Abstract: The present invention provides plating solutions, particularly copper plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Defect free filling of features is enhanced by a plating solution containing blends of polyethers (“carrier”) and organic divalent sulfur compounds (“accelerator”), wherein the concentration of the carrier ranges from about 0.1 ppm to about 2500 ppm of the plating solution, and the concentration of the accelerator ranges from about 0.05 ppm to about 1000 ppm of the plating solution. The plating solution is further improved by adding an organic nitrogen compound at a concentration from about 0.01 ppm to about 1000 ppm to improve the filling of vias on a resistive substrate.

Abstract: The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers.

Abstract: A method and apparatus for detecting the presence of a plasma. The apparatus comprises an electrically floating contact member that is exposed to a plasma forming region, for example, a semiconductor wafer processing chamber. The floating contact is coupled to a measuring device. When a plasma is present in the plasma forming region, the plasma induces a voltage upon the floating contact which is detected by the measuring device.

Abstract: A method and apparatus for conditioning a surface of a ceramic body in a process chamber when the process chamber has a vacuum pump, an anode and a cathode. The conditioning method consists of pumping the process chamber down to a vacuum with the vacuum pump, introducing a gas into the chamber, energizing the anode and cathode with RF power to ignite the gas into a plasma, sputter etchinq the surface with ions from the plasma to remove contaminants therefrom. The method is accomplished either within a process chamber to condition, in situ, a ceramic chuck or within a cleaning chamber to condition any form of ceramic body or component.

Abstract: A novel spindle motor assembly is disclosed that utilizes a fixed shaft and places the motor rotor components on the outside wall of the spindle hub directly below its disc stack supporting flange. The structure disclosed provides a compact yet powerful motor having a relatively low profile.

Abstract: A method and apparatus for providing subscription-on-demand (SOD) services for a interactive information distribution system, where a consumer may subscribe to packages of on-demand programs for a single price and view the programs in the subscribed package at any time for no additional cost. The apparatus and method are embodied in a combination of software, which provides a so called navigator, and hardware, including a subscriber terminal that provides certain functionality for the navigator and service provider equipment that supports the functionality of the terminal. As such, graphical user interface functionality is distributed between the service provider equipment and subscriber equipment (subscriber terminal). Such distribution provides an enjoyable, real time interactive process for accessing SOD services that allows the subscriber to rapidly identify and access a subscription service.

Abstract: The present invention provides a method of forming an aluminum nitride layer on a substrate in a processing chamber comprising depositing a first aluminum nitride layer at a first chamber pressure on a substrate, and then depositing a second aluminum nitride layer at a second chamber pressure higher than the first chamber pressure on the aluminum nitride nucleating layer. The first aluminum nitride layer is deposited by sputtering an aluminum target in a nitrogen and inert gas plasma in a processing chamber at a chamber pressure of about 1.5 to about 3 milliTorr. The second aluminum nitride layer is deposited by sputtering an aluminum target in a nitrogen and inert gas plasma at a chamber pressure of about 5 to about 10 milliTorr. The process may be carried out in the same physical vapor deposition chamber with the substrate being maintained at a temperature of preferably between about 125° C. and about 500° C.

Abstract: A layer of tungsten nitride is deposited on the upper surface of a wafer. The deposition is performed by providing a gaseous mixture and providing energy to the gaseous mixture to form a plasma. The gaseous mixture includes a first gaseous composition containing tungsten and a second gaseous composition containing nitrogen and hydrogen. The second gaseous composition is one that does not have a gas phase reaction with the first gaseous composition to form tungsten nitride, unless energy is provided to the gaseous mixture. The first gaseous composition may be tungsten hexafluoride (WF6). The gaseous mixture may be infused with energy to form a plasma by providing it with energy from an rf signal. In the plasma, the nitrogen dissociates into nitrogen ions, and the tungsten separates from the fluorine. The nitrogen ions and tungsten then combine to form tungsten nitride (W2N), which deposits on the wafer's upper surface.

Abstract: An integrated coil support and lens holder assembly for a magneto-optical read/write head defined on at least one wafer with a coil supported on a first surface including leads extending to an electrical feedthrough supported in part on the first surface, a lens supporting region supporting a lens in alignment with an open center region of the coil, an electrical feedthrough region defined adjacent the lens and extending through the integrated coil support and lens holder assembly to a second surface, an electrical contact layer extending through to the first surface to contact the electrical cross-over region for the coil, and ABS features incorporated in the integrated coil support and lens holder assembly.

Abstract: A method and apparatus that provides a dechucking voltage applied to an electrostatic chuck that facilitates removal of a workpiece or workpiece therefrom. The method incorporates residual chucking force information obtained from the preceding dechuck operation to modify and improve the dechucking algorithm for the subsequent wafer dechucking cycle. To avoid charge accumulation on the electrostatic chuck when processing a succession of workpieces, the chucking and dechucking voltages reverse polarity after each workpiece is dechucked.

Abstract: A single step shaft assembly and oil fill process begins with the sleeve and thrust plate being assembled, leaving open the entire shaft cavity. The assembly is then placed in an evacuation chamber, and air is evacuated. A measured amount of oil or hydrofluid is then placed in the shaft cavity. The shaft is then inserted in the shaft cavity and pressed or otherwise inserted into an opening in the thrust plate. When this is done, the oil will disperse throughout the bearing fluid gap and cavity. When properly measured, no oil will exit the cavity.

Abstract: An interactive information distribution system includes service provider equipment for generating an information stream that is coupled to an information channel and transmitted to subscriber equipment. The service provider also generates a command signal that is coupled to a command channel and transmitted to the subscriber equipment. The service provider also receives information manipulation requests from the subscriber via a back channel. A communication network supporting the information channel, command channel and back channel is coupled between the service provider equipment and the subscriber equipment. The service provider equipment contains two geographically distributed components: central server equipment and a remote video session manager. The central server equipment provides information streams to the remote video session manager in response to information manipulation commands.

Abstract: An apparatus which includes a laminated ceramic body with multilayer electrodes and a method of fabricating this apparatus are disclosed. The laminated ceramic body is formed by layers of ceramic material, with portions of certain layers being silk screened with an intermediate layer of electrically conductive material. Subsequent sintering results in the formation of a solid ceramic body with multilayer electrodes made up of the electrically conductive material layers. The apparatus further comprises an electrical connector extending partially into the ceramic body and intersecting at least one of these electrodes.

Abstract: A one-piece gas distribution faceplate for a showerhead. The one-piece gas distribution faceplate includes a first surface, a second surface, and a third surface. The one-piece gas distribution faceplate comprises a plurality of first gas holes extending through the one-piece gas distribution faceplate between the first surface and the second surface. The one-piece gas distribution faceplate has an internal gas distribution cavity defined by a plurality of interconnecting channels. A plurality of second gas holes extend through the one-piece gas distribution faceplate between the first surface into a plurality of the interconnecting channels. The interconnecting channels are fluidly coupled to a plenum that is in turn connected to at least one gas conduit. The gas conduit extends to the third surface.

Abstract: The present invention generally provides a system for processing substrates having a carrier disposed primarily in at least one processing chamber and at least one shuttle for transferring substrates between the processing chamber and a load lock chamber. A plurality of processing chambers, load lock chambers, and other chambers can be joined to create a series of modular chambers through which the substrates are processed. Preferably, the carrier is only exposed to the processing environment, i.e., the carrier does not shuttle into a non-processing chamber. Thus, during continuous sequential processing of substrates, thermal cycling of the carrier is reduced. The carrier is reversibly moved within the processing chamber along a track. Multiple processing zones separated by partitions allow a plurality of processing regimes to occur within the same processing chamber.

Abstract: A counter balance assembly for a lid assembly comprising a spring inside a housing assembly. The counter balance assembly is mounted to a lid, whose displacement generates an external force substantially along a longitudinal axis of the spring. A restoring force is generated by the spring to counteract an inertia force arising from the lid displacement.

Abstract: A method and apparatus for managing both link and disk bandwidth utilization within the context of a multiple subscriber or user information distribution system by selectively providing variable bitrate and constant low bitrate information streams to one or more subscribers.

Abstract: A hydrodynamic bearing having a shaft relatively rotatable with rest to a surrounding sleeve and having a thrust plate of or near one end thereof. The shaft and sleeve define a journal bearing extending substantially the full length of the two relatively rotating parts.

Abstract: The present invention provides a method and apparatus for filling contacts, vias, trenches, and other patterns, in a substrate surface, particularly patterns having high aspect ratios. Generally, the present invention provides a method for removing oxygen from the surface of an oxidized metal layer prior to deposition of a subsequent metal. The oxidized metal is treated with a plasma consisting of nitrogen, hydrogen, or a mixture thereof. In one aspect of the invention, the metal layer is Ti, TiN, Ta, TaN, Ni, NiV, or V, and a subsequent wetting layer is deposited using either CVD techniques or electroplating, such as CVD aluminum (Al) or electroplating of copper (Cu). The metal layer can be exposed to oxygen or the atmosphere and then treated with a plasma of nitrogen and/or hydrogen in two or more cycles to remove or reduce oxidation of the surface of the metal layer and nucleate the growth of a subsequent metal layer thereon.

Abstract: A layer of material is formed on a substrate in a partially formed integrated circuit on a wafer. The substrate undergoes a plasma annealing, during which the substrate is bombarded with ions. The plasma annealing may be performed by exposing the substrate to plasma that is generated from a nitrogen containing gas which is infused with energy. After the substrate is plasma annealed, a layer of a refractory metal nitride is deposited on the substrate. The layer of refractory metal nitride is then bombarded with a first set of ions. The bombardment of the refractory metal by the first set of ions may be achieved by performing a plasma annealing. The refractory metal nitride may be further bombarded by a second set of ions.