Patents Represented by Attorney McKay and Hodgson, LLP
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Patent number: 8352350Abstract: Financial data associated with one or more “contributing consumers” is obtained. The financial data is then aggregated, analyzed, and/or categorized, according to one or more events and one or more criteria/parameters associated with the financial transaction data and/or the contributing consumer. The aggregated and/or categorized data is then stored. A “user consumer” then initiates a request for predictive event cost data associated with one or more specified events and the aggregated and/or categorized data representing the event related changes in the financial data is searched based. Results data representing the changes in the financial data for one or more similarly situated contributing consumers associated the specified event is then obtained and presented to the user consumer.Type: GrantFiled: October 25, 2011Date of Patent: January 8, 2013Assignee: Intuit Inc.Inventors: James Robert Del Favero, Chris Lee, Barron R. Ernst, Marko Rukonic
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Patent number: 8346226Abstract: A method and system for creating a web listing using a mobile phone whereby a user, typically a business owner or a representative of the business, provides information/data associated with the business to a mobile application including an on-line directory service using a merchant mobile phone, or other mobile computing system, associated with the user and/or the business and/or a mobile application, and/or an SMS and/or another mobile communications network. The information associated with the business provided via the merchant mobile phone, or other mobile computing system, is then used by the on-line directory service to create an on-line presence for the business such as, but not limited to, an on-line web-listing for the business in the on-line directory that includes at least part of the information associated with the business provided via the merchant mobile phone, or other mobile computing system.Type: GrantFiled: February 1, 2010Date of Patent: January 1, 2013Assignee: Intuit Inc.Inventors: Kristina Gibson, Ben Ross, Christopher W. Phillips, Tonya Rado, Manish R. Shah
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Patent number: 8341835Abstract: A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is deposited within the via holes to form vias. A first buildup dielectric layer is formed on the encapsulation. Laser-ablated artifacts are laser-ablated in the first buildup layer. The laser-ablated artifacts in the first buildup layer are filled with a first metal layer to form a first electrically conductive pattern in the first build up layer. The operations of forming a buildup layer, forming laser-ablated artifacts in the buildup layer, and filling the laser-ablated artifacts with an electrically conductive material to form an electrically conductive pattern can be performed any one of a number of times to achieve the desired redistribution.Type: GrantFiled: May 5, 2009Date of Patent: January 1, 2013Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, David Jon Hiner
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Patent number: 8346630Abstract: A method and apparatus to efficiently verify inventory includes a process for verifying inventory in sub-sets using trigger parameters whereby priority status triggers are defined which indicate that an inventory item is particularly susceptible to inaccuracies/discrepancies between physical inventory and inventory as calculated by a computing system implemented financial management system. In one embodiment, transactions and/or events associated with units of the inventory item, or inventory item class, are then monitored for occurrence of any of the priority status triggers. In one embodiment, if one or more priority status triggers occur associated with the given inventory item, or inventory item class, the inventory item, or inventory item class, is given priority verify status indicating that the inventory item, or inventory item class, should be physically inventoried on a priority basis.Type: GrantFiled: June 30, 2006Date of Patent: January 1, 2013Assignee: Intuit Inc.Inventor: Neil Edward McKeown
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Patent number: 8346664Abstract: A system and method for modifying financial transaction categorization lists based on input from multiple users whereby, when a given user of a computing system implemented financial management system modifies their own list of possible categorizations for a given financial transaction, data indicating the given user's modification of the given user's own list of possible categorizations for a given financial transaction is obtained by the computing system implemented financial management system. The obtained data indicating the given user's modification of their own list of possible categorizations for a given financial transaction is then used by the computing system implemented financial management system to create and/or modify a shared list of possible categorizations for a given financial transaction.Type: GrantFiled: November 5, 2008Date of Patent: January 1, 2013Assignee: Intuit Inc.Inventors: Michael S. Klieman, Joseph William Wells, III, Kevin M. Reeth, II, Jeffrey Zimmerman
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Patent number: 8346568Abstract: A system and method for predictive bill estimation includes a process for predictive bill estimation whereby financial data associated with one or more “contributing consumers” is obtained from one or more sources. The financial data obtained from the one or more contributing consumers is then aggregated, analyzed, and/or categorized, according to one or more criteria/parameters associated with the financial transaction data and/or the contributing consumer. The aggregated and/or categorized financial data is then stored. A user consumer then initiates a request for cost/bill data associated with a given area and/or event. The aggregated and/or categorized financial data obtained from one or more contributing consumers is then searched based on one or more search parameters and results data representing multiple financial transactions and/or purchases associated the specified area and/or event is obtained.Type: GrantFiled: January 30, 2008Date of Patent: January 1, 2013Assignee: Intuit Inc.Inventors: James Robert Del Favero, Marko Rukonic, Chris Lee, Benjamin Weiss, John Reed Flora
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Patent number: 8337657Abstract: A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.Type: GrantFiled: October 27, 2010Date of Patent: December 25, 2012Assignee: Amkor Technology, Inc.Inventors: Brett Arnold Dunlap, Robert Francis Darveaux
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Patent number: 8338229Abstract: A method of forming a stackable plasma cleaned via package includes forming interconnection balls on terminals. The interconnection balls are encapsulated in a package body, e.g., molding compound. Via apertures are formed through the package body to expose the interconnection balls, wherein a contamination is formed on the interconnection balls. The contamination is removed using a plasma cleaning process. By removing the contamination, robust reflow of the interconnection balls is insured thus maximizing yield. Further, the plasma cleaning process is a cost efficient high volume process with no adverse effect on package reliability.Type: GrantFiled: July 30, 2010Date of Patent: December 25, 2012Assignees: Amkor Technology, Inc., Texas Instruments IncorporatedInventors: Ludovico E. Bancod, Jin Seong Kim, Kurt Peter Wachtler
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Patent number: 8334590Abstract: A semiconductor device for use in a printed circuit board is provided. In the semiconductor device, metal pillars are disposed perpendicular to bond pads of a semiconductor die. This configuration eliminates the need to form via holes for the connection of interconnection layers and the bond pads of the semiconductor die, thus simplifying the fabrication procedure of the semiconductor device. In addition, the semiconductor die is embedded in the semiconductor device. Based on this configuration, the use of the semiconductor device in a printed circuit board facilitates the stacking of a plurality of semiconductor dies and can reduce the thickness required for the stack, which make the semiconductor device light in weight and small in thickness and size.Type: GrantFiled: September 4, 2008Date of Patent: December 18, 2012Assignee: Amkor Technology, Inc.Inventors: Yoon Ha Jung, Kyu Won Lee, Chan Yok Park
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Patent number: 8335728Abstract: A method and system for providing real-time financial goal monitoring and analysis whereby a given user defines budgetary and/or financial goals for one or more financial categories for a given period of time. A merchant/category database is created that associates one or more merchants with potential financial categories and when the given user accesses a given user interface of a website associated with a given merchant, Uniform Resource Locator (URL) data for the website being accessed is obtained and used to identify the given merchant associated with the given website.Type: GrantFiled: December 15, 2009Date of Patent: December 18, 2012Assignee: Intuit Inc.Inventors: Ummulkiram Mohammed Dahodwala, Aaron Elias Berhanu, Simon Levy, Justin Glaeser
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Patent number: 8324511Abstract: A method includes applying a backside passivation layer to an inactive surface of an electronic component and to enclose a through via nub protruding from the inactive surface. The method further includes laser ablating the backside passivation layer to reveal a portion of the through via nub. The backside passivation layer is formed of a low cost organic material. Further, by using a laser ablation process, the backside passivation layer is removed in a controlled manner to reveal the portion of the through via nub. Further, by using a laser ablation process, the resulting thickness of the backside passivation layer is set to a desired value in a controlled manner. Further, by using a laser ablation process, the fabrication cost is reduced as compared to the use of chemical mechanical polish.Type: GrantFiled: April 6, 2010Date of Patent: December 4, 2012Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, Frederick Evans Reed, David Jon Hiner, Kiwook Lee
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Patent number: 8326725Abstract: A user of a data management system agrees to allow the data management system to obtain user data associated with the user from a third party target site computing system. A distributed client is then implemented on one or more user computing systems used by the one or more users to access the target site computing system. The data management system then makes a request to the distributed client, and the user computing system, to obtain desired data from the target site computing system. The distributed client(s) then accesses/access, directs the user computing system(s) to access, or waits for the user(s) to next access, the target site computing system. The target site computing system is then securely accessed by the user computing system, thereby by-passing any selective blocking/failure filters, and the requested data is accessed and provided to the data management system provider computing system.Type: GrantFiled: January 3, 2011Date of Patent: December 4, 2012Assignee: Intuit Inc.Inventors: Joseph Elwell, Alan Buhler, Marianne Y. Lu
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Patent number: 8323771Abstract: A capture pad structure includes a first dielectric layer. A trace is embedded within the first dielectric layer. A capture pad is also embedded within the first dielectric layer, the capture pad being an end portion of the trace. A blind via aperture extends partially through the first dielectric layer from a principal surface of the first dielectric layer to the capture pad. By forming the capture pad as the end portion of the trace, formation of the capture pad requires no change in direction or complex motion of the laser.Type: GrantFiled: August 15, 2007Date of Patent: December 4, 2012Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, Sukianto Rusli
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Patent number: 8322030Abstract: A method of making a substrate for a semiconductor package includes providing a laminated layer structure including a backing layer and a metal layer attached to the backing layer. A circuit layer is plated atop a first surface of the metal layer to form a circuit-on-metal structure. The circuit-on-metal structure is coupled to a dielectric layer by causing the dielectric layer to flow around the circuit layer to the first surface of the metal layer so that the circuit layer is embedded within the dielectric layer and the first surface of the metal layer is in direct contact with a first surface of the dielectric layer. The backing layer is then removed completely. The metal layer is then removed completely.Type: GrantFiled: November 1, 2007Date of Patent: December 4, 2012Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, Sukianto Rusli
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Patent number: 8316536Abstract: A method of making a semiconductor package substrate includes laser-ablating channels in the substrate. After the channels are ablated in the substrate, conductive material is added to fill the channels and cover the surface of the substrate. Then a photomask etching process simultaneously forms a circuit pattern above the surface of the substrate and removes excess metal above the channels, by removing metal above the surface only in patterned regions. The result is a two-level circuit pattern having conductors within and above the substrate.Type: GrantFiled: May 9, 2008Date of Patent: November 27, 2012Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, David Jon Hiner, Russ Lie
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Patent number: 8321309Abstract: A method and system for streamlined payroll set up and compliant paycheck generation whereby a computing system implemented payroll system is provided that maintains a payroll record for each employee. In one embodiment, data indicating the minimum information required by the law to generate a compliant paycheck is obtained. When a user begins the process of generating a paycheck for a given employee, the given employee's payroll record data is analyzed and compared with the data indicating the minimum information to determine if the given employee's payroll record data includes all of the minimum information. If the given employee's payroll record data includes the minimum information, then the given employee's payroll record is marked as having the compliant paycheck data and the requested paycheck is generated.Type: GrantFiled: July 27, 2009Date of Patent: November 27, 2012Assignee: Intuit Inc.Inventors: Amit Rameshchandra Jain, Timothy Hobson, Elizabeth C. Douglas, Nigel Tremar Menendez
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Patent number: 8320944Abstract: A method and system for creating customer lists and customer profiles using mobile computing systems whereby A mobile computing system based marketing device, such as a Short Message Service (SMS) message, is created by the merchant and/or product marketer through a mobile application that includes one or more “hooks” that are presented to the mobile customers to inquire about a given mobile customer's interest level in the mobile computing system based marketing device and/or the specific offer made through the mobile computing system based marketing device. The mobile computing system based marketing device is then distributed to selected mobile customers and one or more of the selected mobile customers who receive the mobile computing system based marketing device respond, or fail to respond, to the mobile computing system based marketing device.Type: GrantFiled: January 4, 2010Date of Patent: November 27, 2012Assignee: Intuit Inc.Inventors: Kristina Gibson, Ben Ross, Christopher W. Phillips, Tonya Rado, Manish R. Shah
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Patent number: 8315895Abstract: A method and system for obtaining review and rating updates within a review and rating system whereby a review and rating system is provided and a given review or rating associated with a given business, service, product, or other content is submitted to the review and rating system. Contact information associated with the user submitting the given review or rating is also obtained and then upon the occurrence of one or more events, the user submitting the original review or rating is contacted and asked to update the original review or rating and/or to provide additional data. Once the user's update to the original review or rating, and/or any additional data, is/are obtained, the given review or rating is transformed to reflect the update to the original review or rating, and/or any additional data.Type: GrantFiled: October 5, 2009Date of Patent: November 20, 2012Assignee: Intuit Inc.Inventors: Kyle Kilat, Joseph Lasee, Colin J. Roper
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Patent number: 8312064Abstract: Access to information or a document is secured by a central global positioning authority that evaluates access requests in accordance with predefined policies. One component of an access request includes location information regarding at least one of the requesting entity and location of the requested resource. Access is either allowed or denied as a function of at least the requesting entity, position information and the applicable policy or policies. An encryption/decryption scheme is implemented where the encryption key is a function of the resource's position.Type: GrantFiled: May 11, 2005Date of Patent: November 13, 2012Assignee: Symantec CorporationInventor: William J. Gauvin
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Patent number: 8300423Abstract: A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in the package body to expose the interconnection balls. The interconnection balls are treated to form treated interconnection balls comprising treated surfaces. The treated interconnection balls of the stackable treated via package enhance bonding with interconnection balls of a stacked electronic component package thus maximizing yield.Type: GrantFiled: May 25, 2010Date of Patent: October 30, 2012Assignee: Amkor Technology, Inc.Inventors: Robert Francis Darveaux, Ludovico Bancod, Akito Yoshida