power time is active. In this way, each sensor's receiver, transmitter, and support circuitry are operated only when strictly necessary. The network has a defined network time frame, and each device maintains and adjusts its own clock and relationship with the network time. In this way, each sensor is aware about when it may be sent a message, and opens a short listen window only when such a message is expected. If no message is received, or if the message is addressed to another sensor, the sensor goes back to sleep. The sensor's transmitter is only activated in the case where the message 1) is received during the listen period, 2) is addressed to the sensor, and 3) requires a transmission action. Otherwise, the transmitter remains deactivated.

Abstract: An oscillator is provided that is arranged to function as a simplified receiver. The oscillator has a resonator portion and a non-linear portion, which cooperate to generate an oscillating signal. The resonator portion is positioned to receive a modulated signal. In one configuration, the oscillator operates at a frequency offset from the frequency of the carrier for the modulated signal. In this simple arrangement, the oscillator functions as an active mixer, and generates a product output signal. The output signal is extracted from a high impedance point of the oscillator's non-linear device. The output signal is a demodulated or mixed signal, and may be further processed to detect a data signal.

Abstract: A system and method is provided for automatically reading meters, such as utility meters. A camera unit is attached to or otherwise associated with an existing meter. From time to time, either automatically, or upon wireless command, the camera unit takes an image of the meter's readings, and communicates wirelessly the image or image data, to a local area receiver. The images can be transmitted immediately, or stored for later transmission, depending on the network protocol. The camera unit is battery powered, and operates communication protocols that enable extended operational life. These protocols allow for the camera's radio and processor to be turned on only when necessary, and then for only brief periods of time. At most times, the camera is in a power-conserving sleep mode. Multiple camera units may be arranged to communicate meter image data to the local area receiver, either using asynchronous or synchronous processes.

Abstract: A solid surface clamp is provided. The solid surface clamp has a top jaw and a bottom jaw. A connecting rod is attached to one of the jaws, and slideably extends through the other jaw. Alignment surfaces may be incorporated into the jaws to assist in accurately positioning the material to be laminated. A compression device is connected to the portion of the connecting rod that extends through the jaw. A shroud shields the compression device, thereby protecting the compression device from contamination by the laminating adhesive. An elongated stiffening member may be used to apply the clamping force over a longer surface, allowing for greater spacing between clamps and extended regions of even clamping pressure.

Abstract: An improved antenna diversity system is provided. The antenna diversity system has at least two spaced-apart antennas, with each antenna providing a respective antenna signal. The signal(s) may be processed and scaled according to its respective power level. The phase difference is determined between the signals, and the phase difference reduced by using phase rotation. The signals, which are now substantially in-phase, are summed to generate a combined antenna signal.

Abstract: Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: A wave generating apparatus and method in which a chamber is at least partially submerged beneath a body of water in a pool and is connected to a gas supply for at least partially filling the chamber with gas, displacing water in the vicinity of the chamber. A vent valve is arranged to vent gas rapidly from the chamber so that the water level in the vicinity of the chamber falls, forming a wave trough. A wave reflecting wall is positioned in the pool adjacent the chamber and in the vicinity of the wave trough formation so as to reflect the wave away from the chamber and across the body of water. The chamber may have a flexible wall for displacing water or may be a rigid chamber communicating with the water through a submerged passageway. This apparatus forms a wave trough followed by a wave peak which travels across the pool.

Abstract: A novel method for testing a communications circuit is disclosed. The method includes the following steps: (a) connecting an internal balanced circuit to a well-balanced resistor network; (b) measuring a first plurality of real and imaginary components of the voltages with the internal balanced circuit connected to the well-balanced resistor network; (c) calculating an error for the internal balanced circuit based on the first plurality of voltages; (d) connecting the internal balanced circuit to the communications circuit; (e) measuring a second plurality of real and imaginary components of the voltages with the internal balanced circuit connected to the communications circuit; and (f) calculating a corrected balance for the communications circuit based on the second plurality of voltages and the error for the internal balanced resistor network. A novel device and software program that incorporates this novel method are also disclosed.

Abstract: A remote wireless device is provided that operates a user interface specific to a particular target application or device. The wireless device receives information regarding the status or operation of the target's application, and uses that information to determine what information and controls to present to the remote user. The remote user views information regarding the target application, and makes desired control selections using the available controls. The wireless device generates a message according to the control selections, and transmits the message to the target device. The target device acts responsive to the control message, and updated operational information may be sent to the remote wireless device.

Abstract: A novel planarizing probe card for testing a semiconductor device is presented. The probe card is adapted to come into contact with a probe card mount that is in adjustable contact with the prober. The probe card includes a printed circuit board affixed to a stiffener and a probe head that is in electrical contact with the printed circuit board. The probe head also includes a plurality of probe contactor tips that define a first plane. The stiffener further contains at least two planarizing adjusters that comes into contact with the probe card mount. The adjusters may be actuated to alter the position of first plane. A surface of the semiconductor device under test may define a second plane, and the adjusters may be adjusted to position the first plane to be substantially parallel to the second plane.