Abstract: A print head is made from an electronic circuit having a pattern of electric conductors embedded in a dielectric substrate. The conductors are formed by depositing a cermet material in grooves in the substrate, and heating the substrate in a kiln so as to make the cermet electrically conductive, and to form a very tight bond between the conductors and the substrate. The resulting circuit is stable, rugged, and capable of withstanding a wide range of adverse environmental conditions. The print head can be used in a thermal or electrostatic printer, or other type of printer using a print head powered by electric circuitry. The rugged, high-density circuit of the present invention can generate a set of very closely-spaced conductors which are then used to produce a high-density image. The invention also includes a multi-layered version of the print head, and permits the production of black and white or color halftone images having very large numbers of grey scale levels, and exceptional resolution.

Abstract: The present invention is a high-density circuit, wherein the circuit conductors, and the spaces between conductors, are preferably less than about 0.005 inches wide, and wherein the lines are disposed over a relatively large area. The circuit is defined by a pattern of grooves in a dielectric substrate, and a conductive material is deposited in the grooves, and heated so as to form a tight bond with the substrate. The resulting circuit is stable, rugged, and capable of withstanding a wide range of adverse environmental conditions. The invention includes the circuit itself, as well as processes used in its manufacture. The invention also includes a high-density print head, for a thermal or electrostatic printer, made from the circuit described. The rugged, high-density circuit of the present invention can generate a set of very closely-spaced conductors which are then used to produce a high-density image.

Abstract: The invention is a print head for a thermal or electrostatic printer, the print head being made from a high-density circuit. The high-density circuit includes conductors having a spacing less than about 0.005 inches, the conductors being disposed over a relatively large area. The circuit is defined by a pattern of grooves in a dielectric substrate, and a conductive material is deposited in the grooves, and heated so as to form a tight bond with the substrate. The resulting circuit is stable, rugged, and capable of producing an image of high resolution. The invention also includes a print head made from a multi-layered version of the circuit. The invention permits the production of black and white or color halftone images having very large numbers of grey scale levels, and exceptional resolution.

Abstract: The present invention is a high-density circuit, wherein the circuit conductors, and the spaces between conductors, are preferably less than about 0.005 inches wide, and wherein the lines are disposed over a relatively large area. The circuit is defined by a pattern of grooves in a dielectric substrate, and a conductive material is deposited in the grooves, and heated so as to form a tight bond with the substrate. The resulting circuit is stable, rugged, and capable of withstanding a wide range of adverse environmental conditions. The invention includes the circuit itself, as well as processes used in its manufacture. The invention also includes high-density print head, for a thermal or electrostatic printer, made from the circuit described. The rugged, high-density circuit of the present invention can generate a set of very closely-spaced conductors which are then used to produce a high-density image.

Abstract: The present invention is a high-density circuit, wherein the circuit conductors, and the spaces between conductors, are preferably less than about 0.005 inches wide, and wherein the lines are disposed over a relatively large area. The circuit is defined by a pattern of grooves in a dielectric substrate, and a conductive material is deposited in the grooves, and heated so as to form a tight bond with the substrate. The resulting circuit is stable, rugged, and capable of withstanding a wide range of adverse environmental conditions. The invention includes the circuit itself, as well as processes used in its manufacture. The invention also includes a high-density print head, for a thermal or electrostatic printer, made from the circuit described. The rugged, high-density circuit of the present invention can generate a set of very closely-spaced conductors which are then used to produce a high-density image.