Patents Assigned to Allied Resin Corporation
  • Fluid separatory devices having improved potting and adhesive compositions
    Patent number: 4879032
    Abstract: Fluid separatory devices containing novel polyurethane potting and adhesive compositions comprising the reaction product of an aliphatic polyisocyanate with a propoxylated polyether amine in the presence of a metallo-organic catalyst selected from the group consisting of the organic acid salts and the .beta.-diketonates of zinc, iron, copper, manganese, mercury, lead, and mixtures thereof, said catalyst being present in an amount effective to substantially increase the cure rate and prevent bubble formation. Nontoxic metallo-organic catalysts based on zinc, iron, and copper are preferred for use in separatory devices for blood dialysis and water purification.
    Type: Grant
    Filed: June 4, 1984
    Date of Patent: November 7, 1989
    Assignee: Allied Resin Corporation
    Inventor: John C. Zemlin
  • Flow molding surface of plastic and conductive particles
    Patent number: 4140461
    Abstract: Thermosetting molds are formed with electrically conductive surfaces for use in high frequency energy flow molding of sheet materials. Preferably the mold of this invention has a highly electrically conductive layer preferably in an epoxy gel coat carrying electrically conductive particles of gold, silver or platinum and positioned over a compatible epoxy mold body. A vacuum molding technique is used to obtain good surface definition in surface molding.
    Type: Grant
    Filed: August 19, 1977
    Date of Patent: February 20, 1979
    Assignee: Allied Resin Corporation
    Inventors: Paul J. Wiley, Robert Davis
  • Polymer backed silicone rubber molds and means for forming bonds with polyorganosiloxanes
    Patent number: 4070224
    Abstract: A mold has a silicone rubber body defining a molding cavity with a polymeric backer forming a support for the body integrally joined to the body by an adhesive bond. A cured silicone rubber or silicone resin is bonded to anyone of a variety of polymeric substances by applying an activating primer such as trimethylbenzyl ammonium hydroxide and subsequently or simultaneously applying a bridging agent which bonds to the activated silicone surface and also provides bonding sites for later attachment to polymers containing isocyanates, epoxides and/or other reactive groups.
    Type: Grant
    Filed: July 19, 1976
    Date of Patent: January 24, 1978
    Assignee: Allied Resin Corporation
    Inventors: John C. Zemlin, Robert Davis
  • Flow molding means and method
    Patent number: 3937774
    Abstract: Thermosetting molds are formed with electrically conductive surfaces for use in high frequency energy flow molding of sheet materials. Preferably the mold of this invention has a highly electrically conductive layer preferably in an epoxy gel coat carrying electrically conductive particles of gold, silver or platinum and positioned over a compatible epoxy mold body. A vacuum molding technique is used to obtain good surface definition in surface molding.
    Type: Grant
    Filed: October 31, 1973
    Date of Patent: February 10, 1976
    Assignee: Allied Resin Corporation
    Inventors: Paul J. Wiley, Robert Davis