Abstract: An aluminum-containing film having an oxygen content within the film. The aluminum-containing film is formed by introducing hydrogen gas and oxygen gas along with argon gas into a sputter deposition vacuum chamber during the sputter deposition of aluminum or aluminum alloys onto a semiconductor substrate. The aluminum-containing film so formed is hillock-free and has low resistivity, relatively low roughness compared to pure aluminum, good mechanical strength, and low residual stress.

Abstract: A packaged integrated circuit device with a multi-level lead frame has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower lead frame and an upper lead frame, one of the lead frames being subdivided into a plurality of portions, each subdivided portion with an accessible tab for wire attachment. The planar capacitors are bonded to the bottom surface of the chip and act as a die support paddle. Each capacitor may be configured to provide the desired voltage decoupling and noise suppression for a particular portion of the integrated circuit to which it is connected. Capacitors useful for other purposes may be likewise provided in the package.

Abstract: An apparatus for applying a leaching solution to a mass of ore includes a plurality of first tubes which are connected to a supply of leaching solution. Each of the first tubes is fitted with emitters which are positioned at spaced intervals along the length of each first tube. The first tubes are connected with a manifold on their distal ends. A second tube is connected to the manifold. The second tube is fitted with a sprinkler which is positioned to distribute leaching solution over the surface area of the ore mass which is positioned intermediate adjacent emitters.

Abstract: Method and apparatus for the manufacture of fiber reinforced structures wherein tooling and a delivery head are employed for the placement of discrete, elongated fiber elements in mutually superimposed relationship to define reinforcement or stiffening members on fiber elements for the interiors or exteriors of composite shells and the consolidation of the fibers to form the cured composite structure. A consolidation medium is provided for the positioning and control of the fiber elements on the hard tooling and during the curing of the fiber elements. Method and apparatus for the manufacture of fiber reinforced structures.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip on board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: A dowel for use in the woodworking industry to secure two pieces of wood together is made of a composite, polymeric material comprising from about 4% to 90% by weight thermosetting resin and from about 10% to 96% by weight fibrous filler material. The thermosetting resin and the fibrous filler material are mixed together and then subjected to a high pressure and an elevated temperature to set the thermosetting resin and form a dense, hard mass of composite, polymeric material which is formed into the cylindrical shape of a dowel. The dowels have a surface that will adhere to conventional glues used in the woodworking industry.

Abstract: A process for forming an etch mask having a discontinuous regular pattern utilizes beads, each of which has a substantially unetchable core covered by a removable spacer coating. Beads which have a core and a spacer coating are dispensed as a hexagonally-packed monolayer onto a thermo-adhesive layer, which is on a target layer. The beads are kept in place by a bead confinement wall. Following a vibrational step which facilitates hexagonal packing of the beads, the resultant assembly is heated so that the beads adhere to the adhesive layer. Excess beads are then discarded. Spacer shell material is then removed from each of the beads, leaving core etch masks. The core-masked target layer is then plasma etched to form a column of target material directly beneath each core. The cores and any spacer material underneath the cores are removed. The resulting circular island of target material may be used as an etch mask during wet isotropic etching of an underlying layer.

Abstract: A plurality of lead frames is supplied in lead frame by lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device to each lead frame with the adhesive by holding the device in place to cure for a preselected period of time of about one second. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.

Abstract: A method of forming electrically conductive pillars on a printed circuit board by providing a printed circuit board having a plurality of electrical traces and forming a plurality of elongate, electrically conductive pillars of superimposed layers of solder and conductive polymer on the printed circuit board. The elongate, electrically conductive pillars are connected by a first end to the electrical traces of the printed circuit board and extend substantially perpendicularly from the printed circuit board such that a second end of each of the plurality of elongate, electrically conductive pillars lies in substantially a common plane which is substantially perpendicular to and above said printed circuit board.

Abstract: Diffusion juice of a sugar plant is heated under stable sucrose conditions, notably alkaline pH, and held above 70.degree. C. for sufficient duration to effect significant agglomeration. The agglomerated particulates are removed by phase separation procedures, leaving a clarified juice containing a very low, typically 0.1-0.5 volume percent, solids load.

Abstract: An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

Abstract: The present invention provides novel elements for improving genetic engineering techniques for producing recombinant nucleic acid molecules and/or recombinant cells. The novel elements are capable of integrating desired nucleic acid material into other nucleic acid materials, specifically into the genome of a host cell. The novel elements are derived from or based on transposons, in particular from the Tc/Mariner superfamily. In particular, the essential elements of Tc1 enabling excision and pasting of the desired nucleic acid material are provided, together with the relevant transposase activity in cis or in trans.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.