Patents Assigned to Amphenol Corporation
  • Patent number: 11563295
    Abstract: A contact member includes, an outer conductor including a mating interface section that includes a front end of the outer conductor, a termination section including a rear end of the outer conductor, and a middle section therebetween joining the mating interface and termination sections; an inner conductor received in the mating interface section; and a protective insulator including a main portion received in the mating interface section of the outer conductor and supporting the inner conductor and including an end portion configured for closed entry mating. The end portion has an end face extending outside of the front end of the outer conductor.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: January 24, 2023
    Assignee: AMPHENOL CORPORATION
    Inventors: Michael A. Hoyack, Owen R. Barthelmes, Kenneth Capozzi
  • Patent number: 11563292
    Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: January 24, 2023
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Robert Richard, Eric Leo
  • Publication number: 20230017428
    Abstract: A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 19, 2023
    Applicant: Amphenol Corporation
    Inventor: Michael D. Long
  • Publication number: 20230010530
    Abstract: A high frequency cable connector with a plug connector terminating shielded cables via a plurality of cable connection modules attached to a paddle card. The terminations do not significantly disrupt the high integrity signal paths within the cables, even at high frequencies. Various techniques may be used, alone or in combination, to form the termination, including that the wire insulators and shields of the cables extend almost to the point of termination, with a relatively small length of wire extending beyond the insulator and shield; welding of cable wires to signal terminals in the modules; signal terminals and ground terminals held within the modules with a controlled relative spacing; signal terminals of the modules surface mount soldered to pads on the paddle card; narrow pads approximating the width of traces in the paddle card; and short pads, approximating the length of mounting ends of the signal terminals.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 12, 2023
    Applicant: Amphenol Corporation
    Inventor: Mark M. Ayzenberg
  • Publication number: 20230012133
    Abstract: A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 12, 2023
    Applicant: Amphenol Corporation
    Inventor: Michael D. Long
  • Patent number: 11553589
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 10, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: 11546983
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 3, 2023
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
  • Patent number: 11539148
    Abstract: An electrical connector that includes an outer conductive shell that encloses at least one signal contact therein and includes a front end for mating with a mating connector and a back end opposite the front end for electrically connecting to a printed circuit board. A primary ground connection is located inside or outside of the outer conductive shell, the primary ground connection being configured to electrically engage the mating connector with the printed circuit board or coaxial cable. A secondary ground connection is located inside or outside of the outer conductive shell and is configured to electrically engage the mating connector with the printed circuit board or the coaxial cable.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: December 27, 2022
    Assignee: AMPHENOL CORPORATION
    Inventors: Owen R. Barthelmes, Michael A. Hoyack
  • Patent number: 11539171
    Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: December 27, 2022
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
  • Patent number: 11527840
    Abstract: A cable connector that includes an inner subassembly that includes a coupling nut for coupling to a mating connector or port and a post end for electrically connecting to a cable. An outer body includes separable sections that form an inner bore when assembled. The inner bore is configured to receive at least the post end of the inner subassembly. Each section of the outer body has a proximal end and a distal end and the distal ends are configured to accept the cable. The sections are releasably engaged for assembly of the outer body around at least a portion of the inner subassembly.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: December 13, 2022
    Assignee: Amphenol Corporation
    Inventors: Rakesh Thakare, Iuliu Cosmin Gordea, Caichun Song, Stefan Nicholas Hoogendoorn, Nicholas Padfield, Keith Mothersdale
  • Publication number: 20220393404
    Abstract: A spring seal for a cage of a high speed I/O connector, such as those compliant with an OSFP standard. The spring seal suppresses resonances in the operating frequency range of the connector in a space between the cage and a transceiver inserted in a channel of the cage to mate with the I/O connector. The spring seal has multiple peaks, separated by valleys, with short conducting paths between the peaks and valleys. The spring seal may connect a conductive exterior of the transceiver to a wall of the cage, with the peaks contacting a conductive exterior of the transceiver and the valleys contacting walls of the cage. The spring seal may have a plurality of slits that reduce the spring force while providing conducting paths between peaks and valleys.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 8, 2022
    Applicant: Amphenol Corporation
    Inventors: Jason Si, R. Brad Brubaker, Brian Kirk
  • Patent number: 11522310
    Abstract: An electrical connector with improved high frequency performance. The connector has conductive elements, forming both signal and ground conductors, that have multiple points of contact distributed along an elongated dimension. The ground conductors may be formed with multiple beams of different length. The signal conductors may be formed with multiple contact regions on a single beam, with different characteristics. Signal conductors may have beams that are jogged to provide both a desired impedance and mating contact pitch. Additionally, electromagnetic radiation, inside and/or outside the connector, may be shaped with an insert electrically connecting multiple ground structures and/or a contact feature coupling ground conductors to a stiffener. The conductive elements in different columns may be shaped differently to reduce crosstalk.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: December 6, 2022
    Assignee: Amphenol Corporation
    Inventor: Thomas S. Cohen
  • Patent number: 11509075
    Abstract: An electrical connector that has a conductive shell supporting at least one signal contact therein and that has a front end for mating with a mating connector and a back end opposite the front end for electrically connecting to a coaxial cable. A ground connection is located inside of the conductive shell. A coupling member is rotatably coupled to the conductive shell and has an engagement feature for mechanically engaging a support panel associated with the mating connector. A sealing member is disposed on the conductive shell that is configured to provide an environmental seal between the conductive shell and the support panel when the conductive shell is mated with the mating connector.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: November 22, 2022
    Assignee: AMPHENOL CORPORATION
    Inventors: James Todd Smith, Michael A. Hoyack, Owen R. Barthelmes
  • Publication number: 20220361320
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Applicant: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20220352675
    Abstract: A connector for use with high speed signals. The connector may include lead frame assemblies in a connector housing. A lead frame assembly may include signal conductive elements and ground conductive elements disposed in a repeating pattern, and one or more corrugated sheets attached to the ground conductive elements. The corrugated sheets may extend more than half of the length of the signal conductive elements. Valleys of the corrugated sheets may be welded to the ground conductive elements with line welds. The line welds may extend over a large percentage of the length of the conductive elements. Such a configuration enables accurately and repeatedly establishing signal to ground spacing and therefore promotes high signal integrity, even for miniaturized connectors. Such a connector may be used to meet signal integrity requirements in connectors designed for 112 GBps and beyond.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 3, 2022
    Applicant: Amphenol Corporation
    Inventors: Arkady Y. Zerebilov, Michael Rowlands, Theron Ensminger, Jeremy Shober
  • Patent number: 11489300
    Abstract: A connector that has a conductive shell that supports at least one signal contact therein. The shell comprises a front end for mating with a mating connector and a back end opposite the front end for connecting to a power or data transmission cable. A coupling member is configured to engage the conductive shell and engage a corresponding component associated with the mating connector to mechanically couple the connector and the mating connector together. A plurality of ground connections are provided at the front end of the conductive shell and the front section of the coupling member for grounding.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: November 1, 2022
    Assignee: Amphenol Corporation
    Inventors: James T. Smith, Michael A. Hoyack, Owen R. Barthelmes
  • Publication number: 20220329015
    Abstract: An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
    Type: Application
    Filed: May 25, 2022
    Publication date: October 13, 2022
    Applicant: Amphenol Corporation
    Inventors: Daniel B. Provencher, Mark W. Gailus, David Manter, Vysakh Sivarajan
  • Patent number: 11444398
    Abstract: A connector module for an electrical connector that has at least one wafer assembly with at least one conductive member and at least one contact wafer. The contact wafer includes a plurality of contacts including at least one signal contact and at least one ground contact. Each of the contacts has a board engagement end configured to engage a printed circuit board and a mating interface end opposite thereof and configured to connect with a contact of a mating connector module. A grounding gasket receives the board engagement ends of the contacts of the wafer assembly. The grounding gasket has at least one portion in electrical contact with the ground contact of the plurality of contacts. The ground contact of the contact wafer is in electrical contact with both the conductive member and the grounding gasket, thereby defining a grounding path through the connector module to the board.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: September 13, 2022
    Assignee: AMPHENOL CORPORATION
    Inventors: Philip T. Stokoe, Djamel Hamiroune
  • Patent number: 11444402
    Abstract: An electrical socket and method of making an electrical socket. The socket includes a body that has spaced contact beams extending between the first and second ends and an inner receiving area for accepting a mating pin. The contact beams are configured for aligning into a hyperbolic geometry. Each of the contact beams has a middle section between first and second end sections. Each middle section has a pre-formed contour that defines a cross-section of each contact beam that defines a fully radiused, inner contact area without sharp edges such that each middle section extends further into the inner receiving area than the first and second end sections when the contact beams are aligned into the hyperbolic geometry and such that the fully radiused, inner contact areas of the contact beams are positioned for contact with the mating pin when inserted into the inner receiving area of the socket body.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: September 13, 2022
    Assignee: AMPHENOL CORPORATION
    Inventor: Michael E. Uppleger
  • Patent number: D980168
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: March 7, 2023
    Assignee: Amphenol Corporation
    Inventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk