Abstract: A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electroconductive polymer layer and a subsequent metallization, wherein the electroconductive polymer layer is preferably doped with a zinc-containing, colloidal palladium solution prior to the metallization step, the electroconductive polymer is poly-3,4-ethylenedioxythiophene and a contacting with a copper(II) salt solution is performed prior to the metallization.

Abstract: The process for producing through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers using a combined desmearing and direct metalization process (multilayering) is performed by subjecting the polymer base materials, provided with bore holes, to the following process steps:1) swelling in a per se known treatment liquid and rinsing with water;2) treatment with alkaline permanganate solution (desmearing);3) rinsing with water;4) rinsing with acidic aqueous solution (pH value about 1, rinsing time 10 to 120 s, depending on acid content);5) rinsing with water;6) rinsing with alkaline aqueous solution (pH 8 to 9.5);7) rinsing with water;8) rinsing with microemulsion of ethylene-3,4-dioxythiophene (catalyst);9) rinsing with acid (fixation);10) rinsing with water;11) coppering;12) rinsing with water; and13) drying;14) usual process steps for creating the printed circuit pattern.

Abstract: The slightly water-soluble metal salts having the formula I ##STR1## wherein R.sub.1 and R.sub.2 are the same or different and represent hydrogen or a lower alkyl group of from 1 to 3 carbon atoms, M is the cation of a metal which forms slightly water-soluble sulfides, and n means 1 or 2, and mixtures thereof are prepared by reacting carbon disulfide with ketones having the formula II: ##STR2## optionally with the addition of non-aqueous inert solvents, in the presence of strong alkali, preferably potassium hydroxide, followed by precipitation of the slightly water-soluble metal salts of formula I by the addition of aqueous solutions of metal salts of the metals M. They are used as gloss additives to electrolytic baths.

Abstract: A process for acidic electrolytical deposition of lead layers and predominantly lead-containing layers onto surfaces using an electrolyte containing lead salts and acids, in particular alkanesulfonic acid, borofluoric acid or silicofluoric acid, with non-ionic surfactants and cationic or amphoteric surfactants being added to the electrolyte. The process can be operated at current densities of from 0.5 to 20 A/dm.sup.2 and at a pH value below 1.

Abstract: A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one photoresist layer temporarily exposing the electroconductive circuit pattern by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, characterized in thata) the surfaces of the substrate, after hole-drilling and a subsequent mechanical surface-treatment, are laminated with a suitable photoresist, exposed to light and developed so that the circuit pattern image is exposed,b) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,c) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one heterocyclic monomer, and more specifically pyrrole, thiophene, furane or derivative(s) thereof, which in a polymeric for

Abstract: The process for manufacturing through-hole contacting plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material is improved by pre-treatment prior to electrodepositing the metal, preferably with a solution containing one or more nitrogen-containing organic compounds.

Abstract: Described are aqueous acidic solutions for the electrodeposition of tin and lead/tin alloys for improving electro- deposition in the high current density range and for providing a uniform luster distribution of metals deposited in the low current density range. The solutions contain a mixture of metal salts, free alkanesulfonic acid, a non-ionic wetting agent and optionally aromatic short-chain aldehydes and/or optionally aromatic ketones and/or optionally short-chain unsaturated carboxylic acids. In the solutions, tin and/or lead salts of the alkanesulfonic acid are employed as the metal salt(s), the alkyl moiety of the alkanesulfonic acid consisting of from 1 to 5 carbon atoms, the free alkanesulfonic acid having alkyl moieties with from 1 to 5 carbon atoms. They contain, as a further brightener, a mixture comprising a reaction product of acetaldehyde and/or its aidol condensation product with ammonia and/or acyclic ketones and/or aliphatic amines, amides, amino acids and or hydrazine compounds.

Abstract: Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areasa) are galvanically coated with a coating of a black metal in an acidic medium;b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;c) the conductor plates are provided with an adhering solder mask;d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.

Abstract: Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas(a) are galvanically coated with a coating of a black metal in an acidic medium;(b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;(c) the conductor plates are provided with an adhering solder mask;(d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.