Abstract: The present invention is directed to a device for quantitative analysis of an analyte in a liquid sample by detecting a magnetic label, an instrument for controlling the analysis process and displaying the results and a method for performing said analysis with said device and said instrument.

Abstract: A device for separation of damp silicon wafers from a wafer stack, whereby the damp wafers may be removed individually from the stack, transferred to a subsequent conveyor device and the damp thin fragile wafers held in the stack can be rapidly separated and isolated even in large format. The device comprises separation rollers on which the wafer stack may be placed. On rotation of the separation rollers, the lowest wafer is displaced under a doctor strip through a wafer-thin gap between the roller plane and doctor strip and withdrawn from the wafer stack by elastic pressure by a pair of superimposed delivery rollers driven at the same speed.

Abstract: The invention relates to a device for aligning overlapping ends of metal strips, particularly contact bands for photovoltaic solar cells, wherein the end of one of the metal strips is bent back. The device has an advance, displaceable first alignment element for aligning the upper end of one metal strip and a trailing, displaceable second alignment element for aligning the bent end of the other metal strip, and a contact element for the first alignment element and a contact element for the second alignment element. In this manner, a rapid and simple mechanical automated alignment of the overlapping ends of metal is made possible.

Abstract: A device for separation of damp silicon wafers from a wafer stack, whereby the damp wafers may be removed individually from the stack, transferred to a subsequent conveyor device and the damp thin fragile wafers held in the stack can be rapidly separated and isolated even in large format. The device comprises separation rollers on which the wafer stack may be placed. On rotation of the separation rollers, the lowest wafer is displaced under a doctor strip through a wafer-thin gap between the roller plane and doctor strip and withdrawn from the wafer stack by elastic pressure by a pair of superimposed delivery rollers driven at the same speed.