Patents Assigned to Asahi Diamond Industrial Co., Ltd.
  • Patent number: 9770802
    Abstract: A rotary dresser includes a cored bar, an electroformed layer, and superabrasive grains fixed to an outer circumferential surface of the electroformed layer, and a plurality of island regions in which a plurality of superabrasive grains is gathered is provided at certain intervals. Since a plurality of the island regions in which a plurality of the superabrasive grains is gathered is provided at certain intervals, the same degree of dressing accuracy can be obtained as in a case in which expensive large superabrasive grains are fixed at a low density using cheap and small superabrasive grains, it is possible to decrease the contact area of a single superabrasive grain, and favorable cutting quality can be obtained.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: September 26, 2017
    Assignee: ASAHI DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Kunihito Inamori, Manabu Sato
  • Patent number: 7704127
    Abstract: A plating layer 18 of Ni or the like is formed around the outer peripheral face 14 of a wire tool 10, and super abrasive grains 16 are electrodeposited so as to be embedded in the plating layer 18. A coating layer 20 is formed on the surface of the super abrasive grains 16 to increase efficiency during electrodeposition. The thickness of the coating layer 20 formed on the super abrasive grains 16 is less than 0.1 ?m, and preferably not more than 0.05 ?m. The coating layer 20 is thin enough that its mass is less than 10% of the mass of the super abrasive grain 16. Accordingly, the super abrasive grains 16 are electrodeposited in a single layer around the outer peripheral face 14 of the core wire 12. As a result, the super abrasive grains 16 do not readily come off the core wire 12, which means that the wire tool will have a longer life. Also, since there is no need to remove any excess super abrasive grains after their electrodeposition, manufacturing costs can be cut and less work is entailed.
    Type: Grant
    Filed: September 5, 2005
    Date of Patent: April 27, 2010
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventors: Kazuaki Taniguchi, Masahiro Nakano, Yoshitaka Manita
  • Publication number: 20090120422
    Abstract: A plating layer 18 of Ni or the like is formed around the outer peripheral face 14 of a wire tool 10, and super abrasive grains 16 are electrodeposited so as to be embedded in the plating layer 18. A coating layer 20 is formed on the surface of the super abrasive grains 16 to increase efficiency during electrodeposition. The thickness of the coating layer 20 formed on the super abrasive grains 16 is less than 0.1 ?m, and preferably not more than 0.05 ?m. The coating layer 20 is thin enough that its mass is less than 10% of the mass of the super abrasive grain 16. Accordingly, the super abrasive grains 16 are electrodeposited in a single layer around the outer peripheral face 14 of the core wire 12. As a result, the super abrasive grains 16 do not readily come off the core wire 12, which means that the wire tool will have a longer life. Also, since there is no need to remove any excess super abrasive grains after their electrodeposition, manufacturing costs can be cut and less work is entailed.
    Type: Application
    Filed: September 5, 2005
    Publication date: May 14, 2009
    Applicant: ASAHI DIAMOND INDUSTRIAL CO., LTD.
    Inventor: Kazuaki Taniguchi
  • Patent number: 6769975
    Abstract: A super abrasive tool comprises scattered super abrasive grains fixed on a working surface with a bond layer. The bond layer has a flat surface and protrusions. Each protrusion has one grain and the average height from the flat surface to the top of the grain is in a specific range. A process for producing a super abrasive tool comprises forming in a spacer holes having a cylindrical portion having a diameter smaller than the average diameter of grains at the lower face and a portion having a diameter increasing to a specific value at the upper face; placing one grain in each hole; fixing the grains by forming a bond layer on the upper face of the spacer; and removing the spacer. The super abrasive tool maintains sufficient protrusion of super abrasive grains, causes no releasing of the grains nor loading and has excellent cutting ability.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: August 3, 2004
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventor: Masayuki Sagawa
  • Publication number: 20020197947
    Abstract: A super abrasive tool comprises scattered super abrasive grains fixed on a working surface with a bond layer. The bond layer has a flat surface and protrusions. Each protrusion has one grain and the average height from the flat surface to the top of the grain is in a specific range. A process for producing a super abrasive tool comprises forming in a spacer holes having a cylindrical portion having a diameter smaller than the average diameter of grains at the lower face and a portion having a diameter increasing to a specific value at the upper face; placing one grain in each hole; fixing the grains by forming a bond layer on the upper face of the spacer; and removing the spacer.
    Type: Application
    Filed: February 28, 2002
    Publication date: December 26, 2002
    Applicant: ASAHI DIAMOND INDUSTRIAL CO., LTD.
    Inventor: Masayuki Sagawa
  • Patent number: 5989405
    Abstract: A dresser includes a super-abrasive fixed by electroplating on a working face which is disposed perpendicular to the axis of rotation of the dresser, the height of protrusion of particles of the super-abrasive is 5 to 30% of an average diameter of the particles, and a process for producing such a dresser includes temporarily fixing the super-abrasive in an amount to form a single layer to a base metal by electroplating, removing loose stones in the temporarily fixed super-abrasive by a grinder or shaking, electroplating a surface having the temporarily fixed super-abrasive with a metal until thickness of the plating metal reaches height of the most protruded part of the super-abrasive or until particles of the super-abrasive are completely buried in the plating metal, and working the electroplated surface for abrasive protrusion to expose most protruded parts of the super-abrasive resulting in a high accuracy dresser which enables dressing of a polishing pad in a short time and eliminates the releasing of par
    Type: Grant
    Filed: June 25, 1997
    Date of Patent: November 23, 1999
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventors: Yasunori Murata, Kenji Kakui
  • Patent number: 5642159
    Abstract: We disclose: (1) a method for tensioning an ID saw blade, which comprises observing position of the cutting edge of the ID saw blade by using a CCD camera, exhibiting the observed position of the cutting edge of the ID saw blade on a display, adjusting tensioning screws while the position of the cutting edge of the ID saw blade exhibited on the display is watched, and disposing the cutting edge of the ID saw blade at a position within a preset allowable range which is exhibited on the display; and (2) an apparatus for monitoring tensioning of an ID saw blade which comprises a CCD camera for observing the position of the cutting edge of the ID saw blade, a display for exhibiting the observed position of the cutting edge of the ID saw blade, and a mechanism for exhibiting on the display an allowable range for the position of the cutting edge of the ID saw blade which is set in advance.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: June 24, 1997
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventor: Kenji Oba
  • Patent number: 5449123
    Abstract: A method and apparatus for pulverizing into fine powder in one step scrapped difficult to crush plastics of fiber reinforced thermosetting plastics by using a rotating diamond wheel having diamond grits of rough grain size of more than 270 mesh on the outer surface, a pushing unit to press plastic materials against the diamond wheel above and a powder collector.
    Type: Grant
    Filed: October 7, 1993
    Date of Patent: September 12, 1995
    Assignees: Asaoka Co., Ltd., Asahi Diamond Industrial Co., Ltd.
    Inventors: Tomitaka Mase, Toshihiko Asada
  • Patent number: 5035087
    Abstract: A surface grinding machine comprises a wheel head vertically movably supported; a cup-shaped diamond wheel supported by a rotatable wheel shaft at one end of the wheel head and having an abrasive grain layer of Young's modulus (10-15).times.10.sup.4 kgf/cm.sup.
    Type: Grant
    Filed: December 7, 1987
    Date of Patent: July 30, 1991
    Assignees: Sumitomo Electric Industries, Ltd., Asahi Diamond Industrial Co. Ltd., Nissei Industry Corporation
    Inventors: Masanori Nishiguchi, Takeshi Sekiguchi, Ikkei Miyoshi, Kiyoshi Nishio
  • Patent number: 4977710
    Abstract: The metal bonded diamond wheel of the invention has a sintered body of a mixture of a diamond powder and a bonding metal powder. The particles of the bonding metal powder or, preferably, particles of both of the diamond powder and the bonding metal powder are provided, prior to powder metallurgical sintering, with a coating layer of iron, cobalt or nickel, in a thickness of 0.5 to 15 .mu.m. When sintered under adequate conditions, the sintered body has pores in a porosity of 10 to 25% and exhibits greatly improved grinding performance relative to the durability in grinding works and sharpness of grinding with a decreased resistance of grinding.
    Type: Grant
    Filed: February 1, 1989
    Date of Patent: December 18, 1990
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventor: Kouji Une
  • Patent number: 4932582
    Abstract: A bonding tool to be employed for preparing semiconductor parts, e.g., IC, comprizing a tool-head made of a super hard material, e.g., a single crystal of diamond, etc., which comes into contact with a workpiece in the use of the bonding tool and a shank to which the tool-head is bonded by brazing with a brazing material is prepared by using a silver solder based brazing composition obtained by adding a fine powder for shrinkage-stress-relieving material, e.g., fine diamond powder, etc., to a conventional silver solder based brazing material to which titanium has been added as the brazing material. The method is advantageous in that bonding tools having improved properties; i.e., high brazing strength, high stability in practical use, low brazing strain, low thermal stress etc., can be prepared in a good yield with preventing a crack in the super hard material used as a tool-head of the bonding tools.
    Type: Grant
    Filed: May 9, 1989
    Date of Patent: June 12, 1990
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventor: Kouji Une
  • Patent number: 4884476
    Abstract: A diamond-clad machining tool is prepared by the steps of (a) forming a film of diamond of 10 to 1000 .mu.m thickness by the method of vapor-phase deposition on the surface of a temporary substrate of, e.g., silicon, (b) bonding the diamond film as borne by the temporary substrate to the surface of a base body of the tool by brazing and (c) removing the temporary substrate, e.g., by grinding to leave the diamond film bonded to the base body of the tool by brazing. The method is advantageous in the versatility in respect of the material of substrate on which a diamond film is deposited from the vapor phase as well as in the firmness of bonding between the cladding layer and the base body of the tool in comparison with the conventional vapor-phase deposition method of diamond directly to the surface of the base body of a tool.
    Type: Grant
    Filed: June 13, 1988
    Date of Patent: December 5, 1989
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventors: Fuminori Okuzumi, Junichi Matsuda
  • Patent number: 4800686
    Abstract: This invention relates to a method for boring a chamfered hole and a tool for the same hole to effect boring a through hole on a glass plate and to simultaneously effect chamfering on respective aperture on the both sides of the plate, and have the function to enable speedy and accurate boring work without bringing forth defective product with chipping-off, joggles on the glass plate.
    Type: Grant
    Filed: April 9, 1987
    Date of Patent: January 31, 1989
    Assignees: Kyokuwei Optical Glass Co., Ltd., Asahi Diamond Industrial Co., Ltd.
    Inventors: Toshihiko Hirabayashi, Keiji Honda
  • Patent number: 4726150
    Abstract: A face grinder capable of grinding the end surface of a workpiece without leaving any unground protruding portion at the center thereof by imparting rotation on its own axis and around a chuck holder or eccentric rotation to either a chuck for holding the workpiece or a cup-shaped grinding wheel by a planetary gear mechanism.
    Type: Grant
    Filed: October 11, 1985
    Date of Patent: February 23, 1988
    Assignees: Asahi Diamond Industrial Co., Ltd., Nissei Industrial Co., Ltd.
    Inventors: Kiyoshi Nishio, Arihisa Tanaka
  • Patent number: 4484560
    Abstract: A diamond segmented saw blade having a steel center is provided with a plurality of sockets about the rim and a plurality of cutting tip supports having diamond impregnated tips. Each socket is provided with an upper surface inclined upwardly and inwardly and a tapered or wedge-shaped dovetail groove. Each support is provided with a depending tenon. The surfaces adjacent the tenon are inclined upwardly and inwardly complementary to the surfaces adjacent the socket. The tenon is similarly wedge-shaped to fit in the dovetail groove so that the support and socket are firmly interlocked to insure easy and free exchange of diamond impregnated tips.
    Type: Grant
    Filed: June 24, 1983
    Date of Patent: November 27, 1984
    Assignee: Asahi Diamond Industrial Co., Ltd.
    Inventor: Takesaburo Tanigawa