Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.

Abstract: The opto-electronic module comprises a first substrate member; a second substrate member; a first spacer member comprised in the first substrate member or comprised in the second substrate member or distinct from and located between these, which comprises at least one opening; a light emission element arranged on the first substrate member; a first passive optical component; at least one of the first and second substrate members comprising one or more transparent portions through which light can pass, the first passive optical component being comprised in or distinct from the one or more transparent portions, and wherein the first passive optical component has adjustable optical properties. Such modules are well mass-producible in high precision and can be used in photo cameras, e.g., as flashes.

Abstract: A thermally tunable optoelectronic module includes a light emitting assembly operable to emit light of a particular wavelength or range of wavelengths. The light emitting assembly is disposed to a temperature-dependent wavelength shift. The thermally tunable optoelectronic module further includes an optical assembly aligned to the light emitting assembly, and separated from the light emitting assembly by an alignment distance. The thermally tunable optoelectronic module further includes a thermally tunable spacer disposed between the optical assembly and the light-emitting assembly, the thermally tunable spacer is operable to counteract the temperature-dependent wavelength shift.

Abstract: The present disclosure describes subassemblies and optoelectronic modules in which an optics system, or a spacer laterally surrounding a cover glass, includes a flange which facilitates mechanical attachment of the optics system to the spacer.

Abstract: Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.

Abstract: Time-of-flight (TOF) based systems using light pulse compression are described and, in some cases, can help increase demodulation contrast. Further, light pulse shaping techniques are described that, in some cases, can help reduce phase non-linearity and distance-calculation errors. The techniques can be used, for example, in measurement systems, as well as imaging systems in which a time-of-flight and/or distance information is obtained. The time-of-flight and/or distance information can be used to reconstruct and display a three-dimensional image of a scene. The light compression techniques also can be used to provide reference signals.

Abstract: Optoelectronic modules (100) are operable to distinguish between signals indicative of reflections from an object of interest and signals indicative of a spurious reflection. Various modules are operable to recognize spurious reflections by means of dedicated spurious-reflection detection pixels (126) and, in some cases, also to compensate for errors caused by spurious reflections.

Abstract: Presenting a merged, fused three-dimensional point cloud includes acquiring multiple sets of images of a scene from different vantage points, each set of images including respective stereo matched images and a color image. For each respective set of images, a disparity map based on the plurality of stereo images is obtained, data from the color image is fused onto the disparity map so as to generate a fused disparity map, and a three-dimensional fused point cloud is created from the fused disparity map. The respective three-dimensional fused point clouds is merged together so as to obtain a merged, fused three-dimensional point cloud. The techniques can be advantageous even under the constraints of sparseness and low-depth resolution, and are suitable, in some cases, for real-time or near real-time applications in which computing time needs to be reduced.

Abstract: The wafer-level method for applying N?2 first elements to a first side of a substrate, wherein the substrate has at the first side a first surface including the steps of providing the substrate, wherein at least N barrier members are present at the first side, and wherein each barrier member is associated with one of the first elements. For each of the first elements, the method includes bringing a first amount of a hardenable material in a flowable state in contact with the first surface, the first amount of hardenable material being associated with the first element; controlling a flow of the first amount of hardenable material on the first surface with the associated barrier member; and hardening the first amount of hardenable material to interconnect the first surface and the respective element.

Abstract: Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.

Abstract: The present disclosure describes optoelectronic modules that, in some implementations, address the need to combine precise measurements of scenes over a range of near and far distances. For example, an optoelectronic module can include a light emitter operable to direct modulated structured light onto a scene. The module includes an imager to receive reflected light signals from the scene. The imager includes demodulation pixels operable to provide amplitude and phase information based on the reflected light signals. Various techniques can be used to derive distance or three-dimensional information about the scene based on the signals from the pixels.

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

Abstract: This disclosure describes systems and techniques for generating a disparity map having reduced over-smoothing. To achieve the reduction in over-smoothing that might otherwise occur, a third image is captured in addition to stereo reference and search images. Information from the third image, which may be of the same or different type as the stereo images (e.g., RGB, grey-scale, infra-red (IR)) and which may have the same or different resolution as the stereo images, can help better define the object edges.

Abstract: This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.

Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.

Abstract: The present disclosure describes imaging techniques and devices having improved autofocus capabilities. The imaging techniques can include actively illuminating a scene and determining distances over the entire scene and so that a respective distance to each object or point in the scene can be determined. Thus, distances to all objects in a scene (within a particular range) at any given instant can be stored. A preview of the image can be displayed so as to allow a user to select a region of the scene of interest. In response to the user's selection, the imager's optical assembly can be adjusted automatically, for example, to a position that corresponds to optimal image capture of objects at the particular distance of the selected region of the scene.

Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.

Abstract: An optoelectronic device has an asymmetric field overlap and is operable to measure proximity independently of object surface reflectivity. In some instances, the optoelectronic device includes a plurality of light-emitting assemblies and a light-sensitive assembly. In some instances, the optoelectronic devices include a plurality of light-sensitive assemblies and a light-emitting assembly. An asymmetric field overlap is attained in various implementations via various field-of-view axis, field-of-view angle, field-of-illumination axis, field-of-illumination angle, optical element and/or pitch configurations.

Abstract: This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.

Abstract: The present disclosure describes refresh control methods for generating distance data and optoelectronic modules that are operable to provide distance information at a predetermined refresh rate, but with a reduction in overall power consumption attributable to the distance determinations.