Abstract: To provide a fluorine-containing olefin represented, for example, by CH.sub.2 .dbd.CFCF.sub.2 --R.sub.f.sup.6 --(CH.sub.2).sub.k --X.sup.2 [wherein, X.sup.2 is ##STR1## R.sub.f.sup.6 is a fluorine-substituted fluorine-containing alkyl group having 1 to 40 carbon atoms or --OR.sub.f.sup.7 --(Rf.sup.7 is a fluorine-substituted fluorine-containing alkyl group having 1 to 40 carbon atoms or a fluorine-substituted fluorine-containing ether group having 3 to 50 carbon atoms), k is 0 or an integer of 1 to 6]; a fluorine-containing polymer with functional group which is prepared by polymerizing the above-mentioned olefin, has good affinity with various heat-resisting thermoplastic resins and is capable of forming homogeneous dispersion with the thermoplastic resin; and a thermoplastic resin composition comprising the above-mentioned fluorine-containing polymer with functional group and an aromatic polyester or the like as the heat-resisting thermoplastic resin.
Abstract: A dispersing stabilizer suitable for suspension polymerization of vinyl chloride or a monomer mixture mainly composed of vinyl chloride which can be used in a hot water charging polymerization process without any problems, and which can produce vinyl chloride homopolymer or copolymers having a good porosity, a large bulk density, a very low content of coarse particles and good physical properties, the dispersing stabilizer comprising a polyvinyl alcohol having a degree of hydrolysis of 75 to 85% by mole, an absorbance of not less than 0.1 measured at a wavelength of 280 m.mu.with respect to the 0.1% by weight aqueous solution, a content of carboxyl group of 0.01 to 0.15% by mole and a cloud point of not less than 50.degree. C. measured with respect to the 0.
Abstract: A dart having a shaft with a flight, a tip member, and a metal barrel connected between the shaft and the tip member, wherein the tip member has a rigid, cylindrical, solid core, and a hollow cylindrical shell receiving the rigid core, the hollow cylindrical shell having an outer thread at the rear end thereof threaded into a screw hole on one end of the metal barrel, a plurality of recessed portions equiangularly spaced around the periphery of the front end thereof, and a plurality of toothed annular portions raised around the periphery and arranged in parallel between the recessed portions and the outer thread for positioning in studs on a dart board, the recessed portions having a water drop-like shape and a depth gradually reduced from the front end of the cylindrical shell toward the toothed annular portions for guiding the tip member into engagement with the studs on the dart board.
Abstract: A heat sink for use in a computer for dissipating heat which includes a flat base plate having elongated coupling grooves and upright cylindircal sockets in the coupling grooves, a plurality of U-shaped radiating fins respectively mounted in the elongated coupling grooves at the flat base plate, and a slotted holding down plate covered on the flat base plate and secured to the upright cylindrical sockets at the flat base plate to hold down the radiating fins.
Abstract: A water container and cooling fan assembly including a fan motor base, a cylindrical housing mounted on the fan motor face and covered with a top cover, and a water container put inside the housing, the water container having a plurality of longitudinal turning angles defining with the housing a plurality of longitudinal wind passages through which induced currents of air from a fan in the fan motor base pass, top cover having a smoothly curved wind guide face on the inside adapted for guiding induced currents of air from the longitudinal wind passages to an exhaust port.
Abstract: A method for fabricating a bonded SOI wafer is provided in which no void is produced during a waiting period from the completion of a bonding step to the start of a bonding thermal processing step without a special restriction. The method for fabricating a bonded SOI wafer includes a bonding step in which an active wafer, which has been single- or both-side mirror polished and thermal oxidation processed to form an insulating layer of a predetermined thickness, is pressed and bonded to a single- or both-side mirror polished base wafer; and a bonding thermal processing step for carrying out a bonding thermal processing for bonding the wafer, in which a hydrophobic processing step for the base wafer and a hydrophilic processing step for the active wafer are carried out before the bonding step.
Abstract: An electrical female connector installed in a caravan for connection to a matching electrical male connector including a first terminal and a plurality of second terminals respectively mounted in axially extended center through hole and axially extended border through holes at a connector body inside a housing and connected to respective electrical wires of a cable fastened to the housing, wherein the connector body has a plurality of radial through holes through which screw can be respectively inserted and threaded into a respective screw hole at each second terminals to fix the respective electrical wires to the second terminals; the axially extended border through holes of the connector body are stepped, hexagonal through holes; the second terminals are stepped terminals each having a hexagonal upper section respectively fitted into and received inside the stepped, hexagonal border through holes at the connector body.
Abstract: A box end of a box end wrench having a substantially .OMEGA.-shaped constraint spring rod mounted therein for stopping the workpiece in the box end, enabling the workpiece to be positively turned with the box end wrench, the constraint spring rod having two opposite ends respectively inserted into two opposite radial through holes on the peripheral wall of the box end, and an arched middle section closely attached to the inside wall of the box end for stopping the workpiece in the box end.
Abstract: A video data transmission connector and transmission cable mounting arrangement includes a connector holder having a holder base and a hollow shell integral with the holder base, the hollow shell of the connector holder having a top mounting block and a bottom mounting hook for installation in a hole on a patch panel, wall plate or surface mount box, a circuit board mounted in the connector holder, a video data transmission connector welded to a front part of the circuit board and received inside the hollow shell of the connector holder with a front receiving side thereof aimed at an insertion hole on the hollow shell for receiving a matching electric connector, an insulation displacement connector welded to a rear part of the circuit board and coupled to two opposite upright side walls of the holder base, a video data transmission cable connected to the insulation displacement connector for video data transmission with the video data transmission connector through the circuit board, and a holding down cap fa
Abstract: A climber includes a driven bar revolvably supported in an upright support frame on a base frame and turned back and forth when two pedal bars are alternatively stepped up and down, a swivel holder revolvably supported on the driven bar and spaced between the upright support frame and a control block at the top of the driven bar to hold a handlebar unit, and an adjustment bar mounted in the swivel holder and moved between a first position where the swivel holder is turned with the driven bar, a second position where the swivel holder can be freely turned about the driven bar, and a third position where the swivel holder is fixed to the upright support frame.
Abstract: A cleaning system which includes a piping system connected between two opposite ends of the cooling loop of an air conditioning system and two opposite ends of a cooling medium reclaiming machine, a first storage tank and a second storage tank respectively connected between the two opposite ends of the cooling loop of the air conditioning system and the piping system, and a plurality of valves provided at the piping system for controlling the flowing direction of a cooling medium between the cooling loop of the air conditioning and the cooling medium reclaiming machine, and a hard grained material carried with the cooling medium through the cooling loop of the air conditioning system between the storage tanks to rub dirty deposit away from the inside wall of the cooling loop of the air conditioning system.
Abstract: A multipurpose, combined and pre-casting pile assembly, comprises an anchoring and extending piles configured in a shape of the Star of David which includes three V-shaped longer extensions and three V-shaped shorter extensions alternatively arranged. The center of the anchoring and extending piles have a hexagonal passage and a plurality of holes are arranged around the hexagonal passage. One end of the extending pile unit can be fixedly attached to the anchoring pile unit and another end of the extending pile can be connected with another extending pile unit by the use of connecting rods received in the holes arranged about the hexagonal passage. When two anchoring and extending pile units are spaced from each and the V-shaped longer extensions are aligned with each other, a continuous slab having a V-shaped groove at both sides can be disposed between two adjacent anchoring and extending piles units such that an embanking wall or water dam can be configured.
Abstract: A shock-absorbing racket handle having a plurality of grooves and solid blocks alternatively arranged along the length of the body thereof, and a plurality of longitudinal ribs respectively disposed in the grooves and connected between each two adjacent solid blocks in a staggered manner.
Abstract: A method of direct-bonding semiconductor wafers limits the time interval between a bonding step and a bonding anneal step or performs a baking step between the bonding and bonding anneal steps at a predetermined temperature for a predetermined time interval to prevent the formulation of voids on the edge regions of the wafers. The method for fabricating laminated semiconductor wafers includes a bonding step to fit together two polished semiconductor wafers by bonding jigs, and a succeeding bonding anneal step to laminate the wafers. In the method the bonding anneal step is preferably carried out within an hour following the bonding step; or a baking step at a predetermined temperature for a predetermined time interval is carried out between the bonding step and the bonding anneal step. Further, the method can prevent heavy metal impurities attached to the surface of the wafer from diffusing into the wafer by baking the wafer for over 5 minutes at above 100.degree. C.
Abstract: A tool holder having a handle at one end of a flat base thereof for carrying by hand or hanging on the wall, parallel ribs of different lengths raised from the flat base and defining a plurality of tool receiving grooves, a plurality of retainer blocks respectively raised from the flat base adjacent to one end of each tool receiving groove and a plurality of springy retainer rods suspended in respective side notches at the ribs at two opposite sides of each tool receiving groove remote from the retainer blocks for holding down storage tools in the tool receiving groove.
Abstract: A controlling device for conversion of DC power to sine wave AC power, including a boosting circuit, a sine wave generating circuit, a PWM wave generating circuit, a drive module, an MOSFET output circuit, a filter circuit, a protection circuit and a feedback circuit. The MOSFET output circuit outputs PWM wave by all-bridge type, whereby the safety in operation of the circuit is ensured and sine wave AC current is output.
Abstract: A socket for socket wrench having a magnetic bush mounted in a polygonal axial hole at one end thereof for attracting the workpiece to be turned, and a plurality of locating pins mounted in a plurality of radial holes thereof to stop the magnetic bush in place, the magnetic bush being moved axially in the polygonal axial hole between the locating pins and one end of the polygonal axial hole and having longitudinal slots which receive the locating pins.
Abstract: An apparatus for polishing semiconductor wafers is provided which is capable of efficiently polishing the semiconductor wafers one-by-one by a multi-step polishing, capable of preventing occurrence of spots and scratches due to attachment and detachment to and from top rings, and capable of polishing the semiconductor wafers with high-flatness surfaces. The polish apparatus includes a plurality of holding shafts for holding the semiconductor wafers, a polish table on which the semiconductor wafers are placed and polished, and means for upwardly and downwardly moving the semiconductor wafers which are held by the holding shafts, in which the upward and downward movement of the holding shafts and the attachment and detachment of the semiconductor wafers to and from the holding shafts are independently carried out for each of the holding shafts.
Abstract: Aqueous dispersion of a vinylidene fluoride (VdF) polymer which comprises a VdF polymer having a particle size of not more than 200 nm and contains 30 to 50% by weight of solids and not more than 1% by weight of a fluorine-containing surfactant on the basis of water. This aqueous dispersion is prepared by emulsion-polymerizing VdF monomer or a monomer mixture containing VdF under coexistence of not more than 1% by weight of the fluorine-containing surfactant and 0.001 to 0.1% by weight of a nonionic non-fluorine-containing surfactant on the basis of water, and is suitably used for paints.