Abstract: Aluminized optical fiber (11) can be permanently bonded to silicon surfaces by applying both heat and pressure to the optical fiber. Thus, an optical fiber (11) can be bonded within a silicon V-groove (16) simply by applying heat and pressure, thereby to give an extremely accurate predetermined alignment of the central axis of the optical fiber within the V-groove, while avoiding the use of any potentially contaminating adhesives. This method can also be used to bond the aluminized fiber to aluminized V-grooves, as is described below.

Abstract: A first optical fiber support member (30) is held in a first fixture (35) having a first alignment pin (40) extending therefrom perpendicularly to an optical fiber array (32) and also having a first alignment aperture (43). A second support member (31) is held in a second fixture (37) having a second alignment aperture (41) and a second alignment pin (42) extending therefrom perpendicularly to the optical fiber array. When the two support members are clamped on opposite sides of the optical fiber array, they are aligned by engaging the first alignment pin (40) with the second alignment aperture (41) and engaging the second alignment pin (42) with the first alignment aperture (43). With the support members clamped, fluid adhesive is applied through an aperture (61) to bond the support members (30, 31) and optical fiber array (32) together. The first and second support members (30, 31) are made of plastic and are made by plastic molding.

Abstract: An optical waveguide is made by forming successively of light transmitting material a first clad layer (13), a core layer (15) and a second clad layer (18). The core layer has a higher refractive index than that of the first and second clad layers such that the core layer (15) can transmit light along its length as an optical waveguide. A sacrificial layer (14, 17) is formed surrounding at least a first end potion of the core layer. The sacrificial layer is selectively removed as by selective etching such that the first end portion of the core layer is separated from the first and second clad layers. With the end portion so isolated, a lens (22) can be formed on it such that light may be more effectively coupled to or from the core layer. Preferably, the lens is formed by heating the structure sufficiently to form a meniscus on the free end and then cooling it before the reminder of the core layer flows or melts. The cooling hardens the meniscus such that it constitutes an optical lens.

Abstract: First and second devices, such as a laser (11) and an optical fiber (12), are aligned by first positioning the laser on an x-y-z table (13) (such a table is capable of responding to electrical signals to make precise movements in mutually orthogonal x,y and z directions). The laser beam is imaged onto a machine vision camera (19) which develops signals representing the image of the laser beam and directs them to a computer (16). The computer analyzes the signal, calculates the center of the image, and determines from such calculation any deviations in the x and y directions of the position of the laser from its desired alignment position. Next, the optical fiber (12) is imaged on a machine vision camera (17). Signals from the camera representative of the image of the optical fiber end are directed to the computer (16) which calculates the center of the image and determines any deviation from its desired position.

Abstract: In a VGF crystal growth method, the configuration of the outer periphery of the seed crystal (15) has the same dimensions as the configuration of the inner surface of the major portion of the crucible (12).

Abstract: Prior to the production of microlenses (29) by the reactive ion etch technique, a pattern of notches (25) is formed in a second surface of a substrate (11) opposite a first surface on which the microlenses (29) are to be formed. Reactive ion etching of the first surface to produce the microlenses is sufficiently deep to reach the pattern of notches, thereby to separate the substrate. The array of notches may define, for example, an array of first areas (26) on the second surface, each area being surrounded by a notch. Photoresist elements (28) are then each located on an area of the first surface corresponding to a first area of the second surface, so that the separation separates the substrate into a plurality of segments (26) each containing only one of the microlenses (29). The notches can be made such that each of the segments (26) is cylindrical so that each of the microlenses formed from the substrate has a circular outer periphery.

Abstract: In a method for making optical fiber preforms, the time taken for sintering and annealing the clad or jacket layer is significantly reduced by only partially sintering the jacket soot boule in an atmosphere of helium. For example, instead of using one hundred forty-three minutes to sinter completely the soot boule, the boule is only partially sintered by heating in a helium atmosphere for fifty-nine minutes. At this stage of course, the soot boule is still partially porous and is generally opaque. The completion of the sintering and the annealing is then done in a single step in an atmosphere of nitrogen. Surprisingly, we have found that this process does not entrap nitrogen in the soot jacket layer to any noticeable or harmful extent, and the total time for sintering and annealing is significantly reduced.

Abstract: In a preferred embodiment of the invention, a substrate (11) is cleaned by immersing it in an organic solvent (17) and subjecting it to acoustic energy, immersing it in alcohol, immersing it in a surfactant, subjecting it to a cascading rinse in deionized water, baking it (FIG. 3 ), and thereafter subjecting it to ultraviolet light in an ozone ambient (FIG. 4). When the foregoing steps are followed, the contact angle is significantly reduced, and an encapsulant (14) that is thereafter applied provides more reliable protection to an encapsulated device (12) from outside contaminants.

Abstract: A substrate (10) is formed having first and second opposite flat surfaces. Photolithographic masking and etching is used to form on the first surface of the substrate at least one lens (25) having a central axis. Photolithographic masking and etching is also used to form on the second surface of the substrate an optical fiber guide (23). The fiber guide is then used to mount an optical fiber(27) on the second surface of the substrate such that the central axis of the optical fiber is substantially coincident with the central axis of the lens, thereby giving the desired alignment.

Abstract: Optical fibers (15) are supported within a bonded support member (16) having along opposite sides first and second grooves (14) which are parallel to the central axes of the fibers being supported. A first opening (22) is formed in a holder member (21) which includes a first projection (27). A cantilever spring member (23) is formed in the holder member having a second projection (27) opposite the first projection. The bonded fiber support member (16) is inserted into the opening such that the first projection engages the first groove (14) on one side, and the second projection engages the second groove (14) on the other side of the bonded support member. Thereafter, the bonded support member is locked into position and the holder biases one end of it against a polishing wheel (29) to permit polishing along a plane which is perpendicular to the axes of the optical fibers.

Abstract: A method for interconnecting first and second optical fiber bundles (FIG. 4 ), each bundle comprising a plurality of optical fibers, comprises the steps of accurately forming substantially identical matrix arrays of apertures in first and second thin securing plates (FIG. 1, 20, 17). The use of thin plates for the securing plate makes it possible to form apertures by masking and etching with great precision, but the plates themselves have little mechanical strength. The first and second plates are aligned (by balls 24), and a first support member (31), which is mechanically rugged, is simultaneously contacted to the first securing plate (17) and to a first alignment pin (27). The first support member (31) is bonded to the first securing plate while the first securing plate (17) is in alignment with the second securing plate (20).

Abstract: In a wafer fabrication process in which a photoresist stripper must be removed from the surface of a semiconductor wafer, the photoresist stripper is rinsed by inserting the wafer in a vessel (23, FIG. 3) filled with water and simultaneously pumping carbon dioxide and water into the vessel to cause the water to overflow the vessel. Preferably, the wafer is contained within the vessel for at least five minutes, and, during the rinsing step, the water completely fills the vessel and overflows at a rate of at least fifty percent of the volume of the vessel each minute. We have found that this method of rinsing photoresist stripper from semiconductor wafers significantly reduces or eliminates the incidence of corrosion pitting on aluminum conductors (12, FIG. 1) of the wafer (11).

Abstract: A triazine-based mixture, used as a multichip module device dielectric (14), is made more robust and more resistant to temperature extremes by making it to be of from twenty to sixty percent by weight of triazine and of one to ten percent by weight of siloxane-caprolactone copolymer. The foregoing mixture can be made to have a higher resolution by including zero to twenty percent by weight of novolak epoxy acrylate. The entire mixture preferably additionally comprises two to eight percent by weight of bisphenol-A diglycidyl ether monoepoxyacrylate, zero to twenty percent by weight of carboxyl-terminated butadiene nitrile rubber, two to six percent of N-vinylpyrrolidone, one to ten percent of trimethylolpropanetriacrylate, zero to five weight percent glycidoxypropyltrimethoxysilane, 0.05 to five weight percent photoinitiator, zero to two percent pigment, 0.1 to one percent surfactant, zero to 0.3 percent copper benzoylacetonate, and thirty to fifty percent solvent.

Abstract: As an optical fiber (12) is being drawn, air (14) is directed at a portion of the fiber as a succession of air pulses, the pulses having a frequency near the natural frequency of the fiber portion. The frequency of the air pulses is then varied over a range of frequencies that includes the natural frequency of the fiber portion. When the air pulse frequency equals the natural frequency of the fiber portion, a resonance occurs which greatly amplifies the amplitude of the vibration of the fiber portion. The large deflection of the fiber that occurs at resonance is easy to detect, and the air pulse frequency which causes such maximum deflection is taken as being equal to the resonant frequency and therefore to the natural frequency of the fiber portion. Changes of the detected resonant frequency can be interpreted in a straightforward manner as changes in optical fiber tension which, in turn, are used to make compensatory changes of the temperature of the furnace (10).

Abstract: An electronic device (12, 13) is substantially enclosed by a fluid encapsulant (17). The fluid encapsulant consists essentially of a silicone resin and a catalyst selected from the group consisting of platinum and tin. The silicone resin is selected from the group consisting of polydimethylsiloxane, polymethylphenylsiloxane, polydimethyldiphenylsiloxane, and mixtures thereof. Such silicone resins comprise molecules terminating in vinyl components and hydride components. The ratio of vinyl components to hydride components is maintained within the range of five to twenty. As will be explained more fully later, this ratio of vinyl components to hydride components assures that the resin will remain substantially a liquid even after cure, due to limited cross-linking or polymerization during the cure. The electronic device is contained within a container (16) having a sealed cover (18) for containing the liquid encapsulant during the operation of the electronic device.

Abstract: A first conductor array (24, FIG. 5) of an electronic device (21) such as an integrated circuit is interconnected to a second conductor array (25) of a first substrate (22) by, first, using photolithographic masking and etching to make an array of substantially uniformly spaced apertures (15, FIG. 2) in a mask (11). The mask is located over a second substrate (12), and the apertures are used to form an array of substantially uniformly spaced metal particles (19). The metal particles are joined with insulative material (11) to form a layer of anisotropic conductive material (20), and the anisotropic conductive material layer is removed from the second substrate. The conductors (24) in the first conductor array of the electronic device are registered with conductors (25) of the second conductor array of the first substrate (22), and the layer of anisotropic conductive materials is compressed between the first and second conductor arrays.

Abstract: A plurality of optical fibers (13) are first bonded to an upper surface of a flat flexible plastic substrate (12). The optical fibers are covered with a layer (20) of thermoplastic material to form a composite structure comprising the thermoplastic material, the optical fibers and the plastic substrate. The composite structure is then compressed at a first elevated temperature and at a first relatively high pressure which are sufficient to bond or tack the thermoplastic material to the plastic substrate. The temperature of a composite structure is then cool while maintaining the first relatively high pressure. Thereafter, a second elevated temperature is applied to the thermoplastic material while compressing the composite structure at a second pressure.

Abstract: A middle portion (13) of an optical fiber encapsulation (11) of an optical fiber ribbon is selectively removed, while leaving intact separated ribbon portions (14, 15) and optical fiber portions (12) extending between the separated ribbon portions. The exposed optical fiber portions are next contained between a pair of first optical fiber support members (18, 19) on opposite sides of the fiber portions. The support members are then preferably contained and encapsulated (FIGS. 7, 8) by injection molding plastic around them, which additionally reinforces the adjacent optical fiber ribbon portions. The optical fiber ribbon is cut for use by cutting transversely through the first support members and the optical fiber portions. This exposes optical fiber ends (27) which are polished for alignment and abutment to other optical fiber ends. The optical fiber support members also define an alignment aperture (20) that extends substantially parallel to the optical fiber portions.

Abstract: During a reactive ion etching process (FIG. 5) for making lens elements (15, FIG. 4) in a silica substrate (12), the gas constituency in the reactive ion etch chamber is changed to adjust the curvature of lens elements formed in the silica substrate and to reduce the aberrations of such lens elements. For example, two gases, CHF.sub.3 and oxygen may be supplied to the reactive ion etch chamber and, during the reactive ion etch process, the proportion of oxygen is significantly reduced, which reduces the aberrations of the lens elements formed by the process.

Abstract: A plurality of optical fibers (14-14E) are interconnected by using connectors each comprising an optoelectronic device (13-13E) adapted to be connected to an end of each optical fiber for converting optical signals to electrical signals and for converting electrical signals to optical signals. Each connector has a first contact (12-12E) having a cylindrical plug end and a cylindrical socket end located on a common axis and a transverse conductor (21) extending transversely to the axis (20) from the first contact and connected to the optoelectronic device of the connector. The plug end of each contact is adapted to fit snugly within the socket end of another first contact, whereby all of the contacts may be connected and arranged along the common axis. Each of the contacts is free to rotate with respect to other contacts to which it is connected; this permits the various optical fibers to extend in different radial directions from the axis.