Patents Assigned to Amphenol Corporation
  • Publication number: 20210329775
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20210315102
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Application
    Filed: June 15, 2021
    Publication date: October 7, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., Mark W. Gailus, Tom Pitten, Donald A. Girard, JR., Huilin Ren
  • Patent number: 11128080
    Abstract: An electrical connector or electrical connector assembly that has a housing, a contact carrier, one or more spring members, and an interposer or contact system. The contact carrier is movable with respect to the housing between unmated and mated electrical positions.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: September 21, 2021
    Assignee: Amphenol Corporation
    Inventors: Ronald I. Frank, James R. Meszaros, George L. Goulart, Jr., Braden J. Ishaug, Robert G. Hennemuth, III, Michael D. Smith, Michael A. Yashin, Gordon J. Udall, Daniel R. Mcnevin
  • Patent number: 11108180
    Abstract: Electrical connectors including superelastic components. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. A connector can include one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members may deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: August 31, 2021
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine
  • Publication number: 20210257788
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Patent number: 11096270
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: August 17, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20210234290
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 29, 2021
    Applicant: Amphenol Corporation
    Inventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Patent number: 11075473
    Abstract: An electrical connector that comprises an outer conductive shell supporting at least one signal contact therein and that includes a front end for mating with a mating connector and a back end opposite the front end for electrically connecting to a printed circuit board or a coaxial cable. A primary ground connection is located either inside or outside of the outer conductive shell. The primary ground connection is configured to electrically engage the mating connector with the printed circuit board or with the coaxial cable. A secondary ground connection is located either inside or outside of the outer conductive shell. The secondary ground connection is configured to electrically engage the mating connector with the printed circuit board or with the coaxial cable.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: July 27, 2021
    Assignee: Amphenol Corporation
    Inventors: Owen R. Barthelmes, Michael A. Hoyack
  • Publication number: 20210227683
    Abstract: A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 22, 2021
    Applicant: Amphenol Corporation
    Inventors: Michael Rowlands, Ali Hammoodi
  • Patent number: 11070006
    Abstract: A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: July 20, 2021
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Allan Astbury, David Manter, Marc B. Cartier, Jr., Vysakh Sivarajan, John Robert Dunham
  • Publication number: 20210219420
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Application
    Filed: March 31, 2021
    Publication date: July 15, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20210218198
    Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
  • Patent number: 11061192
    Abstract: A fiber optic cable connector for connecting the terminal ends of two fiber optic cables having termini of respective ones of multiple optical fibers included within said cables. The connector has a termini with a pin body that includes a flat alignment surface at the rear of the main body. The pin body is received in a bore of an insert body. The forward face of the insert body has a shoulder that partially obstructs the bore and aligns with the flat alignment surfaces of the pin body. The shoulder and flat alignment surface cooperate to ensure that the termini is properly inserted into the bore so that an angled forward contact surface of the termini is properly aligned with the angled forward contact surface of a mating termini of another connector.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 13, 2021
    Assignee: Amphenol Corporation
    Inventors: Jon M. Woodruff, Sean M. McCalley, Michael L. Cox
  • Patent number: 11056807
    Abstract: A float connector for interconnecting printed circuit boards that has a contact assembly including a contacts and a holder and each of the contacts has opposite first and second contact ends for electrically connecting to the boards. A first guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the first contact ends. A second guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the second contact ends. A biasing member biases the guide members away from one another to an open position. Axial float of the contact assembly is provided between the first and second guide members to compensate for axial misalignment between the first and second printed circuit boards. Radial float of the contact assembly is provided between the first and second guide members to compensate for radial misalignment between the boards.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: July 6, 2021
    Assignee: Amphenol Corporation
    Inventors: Michael A. Hoyack, Joachim I. Grek, Owen R. Barthelmes
  • Patent number: 11057995
    Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: July 6, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, Tom Pitten, Donald A. Girard, Jr., Huilin Ren
  • Publication number: 20210203096
    Abstract: An electrical connector with improved high frequency performance. The connector has conductive elements, forming both signal and ground conductors, that have multiple points of contact distributed along an elongated dimension. The ground conductors may be formed with multiple beams of different length. The signal conductors may be formed with multiple contact regions on a single beam, with different characteristics. Signal conductors may have beams that are jogged to provide both a desired impedance and mating contact pitch. Additionally, electromagnetic radiation, inside and/or outside the connector, may be shaped with an insert electrically connecting multiple ground structures and/or a contact feature coupling ground conductors to a stiffener. The conductive elements in different columns may be shaped differently to reduce crosstalk.
    Type: Application
    Filed: February 22, 2021
    Publication date: July 1, 2021
    Applicant: Amphenol Corporation
    Inventor: Thomas S. Cohen
  • Publication number: 20210194182
    Abstract: A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.
    Type: Application
    Filed: March 8, 2021
    Publication date: June 24, 2021
    Applicant: Amphenol Corporation
    Inventors: Mark W. Gailus, Allan Astbury, David Manter, Marc B. Cartier, JR., Vysakh Sivarajan, John Robert Dunham
  • Publication number: 20210184404
    Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.
    Type: Application
    Filed: February 22, 2021
    Publication date: June 17, 2021
    Applicant: Amphenol Corporation
    Inventors: Thomas S. Cohen, Robert Richard, Eric Leo
  • Publication number: 20210175670
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: November 23, 2020
    Publication date: June 10, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20210167529
    Abstract: A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17 dB insertion loss.
    Type: Application
    Filed: December 16, 2019
    Publication date: June 3, 2021
    Applicant: Amphenol Corporation
    Inventors: Mark M. Ayzenberg, Khwajahussain Gadwal Mohammed, Erdem Matoglu, Catalin Muntean