Abstract: A semiconductor package for mounting a chip is disclosed. The package includes a first metal or metal alloy component having a first thin refractory oxide layer on a first surface. The chip is bonded to the first component. A skirt extends from the first component for strengthening the first component and providing heat transfer from the semiconductor package. A second metal or metal alloy lead frame having second and third refractory oxide layers on opposite surfaces is electrically connected to the chip and is bonded to the first oxide layer. Also, the lead frame is insulated from the first component by the first and second refractory oxide layers. A second metal or metal alloy component has a fourth refractory oxide layer on one surface and is bonded to the third refractory oxide layer so that the chip is hermetically sealed between the first and second components.

Abstract: A kit for the assembly of an adhesively sealed package designed to encase an electronic device is provided. The kit comprises a metallic base and cover components which are adapted to receive a polymeric adhesive. At least those portions of the base and cover component which will contact the polymeric adhesive are provided with a coating of a second metal or oxide. In one embodiment, first, second and third dry film adhesives are tacked to the base and cover components.

Abstract: An aqueous solution comprising alkali metal hydrosulfite and hydroxide ions in an amount to provide a residual alkalinity of at least 0.25 moles per liter results in the decomposition of thiosulfate ions present and inhibits their formation during storage. These solutions can be used, for example, in the bleaching of mechanical pulp.

Abstract: A solid calcium hypochlorite composition contains hydrated calcium hypochlorite and an alkali metal salt of phosphonobutane polycarboxylic acid having an available chlorine concentration of at least 50 percent by weight and a water content of at least 4 percent by weight.It has been found that the use of the novel compositions of the present invention can significantly reduce scale formation in dispensers for calcium hypochlorite particularly where water having high total alkalinity is used. The prevention or inhibition of scale formation is accomplished without harmfully affecting other properties of the pool water such as the pH.

Abstract: An integrated circuit assembly for electrical applications is disclosed. The assembly includes a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding is bonded to opposite surfaces of the substrate. The cladding consists essentially of about 15% to about 70% nickel and the balance essentially copper. The resulting lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C. A second embodiment of the integrated circuit assembly also relates to a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding material is bonded to opposite surfaces of the substrate for providing the circuit assembly with relatively high electrical and thermal conductivity. A second cladding is bonded to opposite surfaces of the first cladding so that the lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C.

Abstract: A process for producing 1,2,4-triazol-5-one comprises reacting a semicarbazide compound with a formic acid compound formylating agent in the presence of a catalytic amount of a sulfur-oxygen containing acid.The process is able to produce 1,2,4-triazol-5-one from semicarbazide hydrochloride having significantly lower concentrations of chloride ion, which is advantageous, for example, in the production of 3-nitro-1,2,4-triazol-5-one as an explosive used in castable explosive compositions.

Abstract: A multi-metal layer interconnect tape is provided. The tape is not supported by a dielectric carrier. A thin dielectric adhesive layer separates at least two self supporting metal foil layers. In one embodiment of the invention, conductive vias electrically interconnect leads formed in a first metal foil layer with ground and power circuits formed in a second metal foil layer. The metal foil layers are in close proximity so the vias have a low aspect ratio. The vias may be readily coated with continuous film of a conductive metal and are much easier to clean than conventional vias having significantly higher aspect ratios.

Abstract: A process for electrolyzing an aqueous catholyte solution comprising an alkali meal bisulfite to produce an alkali metal hydrosulfite in an electrolytic membrane cell having a cation exchange membrane separating a cathode compartment from an anode compartment, a porous cathode having a face adjacent the membrane, a back opposite, and a porous structure conjoining the face and the back, and a cathode-membrane gap between the porous cathode and the cation exchange membrane. The process comprises directing at least 50 percent of the volume of the aqueous alkali metal bisulfite catholyte through the porous cathode and transverse to the face and back of the cathode, the porous cathode having a ratio of total surface area to the projected surface area of at least about 30:1.High purity solutions of alkali metal hydrosulfites, such as sodium hydrosulfite having concentrations of at least 120 grams per liter, are produced at current densities in the range of 1.0 to 4.5 KA/m.sup.2 and at reduced cell voltages.

Abstract: A method for fabricating a ceramic superconductor comprising the following steps: mixing a copper or copper alloy metal, a first metal oxide or carbonate which includes one element selected from group IIA of the Chemical Periodic Table, and a second metal oxide or carbonate which includes one element selected from group IIIB of the Chemical Periodic Table to form a copper/ceramic mixture; heting a copper/ceramic mixture to a temperature in the range between 900.degree.-1100.degree. C.; and cooling the heated copper/ceramic mixture slowly, thereby forming a superconductive material. The copper/ceramic mixture may be extruded through a die prior to the heating step, thereby forming a superconductor of desired shape.

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.

Abstract: The average diameter of atomized droplets is reduced thereby reducing both the frequency of collisions between droplets as well as the turbulence at the liquid/solid interface. Reducing the porosity of a spray cast deposit leads to improvements in both the ductility and the electrical conductivity of the deposit.

Abstract: A process plate for the manufacture of molded electronic packages such as plastic pin grid array packages is provided. The process plate is a single fixture which is used to position terminal pins, align the pins for electrical interconnection and form the base of the mold during encapsulation. In one embodiment, the process plate comprises a support plate which is used for all standard terminal pin configurations and a thin cover plate which is specific for each terminal pin configuration. The process plate reduces the number of fixtures required to mold an electronic package reducing both cost and assembly error.

Abstract: A process for forming an integrated circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tapes and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

Abstract: A process for the purification of crude cyanuric acid containing aminotriazine compounds as impurities which comprises digesting the crude cyanuric acid in an aqueous solution containing low concentrations of a mineral acid. The mineral acid is, for example sulfuric acid, nitric acid, hydrochloric acid, or phosphoric acid. The digestion is operated at a temperature in the range of from about 120.degree. C. and about 220.degree. C. and autogenous pressure using a stoichiometric ratio of sulfuric acid to aminotriazine compounds of less than 1, to produce a slurry of purified cyanuric acid in an acid depleted ammonium sulfate solution.Purification of cyanuric acid by the process of the present invention permits a substantial reduction in the amounts of acid used in the digestion and the base required for ammonia stripping and neutralization of the spent acid from the digestion. This provides significant cost savings in the digestion and waste treatment methods.

Abstract: An effective amount of a reactive metal which reacts whith the spray casting atmosphere but not with the desired alloy is dissolved into the alloy prior to spray casting. Preferred reactive metals readily form a nitride which is finely dispersed throughout the spray cast alloy.

Abstract: A package adapted to encase an electronic component is disclosed. The package comprises a metallic lid component disposed on a metallic base component to form an enclosure adapted to receive said electronic component. A metallic leadframe is disposed between the base and lid components and is glass or polymer sealed therebetween. The base component is split into first and second base layers which are bonded together at their interface with a layer of electrically insulating glass or polymer. In one embodiment, the first and second base layers are bonded only around the edges of their interface, with the internal cavity thereby formed filled with a fluid or powder to enhance heat transfer between the layers. A fluid or powder may also be placed in the electronic component enclosure for further enhancement of heat transfer from the electronic component.

Abstract: A method to manufacture bulk polycrystalline superconducting materials having properties closely related to the properties of a single crystal of the superconducting material is provided. The method includes forming an oriented anisotropic structure by spray casting an atomized precursor onto a ceramic substrate. The precursor may be atomized in a neutral atmosphere and the resultant structure oxidized. In another embodiment, the precursor is atomized in an oxidizing atmosphere and the subsequent oxidation step may be omitted.

Abstract: A wrought metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The alloy composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and the oil flow into the well bore is not impeded.

Abstract: The present invention relates to a glass for making glass to metal seals. The coefficient of thermal expansion of the glass is in excess of 160.times.10.sup.-7 in/in/.degree.C. making the glass particularly useful for sealing copper and copper based alloys. The glass has particular utility in the manufacture of electronic packages and multi-layer circuitry.

Abstract: A process for coating a molybdenum base with an oxidation resistant layer. The oxidation resistant layer is applied as an oxide powder which is converted to the base metal or metal alloy by heating in a reducing atmosphere. The coating layer is characterized by good adhesion to the base and is readily wet by a solder or brazing material.