Abstract: An electronic assembly with integrated circuit capacitively coupled to antenna. The electronic assembly includes a strap assembly and an antenna assembly. The antenna assembly includes a first substrate and antenna elements. The strap assembly includes a second substrate and an integrated circuit embedded within the second substrate and substantially flush with a surface of the second substrate. Interconnections are formed to the integrated circuit. The interconnections are formed on the surface of the second substrate. The antenna assembly and the strap assembly are affixed to one another with the surface of the second substrate facing the antenna elements. The antenna elements capacitively couples to the integrated circuit through the interconnections with no direct contact. A non-conductive layer is disposed between the antenna elements and the interconnections providing the capacitive coupling.

Abstract: An RFID tag in one embodiment. The RFID tag includes at least one integrated circuit and an antenna pattern coupled to the integrated circuit, wherein the antenna pattern has an inductor pattern which limits the effect of misplacement of the integrated circuit relative to the inductor pattern. Other embodiments and methods of making these apparatuses are described.

Abstract: An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.

Abstract: Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements.

Abstract: A method and apparatus for testing RFID straps. Arrays of RFID straps in a roll-to-roll process are coupled to an array of test elements. RF programming and interrogation signals are frequency and time multiplexed to the RFID array. Return signals are detected to determine sensitivity and programmability parameters of the RFID straps.

Abstract: A Radio Frequency Identification (RFID) device. The RFID device comprises an antenna assembly and a resonator assembly. The antenna assembly comprises a first substrate and an antenna element. The resonator assembly comprises a second substrate having an integrated circuit connected to a resonator loop. The first substrate and the second substrate are attached to one another. The integrated circuit electrically couples to the antenna element without a direct mechanical contact.

Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

Abstract: Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.

Abstract: A protective layer for an electronic device and devices with a protective layer. In one exemplary embodiment, the protective layer includes two different layers which can be etched by the same etchant as which are at least one of optically or RF transparent.

Abstract: The invention provides intrafallopian devices and non-surgical methods for their placement to prevent conception. The efficacy of the device is enhanced by forming the structure at least in part from copper or a copper alloy. The device is anchored within the fallopian tube by imposing a secondary shape on a resilient structure, the secondary shape having a larger cross-section than the fallopian tube. The resilient structure is restrained in a straight configuration and transcervically inserted within the fallopian tube, where it is released. The resilient structure is then restrained by the walls of the fallopian tube, imposing anchoring forces as it tries to resume the secondary shape.

Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Abstract: Apparatuses and methods for forming microelectronic assemblies are claimed. One embodiment of the invention includes a contact smart card wherein fluidic self assembly is used to build the microelectronic structures on the microelectronic assembly such that a contact smart data is transmitted unidirectionally. A contact smart card is inserted directly into a device that transfers data to a microelectronic assembly coupled to the smart card. Another embodiment of the invention relates to a contactless smart card in which fluidic self assembly is also used here to build the microelectronic assembly. Data is transmitted to an antenna that is embedded in the contactless card in which a plurality of blocks were deposited thereon.

Abstract: An electronic device. The device comprises a metalization layer and an integrated circuit chip incorporated into the device wherein the integrated circuit chip is capacitively coupled to the metalization layer. The device comprises a first substrate having the metalization layer formed on the substrate, a cap layer covering at least the entire metalization layer and at least a portion of the first substrate not covered by the metalization layer. The integrated circuit chip is coupled to the first substrate, and is placed in proximity and in non-physical contact with the metalization layer. A conductive layer is attached to the integrated circuit chip. The conductive layer has at least a portion placed in a non-physical contact with the metalization layer. The integrated circuit chip is capacitively coupled to the metalization layer through the conductive layer and the metalization layer.

Abstract: The circuitry introduced in this invention selectively slows down the functioning of an electronic circuit by maintaining a particular state for a prolonged period of time. This circuitry is used not only to achieve the desired effect in maintaining security from electronic thieves trying to circumvent codes but also in other applications such as enabling a circuit to continue to function in the event of a brief loss of power. For example, in an RFID system, if a reader is frequency hopping, a tag loses power for as long as about 400 milliseconds when the reader changes to other frequencies. In a preferred embodiment, the disclosed circuitry is used in conjunction with a destruct sequence.

Abstract: The circuitry introduced in this invention selectively slows down the functioning of an electronic circuit by maintaining a particular state for a prolonged period of time. This circuitry is used not only to achieve the desired effect in maintaining security from electronic thieves trying to circumvent codes but also in other applications such as enabling a circuit to continue to function in the event of a brief loss of power. For example, in an RFID system, if a reader is frequency hopping, a tag loses power for as long as about 400 milliseconds when the reader changes to other frequencies. In a preferred embodiment, the disclosed circuitry is used in conjunction with a destruct sequence.

Abstract: Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

Abstract: Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously across a plurality of antenna structures of a roll of the web material. An RFID integrated circuit (IC) is attached to the web of antenna structures with the dissipative coating, then subsequently tested on the roll. Additional processing is performed to the RFID tag to produce an RFID label.

Abstract: An RFID tag in one embodiment. The RFID tag includes at least one integrated circuit and an antenna pattern coupled to the integrated circuit, wherein the antenna pattern has an inductor pattern which limits the effect of misplacement of the integrated circuit relative to the inductor pattern. Other embodiments and methods of making these apparatuses are described.

Abstract: Methods for fabricating an assembly having functional blocks coupling to a substrate. The method includes providing the substrate with receptor sites wherein each of the receptor sites is designed to couple to one of the functional blocks. Electrodes are coupled to the substrate. The electrodes cover the receptor sites such that portions of the receptor sites are coated with the electrodes. Applying a voltage source to the electrodes using a first electrical circuit such that each electrode has a voltage different from another electrode. The electrodes form an electric field. The functional blocks having electronic devices and being in a slurry solution are dispensed over the substrate. Each functional block is fabricated out of materials having a high dielectric constant such that said functional blocks are attracted to the higher field strength regions and are guided to the receptor sites.

Abstract: A method and apparatus for testing RFID straps. Arrays of RFID straps in a roll-to-roll process are coupled to an array of test elements. RF programming and interrogation signals are frequency and time multiplexed to the RFID array. Return signals are detected to determine sensitivity and programmability parameters of the RFID straps.