Patents Represented by Attorney, Agent or Law Firm Wenderoth, Lind & Ponak, L.L.P.
  • Patent number: 8106521
    Abstract: In a semiconductor device mounted structure in which device electrodes of a semiconductor device and board electrodes of a board are connected to each other via bump electrodes, respectively, and in which a sealing-bonding resin is placed between the semiconductor device and the board, a void portion is placed at a position corresponding to an edge portion of the semiconductor device in the sealing-bonding resin. Thus, stress loads generated at corner portions of the semiconductor device due to board flexures for differences in thermal expansion and thermal contraction among the individual members caused by heating and cooling during mounting of the semiconductor device, as well as for mechanical loads after the mounting process, can be absorbed by the void portion and thereby reduced, so that breakdown of the semiconductor device mounted structure is prevented.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: January 31, 2012
    Assignee: Panasonic Corporation
    Inventors: Teppei Iwase, Yoshihiro Tomura, Kazuhiro Nobori
  • Patent number: 6399968
    Abstract: The present invention provides a photoreceiving device that is inexpensive and has good properties as a photoreceiving device for selectively receiving long wavelength light. This is a semiconductor photoreceiving device 10 for selectively receiving long wavelength light from multiplexed light including long wavelength light A and short wavelength light B. This photoreceiving device comprises a multilayered film 22 comprising alternately stacked layers of materials having mutually different indexes of refraction and the thicknesses and number of which are designed so as to transmit said long wavelength light and reflect said short wavelength light; and a first light-absorbing layer 14 composed of a material having a band gap wavelength longer than the wavelength of said long wavelength light.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: June 4, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Masanobu Kato, Ryozo Furukawa
  • Patent number: 5897106
    Abstract: A spring assembly comprising an inner ring spring and an outer ring spring suitable for use in a safety device for an automobile power window is provided. The inner ring spring is formed by substantially circularly bending a strip spring so that both ends thereof are away from each other and the outer ring spring is formed by substantially circularly bending a strip spring so that both ends thereof are away from each other, the outer ring spring being fitted with the inner ring spring. Stoppers are provided in the vicinity of one ends of the inner and outer ring springs respectively. Each stopper is engaged with the other end of other ring spring, thereby holding one end side of each ring spring in such a condition that one end side of each ring spring is resiliently abutted against one end side of other ring spring.
    Type: Grant
    Filed: September 17, 1997
    Date of Patent: April 27, 1999
    Assignees: Togo Seisakusyo Corporation, Aisin Seiki Kabushiki Kaisha
    Inventors: Michinori Murase, Hitoshi Ishikawa, Toshihiko Ishida
  • Patent number: 5841640
    Abstract: An IC socket comprises a socket body including a plurality of contacts for interconnecting an IC and a wiring board. Each of the contacts comprises a contacting arm including an upper end contact portion for a lead of an IC to overlie and contact, and a lower end contact portion including a downwardly facing projection capable of abutting with a wiring portion of the wiring board, and a pressing element projecting backwardly of the contacting arm from an area in the vicinity of a connecting portion between the projection and the contacting arm. The projection forming the lower end contact portion is received in an upwardly and downwardly open through-hole formed in the socket body, so as to be subjected to abutment with the wiring portion.
    Type: Grant
    Filed: July 31, 1997
    Date of Patent: November 24, 1998
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Sueji Shibata
  • Patent number: 5832693
    Abstract: A system for collecting prescribed injection ampules. In this system, it is possible to collect any ampules that cannot be collected from an automatic ampule dispenser with high efficiency. An ampule collecting apparatus has a tray supply unit for supplying trays. The trays supplied from the tray supply unit are sent into an ampule dispenser by an elevator unit and a conveyor unit, and moved downward in the dispenser by the downward conveyor unit. While the trays are being fed in the dispenser, ampules are put in the respective trays. The trays then exit the dispenser and stacked by the tray stacker. A drug name list is put in each tray. Of the ampules that are specified in a prescription, those which have not been collected from the ampule dispenser are highlighted on the list. Thus, a pharmacist can instantly see which ampules are not in the tray and can collect the missing ampules from a separate shelf.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: November 10, 1998
    Assignee: Kabushiki Kaisha Yuyama Seisakusho
    Inventors: Shoji Yuyama, Hiroshi Nose