Patents Represented by Attorney Scwhabe, Williamson & Wyatt, P.C.

Find this attorney in the Justia Lawyer Directory

  • Electronic packaging including die with through silicon via
    Patent number: 7317256
    Abstract: An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the through silicon via of the first die. A mount having a lead is coupled to the through silicon via of the first die.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: January 8, 2008
    Assignee: Intel Corporation
    Inventors: Christina K. Williams, Rainer E. Thomas