Abstract: An information handling system includes stacks of printed circuit boards interconnected using an interconnection system. The printed circuit boards include network boards, system interface boards, memory boards, and central processing unit boards. The interconnection system for electrically connecting the various printed circuit boards includes a set of interconnection modules placed adjacent one another to form a substantially aligned row. The interconnection modules can be used to connect one stack to an orthogonally oriented stack or to a parallel oriented stack. The printed circuit board used in the interconnection system includes an inner rail positioned near the edge of the printed circuit board, an outer rail positioned near the edge of the printed circuit board, and an alignment stop attached to or positioned near one of the inner or outer rail. The most distant interconnection module of a row of aligned modules includes a spring attached thereto.
September 9, 1997
Date of Patent:
September 12, 2000
Cray Research, Inc.
Kent T. McDaniel, Bradley J. Smith, Gregory David Spanier